JoonSeo Son

Person

Mapo Gu, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package and related methods
- Patent number 12,230,606
- Issue date Feb 18, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Seungwon Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit direct cooling systems having substrates in cont...
- Patent number 11,967,540
- Issue date Apr 23, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Seungwon Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module package and method of manufacturing the same
- Patent number 11,615,967
- Issue date Mar 28, 2023
- Semiconductor Components Industries, LLC
- Keunhyuk Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having a spacer with a junction cooling pipe
- Patent number 11,201,105
- Issue date Dec 14, 2021
- Semiconductor Components Industries, LLC
- Seungwon Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die package including a one-body clip
- Patent number 11,101,198
- Issue date Aug 24, 2021
- Semiconductor Components Industries, LLC
- Seungwon Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and related methods
- Patent number 11,037,907
- Issue date Jun 15, 2021
- Semiconductor Components Industries, LLC
- Seungwon Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having junction cooling pipes embedded in sub...
- Patent number 10,607,919
- Issue date Mar 31, 2020
- Semiconductor Components Industries, LLC
- Seungwon Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die package and manufacturing method
- Patent number 10,586,754
- Issue date Mar 10, 2020
- Semiconductor Components Industries, LLC (BHB)
- Seungwon Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and related methods
- Patent number 10,403,601
- Issue date Sep 3, 2019
- FAIRCHILD SEMICONDUCTOR CORPORATION
- Seungwon Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stray inductance reduction in packaged semiconductor devices and mo...
- Patent number 10,090,279
- Issue date Oct 2, 2018
- Semiconductor Components Industries, LLC
- Seungwon Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wireless semiconductor package for efficient heat dissipation
- Patent number 7,586,179
- Issue date Sep 8, 2009
- Fairchild Semiconductor Corporation
- Paul Armand Calo
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT DIRECT COOLING SYSTEMS AND RELATED METHODS
- Publication number 20240234246
- Publication date Jul 11, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Seungwon IM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DIRECT COOLING SYSTEMS AND RELATED METHODS
- Publication number 20220093487
- Publication date Mar 24, 2022
- Semiconductor Components Industries, LLC
- Seungwon IM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE PACKAGE AND METHOD OF MANUFACTURING THE SAME RELATED A...
- Publication number 20210265175
- Publication date Aug 26, 2021
- Semiconductor Components Industries, LLC
- Keunhyuk LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND RELATED METHODS
- Publication number 20210265318
- Publication date Aug 26, 2021
- Semiconductor Components Industries, LLC
- Seungwon IM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE PACKAGE INCLUDING A ONE-BODY CLIP
- Publication number 20200194346
- Publication date Jun 18, 2020
- Semiconductor Components Industries, LLC
- Seungwon IM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DIRECT COOLING SYSTEMS AND RELATED METHODS
- Publication number 20200185305
- Publication date Jun 11, 2020
- Semiconductor Components Industries, LLC
- Seungwon IM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND RELATED METHODS
- Publication number 20190348399
- Publication date Nov 14, 2019
- Semiconductor Components Industries, LLC
- Seungwon IM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DIRECT COOLING SYSTEMS AND RELATED METHODS
- Publication number 20180315681
- Publication date Nov 1, 2018
- Semiconductor Components Industries, LLC
- Seungwon IM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRAY INDUCTANCE REDUCTION IN PACKAGED SEMICONDUCTOR DEVICES AND MO...
- Publication number 20180254262
- Publication date Sep 6, 2018
- Semiconductor Components Industries, LLC
- Seungwon IM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE PACKAGE AND MANUFACTURING METHOD
- Publication number 20180122725
- Publication date May 3, 2018
- FAIRCHILD KOREA SEMICONDUCTOR LTD.
- Seungwon IM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND RELATED METHODS
- Publication number 20170365583
- Publication date Dec 21, 2017
- FAIRCHILD SEMICONDUCTOR CORPORATION
- Seungwon IM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRELESS SEMICONDUCTOR PACKAGE FOR EFFICIENT HEAT DISSIPATION
- Publication number 20090091010
- Publication date Apr 9, 2009
- Paul Armand Calo
- H01 - BASIC ELECTRIC ELEMENTS

JoonSeo Son

Person

Patents Grantslast 30 patents

Semiconductor package and related methods

Integrated circuit direct cooling systems having substrates in cont...

Power module package and method of manufacturing the same

Semiconductor package having a spacer with a junction cooling pipe

Semiconductor die package including a one-body clip

Semiconductor package and related methods

Semiconductor package having junction cooling pipes embedded in sub...

Semiconductor die package and manufacturing method

Semiconductor package and related methods

Stray inductance reduction in packaged semiconductor devices and mo...

Wireless semiconductor package for efficient heat dissipation

Patents Applicationslast 30 patents

INTEGRATED CIRCUIT DIRECT COOLING SYSTEMS AND RELATED METHODS

INTEGRATED CIRCUIT DIRECT COOLING SYSTEMS AND RELATED METHODS

POWER MODULE PACKAGE AND METHOD OF MANUFACTURING THE SAME RELATED A...

SEMICONDUCTOR PACKAGE AND RELATED METHODS

SEMICONDUCTOR DIE PACKAGE INCLUDING A ONE-BODY CLIP

INTEGRATED CIRCUIT DIRECT COOLING SYSTEMS AND RELATED METHODS

SEMICONDUCTOR PACKAGE AND RELATED METHODS

INTEGRATED CIRCUIT DIRECT COOLING SYSTEMS AND RELATED METHODS

STRAY INDUCTANCE REDUCTION IN PACKAGED SEMICONDUCTOR DEVICES AND MO...

SEMICONDUCTOR DIE PACKAGE AND MANUFACTURING METHOD

SEMICONDUCTOR PACKAGE AND RELATED METHODS

WIRELESS SEMICONDUCTOR PACKAGE FOR EFFICIENT HEAT DISSIPATION