Joonsung Kim

Person

Gyeonggi-do, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Fan-out semiconductor packages
- Patent number 12,159,833
- Issue date Dec 3, 2024
- Samsung Electronics Co., Ltd.
- Joonsung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,062,617
- Issue date Aug 13, 2024
- Samsung Electronics Co., Ltd.
- Joonsung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for efficiently transceiving PSFCH for V2X com...
- Patent number 11,968,648
- Issue date Apr 23, 2024
- Samsung Electronics Co., Ltd.
- Yongin Choi
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Semiconductor package including a chip pad having a connection port...
- Patent number 11,854,912
- Issue date Dec 26, 2023
- Samsung Electronics Co., Ltd.
- Joonsung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,798,862
- Issue date Oct 24, 2023
- Samsung Electronics Co., Ltd.
- Eunseok Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out semiconductor package
- Patent number 11,791,230
- Issue date Oct 17, 2023
- Samsung Electronics Co., Ltd.
- Joonsung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 11,735,532
- Issue date Aug 22, 2023
- Samsung Electronics Co., Ltd.
- Joonsung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Communication device for performing beamforming and operating metho...
- Patent number 11,689,262
- Issue date Jun 27, 2023
- Samsung Electronics Co., Ltd.
- Yongin Choi
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Fan-out semiconductor packages
- Patent number 11,574,868
- Issue date Feb 7, 2023
- Samsung Electronics Co., Ltd.
- Joonsung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for transmitting and receiving downlink contro...
- Patent number 11,569,957
- Issue date Jan 31, 2023
- Samsung Electronics Co., Ltd.
- Yangsoo Kwon
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Apparatus and method for efficiently transceiving PSFCH for V2X com...
- Patent number 11,503,569
- Issue date Nov 15, 2022
- Samsung Electronics Co., Ltd.
- Yongin Choi
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Semiconductor packages
- Patent number 11,355,445
- Issue date Jun 7, 2022
- Samsung Electronics Co., Ltd.
- Joonsung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having semiconductor chip between first and s...
- Patent number 11,158,581
- Issue date Oct 26, 2021
- Samsung Electronics Co., Ltd.
- Joonsung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out semiconductor package
- Patent number 11,127,646
- Issue date Sep 21, 2021
- Samsung Electronics Co., Ltd.
- Joonsung Kim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240363542
- Publication date Oct 31, 2024
- Samsung Electronics Co., Ltd.
- Joonsung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240243053
- Publication date Jul 18, 2024
- Samsung Electronics Co., Ltd.
- JI HWANG KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING A REDISTRIBUTION STRUCTURE
- Publication number 20240186231
- Publication date Jun 6, 2024
- Samsung Electronics Co., Ltd.
- Jihwang KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE COMPRISING THE SAME
- Publication number 20240065002
- Publication date Feb 22, 2024
- Samsung Electronics Co., Ltd.
- Dongkyu Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240038642
- Publication date Feb 1, 2024
- Samsung Electronics Co., Ltd.
- Dongkyu Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240040806
- Publication date Feb 1, 2024
- Samsung Electronics Co., Ltd.
- Joonsung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240030089
- Publication date Jan 25, 2024
- Samsung Electronics Co., Ltd.
- Eunseok CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT SEMICONDUCTOR PACKAGE
- Publication number 20230187424
- Publication date Jun 15, 2023
- Samsung Electronics Co., Ltd.
- Joonsung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT SEMICONDUCTOR PACKAGES
- Publication number 20230163070
- Publication date May 25, 2023
- Samsung Electronics Co., Ltd.
- Joonsung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MASK LAYOUT DESIGN METHOD, MASK AND INTEGRATED CIRCUIT MANUFACTURIN...
- Publication number 20230161937
- Publication date May 25, 2023
- Samsung Electronics Co., Ltd.
- Somin Cheon
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230054984
- Publication date Feb 23, 2023
- Samsung Electronics Co., Ltd.
- Joonsung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR EFFICIENTLY TRANSCEIVING PSFCH FOR V2X COM...
- Publication number 20230049344
- Publication date Feb 16, 2023
- Samsung Electronics Co., Ltd.
- Yongin CHOI
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME
- Publication number 20230024655
- Publication date Jan 26, 2023
- Samsung Electronics Co., Ltd.
- Sangdon LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME
- Publication number 20230014037
- Publication date Jan 19, 2023
- Samsung Electronics Co., Ltd.
- Euntaek Jung
- G11 - INFORMATION STORAGE
Information Patent Application
THREE-DIMENSIONAL SEMICONDUCTOR MEMORY DEVICE AND ELECTRONIC SYSTEM...
- Publication number 20230012115
- Publication date Jan 12, 2023
- Samsung Electronics Co., Ltd.
- Jaeho KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20220392843
- Publication date Dec 8, 2022
- Samsung Electronics Co., Ltd.
- Joonsung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20220278049
- Publication date Sep 1, 2022
- Samsung Electronics Co., Ltd.
- Joonsung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMMUNICATION DEVICE FOR PERFORMING BEAMFORMING AND OPERATING METHO...
- Publication number 20220182115
- Publication date Jun 9, 2022
- Samsung Electronics Co., Ltd.
- Yongin CHOI
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20220108935
- Publication date Apr 7, 2022
- Samsung Electronics Co., Ltd.
- Eunseok CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR EFFECTIVELY MAPPING REFERENCE SIGNAL FOR V...
- Publication number 20220070036
- Publication date Mar 3, 2022
- Samsung Electronics Co.,Ltd.
- Yangsoo Kwon
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20220068730
- Publication date Mar 3, 2022
- Samsung Electronics Co., Ltd.
- Joonsung KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT SEMICONDUCTOR PACKAGE
- Publication number 20210384095
- Publication date Dec 9, 2021
- Samsung Electronics Co., Ltd.
- Joonsung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR EFFICIENTLY TRANSCEIVING PSFCH FOR V2X COM...
- Publication number 20210258919
- Publication date Aug 19, 2021
- Samsung Electronics Co., Ltd.
- Yongin CHOI
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20210202397
- Publication date Jul 1, 2021
- Samsung Electronics Co., Ltd.
- Joonsung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT SEMICONDUCTOR PACKAGES
- Publication number 20210183762
- Publication date Jun 17, 2021
- Samsung Electronics Co., Ltd.
- Joonsung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR TRANSMITTING AND RECEIVING DOWNLINK CONTRO...
- Publication number 20210050973
- Publication date Feb 18, 2021
- Samsung Electronics Co., Ltd.
- YANGSOO KWON
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
FAN-OUT SEMICONDUCTOR PACKAGE
- Publication number 20200161204
- Publication date May 21, 2020
- Samsung Electronics Co., Ltd.
- Joonsung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20200161203
- Publication date May 21, 2020
- Samsung Electronics Co., Ltd.
- Joonsung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for manufacturing printed circuit board with optical waveguides
- Publication number 20120163752
- Publication date Jun 28, 2012
- Samsung Electro-Mechanics Co., Ltd.
- Sanghoon Kim
- G02 - OPTICS
Information Patent Application
Circuit board and method of manufacturing the same
- Publication number 20120160556
- Publication date Jun 28, 2012
- Samsung Electro-Mechanics Co., Ltd.
- Joonsung Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Joonsung Kim

Person

Patents Grantslast 30 patents

Fan-out semiconductor packages

Semiconductor package

Apparatus and method for efficiently transceiving PSFCH for V2X com...

Semiconductor package including a chip pad having a connection port...

Semiconductor package

Fan-out semiconductor package

Semiconductor packages

Communication device for performing beamforming and operating metho...

Fan-out semiconductor packages

Method and apparatus for transmitting and receiving downlink contro...

Apparatus and method for efficiently transceiving PSFCH for V2X com...

Semiconductor packages

Semiconductor package having semiconductor chip between first and s...

Fan-out semiconductor package

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE INCLUDING A REDISTRIBUTION STRUCTURE

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE COMPRISING THE SAME

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

FAN-OUT SEMICONDUCTOR PACKAGE

FAN-OUT SEMICONDUCTOR PACKAGES

MASK LAYOUT DESIGN METHOD, MASK AND INTEGRATED CIRCUIT MANUFACTURIN...

SEMICONDUCTOR PACKAGE

APPARATUS AND METHOD FOR EFFICIENTLY TRANSCEIVING PSFCH FOR V2X COM...

SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME

SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME

THREE-DIMENSIONAL SEMICONDUCTOR MEMORY DEVICE AND ELECTRONIC SYSTEM...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGES

COMMUNICATION DEVICE FOR PERFORMING BEAMFORMING AND OPERATING METHO...

SEMICONDUCTOR PACKAGE

APPARATUS AND METHOD FOR EFFECTIVELY MAPPING REFERENCE SIGNAL FOR V...

SEMICONDUCTOR PACKAGE

FAN-OUT SEMICONDUCTOR PACKAGE

APPARATUS AND METHOD FOR EFFICIENTLY TRANSCEIVING PSFCH FOR V2X COM...

SEMICONDUCTOR PACKAGES

FAN-OUT SEMICONDUCTOR PACKAGES

METHOD AND APPARATUS FOR TRANSMITTING AND RECEIVING DOWNLINK CONTRO...

FAN-OUT SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

Method for manufacturing printed circuit board with optical waveguides

Circuit board and method of manufacturing the same