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Patents Grants
last 30 patents
Information
Patent Grant
Power module package
Patent number
11,004,698
Issue date
May 11, 2021
Semiconductor Components Industries, LLC
Keunhyuk Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package
Patent number
9,666,512
Issue date
May 30, 2017
Fairchild Korea Semiconductor, Ltd.
Seung-won Im
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Power module having stacked flip-chip and method for fabricating th...
Patent number
9,130,065
Issue date
Sep 8, 2015
Fairchild Korea Semiconductor, Ltd.
Seungwon Im
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Power device package comprising metal tab die attach paddle (DAP) a...
Patent number
8,945,992
Issue date
Feb 3, 2015
Fairchild Korea Semiconductor, Ltd.
Joon-seo Son
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and method of fabricating the same
Patent number
8,860,196
Issue date
Oct 14, 2014
Fairchild Korea Semiconductor Ltd.
Joo-yang Eom
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Power module having stacked flip-chip and method of fabricating the...
Patent number
8,766,419
Issue date
Jul 1, 2014
Fairchild Korea Semiconductor, Ltd.
Seung-won Lim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and methods of fabricating the same
Patent number
8,723,304
Issue date
May 13, 2014
Fairchild Korea Semiconductor, Ltd.
In-goo Kang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Power device packages having thermal electric modules using peltier...
Patent number
8,552,541
Issue date
Oct 8, 2013
Fairchild Korea Semiconductor, Ltd.
Seung-won Lim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Power device package comprising metal tab die attach paddle (DAP) a...
Patent number
8,067,826
Issue date
Nov 29, 2011
Fairchild Korea Semiconductor Ltd
Joon-Seo Son
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Power device packages and methods of fabricating the same
Patent number
7,863,725
Issue date
Jan 4, 2011
Fairchild Korea Semiconductor Ltd.
Man-kyo Jong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Power quad flat no-lead semiconductor die packages with isolated he...
Patent number
7,816,784
Issue date
Oct 19, 2010
Fairchild Semiconductor Corporation
Joon-Seo Son
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor packages and methods of fabricating the same
Patent number
7,714,455
Issue date
May 11, 2010
Fairchild Korea Semiconductor Ltd.
Joon-seo Son
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Power module and method of fabricating the same
Patent number
7,687,903
Issue date
Mar 30, 2010
Fairchild Korea Semiconductor Ltd.
Joon-seo Son
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Power module having stacked flip-chip and method of fabricating the...
Patent number
7,675,148
Issue date
Mar 9, 2010
Fairchild Korea Semiconductor Ltd.
Seung-won Lim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package suitable for high voltage applications
Patent number
7,199,461
Issue date
Apr 3, 2007
Fairchild Korea Semiconductor, Ltd.
Joon-seo Son
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
MOLDED SEMICONDUCTOR PACKAGE HAVING A SUBSTRATE WITH BEVELLED EDGE
Publication number
20220285239
Publication date
Sep 8, 2022
Man Kyo Jong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Package
Publication number
20150332992
Publication date
Nov 19, 2015
FAIRCHILD KOREA SEMICONDUCTOR LTD.
Seung-won IM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
POWER MODULE PACKAGE AND METHOD OF MANUFACTURING THE SAME
Publication number
20150103498
Publication date
Apr 16, 2015
FAIRCHILD KOREA SEMICONDUCTOR LTD.
Keunhyuk Lee
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Power Module Having Stacked Flip-Chip and Method for Fabricating th...
Publication number
20140273349
Publication date
Sep 18, 2014
Fairchild Korea Semiconductor, Ltd.
Seung-won Lim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MOBILE COMMUNICATION TERMINAL
Publication number
20140080541
Publication date
Mar 20, 2014
Joon SON
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
Publication number
20130307145
Publication date
Nov 21, 2013
FAIRCHILD KOREA SEMICONDUCTOR LTD.
Yoon-jae CHUNG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
Publication number
20120168919
Publication date
Jul 5, 2012
Joo-Yang EOM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
POWER DEVICE PACKAGE COMPRISING METAL TAB DIE ATTACH PADDLE (DAP) A...
Publication number
20120034741
Publication date
Feb 9, 2012
Fairchild Korea Semiconductor Co., Ltd.
Joon-seo Son
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
POWER DEVICE PACKAGES HAVING THERMAL ELECTRIC MODULES USING PELTIER...
Publication number
20110204500
Publication date
Aug 25, 2011
Seung-won Lim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
POWER DEVICE PACKAGES AND METHODS OF FABRICATING THE SAME
Publication number
20110076804
Publication date
Mar 31, 2011
Man-kyo Jong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Power Module Having Stacked Flip-Chip and Method of Fabricating the...
Publication number
20100155914
Publication date
Jun 24, 2010
Seung-won Lim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
POWER QUAD FLAT NO-LEAD SEMICONDUCTOR DIE PACKAGES WITH ISOLATED HE...
Publication number
20100148328
Publication date
Jun 17, 2010
Fairchild Semiconductor Corporation
Joon-Seo Son
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor device package
Publication number
20090243079
Publication date
Oct 1, 2009
Seung-won Lim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Power Device Substrates and Power Device Packages Including the Same
Publication number
20090244848
Publication date
Oct 1, 2009
Seung-won Lim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Power Device Packages Having Thermal Electric Modules Using Peltier...
Publication number
20090243078
Publication date
Oct 1, 2009
Seung-won Lim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHODS OF FABRICATING THE SAME
Publication number
20090194859
Publication date
Aug 6, 2009
Fairchild Korea Semiconductor, Ltd.
In-goo Kang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Power Device Packages and Methods of Fabricating the Same
Publication number
20090127685
Publication date
May 21, 2009
Man-kyo Jong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
Publication number
20090127681
Publication date
May 21, 2009
Fairchild Korea Semiconductor Ltd.
Joon-seo Son
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Power module and method of fabricating the same
Publication number
20090129028
Publication date
May 21, 2009
Joon-seo Son
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Packages and Methods of Fabricating the Same
Publication number
20090115038
Publication date
May 7, 2009
Joon-seo Son
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Power module having stacked flip-chip and method of fabricating the...
Publication number
20080224285
Publication date
Sep 18, 2008
Seung-won Lim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
POWER DEVICE PACKAGE COMPRISING METAL TAB DIE ATTACH PADDLE (DAP) A...
Publication number
20080164589
Publication date
Jul 10, 2008
Fairchild Korea Semiconductor, Ltd.
Joon-seo Son
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE SUITABLE FOR HIGH VOLTAGE APPLICATIONS
Publication number
20070181984
Publication date
Aug 9, 2007
Fairchild Korea Semiconductor, Ltd.
Joon-seo Son
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor package suitable for high voltage applications
Publication number
20040232541
Publication date
Nov 25, 2004
Joon-seo Son
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Discrete package having insulated ceramic heat sink
Publication number
20040061206
Publication date
Apr 1, 2004
Joon-Seo Son
H01 - BASIC ELECTRIC ELEMENTS