Joon Hwan Kwag

Person

Suwon, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Capacitor component having secondary phase material contained in ex...
- Patent number 11,152,155
- Issue date Oct 19, 2021
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Jang Yeol Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor component having secondary phase material contained in ex...
- Patent number 10,804,034
- Issue date Oct 13, 2020
- Samsung Electro-Mechanics Co., Ltd.
- Jang Yeol Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite electronic component and a board for mounting the same
- Patent number 9,654,079
- Issue date May 16, 2017
- Samsung Electro-Mechanics Co., Ltd.
- Soo Hwan Son
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Multilayer ceramic electronic part and board having the same mounte...
- Patent number 9,258,893
- Issue date Feb 9, 2016
- Samsung Electro-Mechanics Co., Ltd.
- Joon Hwan Kwag
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip device and method for manufacturing the same
- Patent number 9,153,381
- Issue date Oct 6, 2015
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Jung Tae Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer ceramic electronic component and method of manufacturing...
- Patent number 8,982,534
- Issue date Mar 17, 2015
- Samsung Electro-Mechanics Co., Ltd.
- Joon Hwan Kwag
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MULTILAYER ELECTRONIC COMPONENT
- Publication number 20250125096
- Publication date Apr 17, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Seung Min AHN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER ELECTRONIC COMPONENT
- Publication number 20250118496
- Publication date Apr 10, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Dong Hyeon LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR COMPONENT
- Publication number 20200303123
- Publication date Sep 24, 2020
- Samsung Electro-Mechanics Co., Ltd.
- Jang Yeol LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR COMPONENT HAVING SECONDARY PHASE MATERIAL CONTAINED IN EX...
- Publication number 20200135403
- Publication date Apr 30, 2020
- Samsung Electro-Mechanics Co., Ltd.
- Jang Yeol LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CERAMIC ELECTRONIC COMPONENT AND BOARD HAVING THE SAME
- Publication number 20150318112
- Publication date Nov 5, 2015
- Samsung Electro-Mechanics Co., Ltd.
- Joon Hwan KWAG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CERAMIC ELECTRONIC COMPONENT AND BOARD HAVING THE SAME M...
- Publication number 20150243439
- Publication date Aug 27, 2015
- Samsung Electro-Mechanics Co., Ltd.
- Joon Hwan KWAG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CERAMIC ELECTRONIC PART AND BOARD HAVING THE SAME MOUNTE...
- Publication number 20150162132
- Publication date Jun 11, 2015
- Samsung Electro-Mechanics Co., Ltd.
- Joon Hwan KWAG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITE ELECTRONIC COMPONENT AND A BOARD FOR MOUNTING THE SAME
- Publication number 20150109074
- Publication date Apr 23, 2015
- Samsung Electro-Mechanics Co., Ltd.
- Soo Hwan SON
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
ARRAY TYPE MULTILAYER CERAMIC ELECTRONIC COMPONENT, MOUNTING STRUCT...
- Publication number 20140138137
- Publication date May 22, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Joon Hwan KWAG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYERED CERAMIC ELECTRONIC COMPONENT AND METHOD OF MANUFACTURI...
- Publication number 20140098454
- Publication date Apr 10, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Joon Hwan KWAG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20140085770
- Publication date Mar 27, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Jung Tae Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CERAMIC ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING...
- Publication number 20140029157
- Publication date Jan 30, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Joon Hwan KWAG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYERED CERAMIC ELECTRONIC COMPONENT AND MANUFACTURING METHOD...
- Publication number 20140022691
- Publication date Jan 23, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Joon Hwan KWAG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYERED CERAMIC ELECTRONIC COMPONENT AND METHOD OF MANUFACTUR...
- Publication number 20140022689
- Publication date Jan 23, 2014
- Joon Hwan Kwag
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CERAMIC CAPACITOR AND MANUFACTURING METHOD THEREOF
- Publication number 20110149470
- Publication date Jun 23, 2011
- Samsung Electro-Mechanics CO., LTD.
- Kang Heon Hur
- H01 - BASIC ELECTRIC ELEMENTS

Joon Hwan Kwag

Person

Patents Grantslast 30 patents

Capacitor component having secondary phase material contained in ex...

Capacitor component having secondary phase material contained in ex...

Composite electronic component and a board for mounting the same

Multilayer ceramic electronic part and board having the same mounte...

Chip device and method for manufacturing the same

Multilayer ceramic electronic component and method of manufacturing...

Patents Applicationslast 30 patents

MULTILAYER ELECTRONIC COMPONENT

MULTILAYER ELECTRONIC COMPONENT

CAPACITOR COMPONENT

CAPACITOR COMPONENT HAVING SECONDARY PHASE MATERIAL CONTAINED IN EX...

MULTILAYER CERAMIC ELECTRONIC COMPONENT AND BOARD HAVING THE SAME

MULTILAYER CERAMIC ELECTRONIC COMPONENT AND BOARD HAVING THE SAME M...

MULTILAYER CERAMIC ELECTRONIC PART AND BOARD HAVING THE SAME MOUNTE...

COMPOSITE ELECTRONIC COMPONENT AND A BOARD FOR MOUNTING THE SAME

ARRAY TYPE MULTILAYER CERAMIC ELECTRONIC COMPONENT, MOUNTING STRUCT...

MULTILAYERED CERAMIC ELECTRONIC COMPONENT AND METHOD OF MANUFACTURI...

CHIP DEVICE AND METHOD FOR MANUFACTURING THE SAME

MULTILAYER CERAMIC ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING...

MULTILAYERED CERAMIC ELECTRONIC COMPONENT AND MANUFACTURING METHOD...

MULTI-LAYERED CERAMIC ELECTRONIC COMPONENT AND METHOD OF MANUFACTUR...

MULTILAYER CERAMIC CAPACITOR AND MANUFACTURING METHOD THEREOF