JoonSik Shin

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Suwon-si, KR

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Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing semiconductor package having a first board,...
- Patent number 8,174,128
- Issue date May 8, 2012
- Samsung Electro-Mechanics Co., Ltd.
- Nobuyuki Ikeguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing semiconductor package and semiconductor pla...
- Patent number 8,030,752
- Issue date Oct 4, 2011
- Samsung Electro-Mechanics Co., Ltd.
- Nobuyuki Ikeguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Method of manufacturing semiconductor package
- Publication number 20100291737
- Publication date Nov 18, 2010
- Samsung Electro-Mechanics Co., Ltd.
- Nobuyuki Ikeguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of manufacturing semiconductor package and semiconductor pla...
- Publication number 20090152742
- Publication date Jun 18, 2009
- Samsung Electro-Mechanics Co., Ltd.
- Nobuyuki Ikeguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR