Joonho JUN

Person

Cheonan-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Methods of inspection of semiconductor packages including measureme...
- Patent number 11,935,873
- Issue date Mar 19, 2024
- Samsung Electronics Co., Ltd.
- Joonho Jun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,688,707
- Issue date Jun 27, 2023
- Samsung Electronics Co., Ltd.
- Joonho Jun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 11,621,250
- Issue date Apr 4, 2023
- Samsung Electronics Co., Ltd.
- Joonho Jun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages including stacked substrates and penetration...
- Patent number 11,222,873
- Issue date Jan 11, 2022
- Samsung Electronics Co., Ltd.
- Joonho Jun
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MEMORY DEVICE AND A MEMORY SYSTEM INCLUDING THE MEMORY DEVICE
- Publication number 20250120099
- Publication date Apr 10, 2025
- Samsung Electronics Co., Ltd.
- MINWOO LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20250062303
- Publication date Feb 20, 2025
- Samsung Electronics Co., Ltd.
- Joonho Jun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE INCLUDING CONTENT ADDRESSABLE MEMORY AND METHOD OF IN...
- Publication number 20250013366
- Publication date Jan 9, 2025
- Samsung Electronics Co., Ltd.
- BYOUNGKON JO
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
OPTICAL MEMORY MODULE AND OPTICAL COMPUTING SYSTEM INCLUDING THE SAME
- Publication number 20240427715
- Publication date Dec 26, 2024
- Samsung Electronics Co., Ltd.
- JOONHO JUN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240387495
- Publication date Nov 21, 2024
- Samsung Electronics Co., Ltd.
- Minwoo LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS USING BOTH SURFACES OF A WAFER AND MANUFACT...
- Publication number 20240371831
- Publication date Nov 7, 2024
- Samsung Electronics Co., Ltd.
- Joonho Jun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240347524
- Publication date Oct 17, 2024
- Samsung Electronics Co., Ltd.
- Joonho Jun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT TYPE SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE...
- Publication number 20230420336
- Publication date Dec 28, 2023
- Samsung Electronics Co., Ltd.
- Joonho JUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20230207532
- Publication date Jun 29, 2023
- Samsung Electronics Co., Ltd.
- Joonho JUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20220130802
- Publication date Apr 28, 2022
- Samsung Electronics Co., Ltd.
- Joonho JUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20220020713
- Publication date Jan 20, 2022
- Samsung Electronics Co., Ltd.
- Joonho Jun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20210183816
- Publication date Jun 17, 2021
- Samsung Electronics Co., Ltd.
- Joonho JUN
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Methods of inspection of semiconductor packages including measureme...

Semiconductor package

Semiconductor packages

Semiconductor packages including stacked substrates and penetration...

Patents Applicationslast 30 patents

MEMORY DEVICE AND A MEMORY SYSTEM INCLUDING THE MEMORY DEVICE

SEMICONDUCTOR PACKAGES

MEMORY DEVICE INCLUDING CONTENT ADDRESSABLE MEMORY AND METHOD OF IN...

OPTICAL MEMORY MODULE AND OPTICAL COMPUTING SYSTEM INCLUDING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR APPARATUS USING BOTH SURFACES OF A WAFER AND MANUFACT...

SEMICONDUCTOR PACKAGE

FAN-OUT TYPE SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE...

SEMICONDUCTOR PACKAGES

SEMICONDUCTOR PACKAGES

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGES