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JoonYoung Choi
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Gyeonggi-do, KR
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Patents Grants
last 30 patents
Information
Patent Grant
Semiconductor device and method of forming bump structure with insu...
Patent number
9,780,063
Issue date
Oct 3, 2017
STATS ChipPAC Pte. Ltd.
JoonYoung Choi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of individual die bonding followed...
Patent number
9,524,958
Issue date
Dec 20, 2016
STATS ChipPAC Pte. Ltd.
JoonYoung Choi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of forming multi-layered UBM with i...
Patent number
9,252,093
Issue date
Feb 2, 2016
STATS ChipPAC, Ltd.
DaeSik Choi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of manufacture of integrated circuit packaging system with p...
Patent number
9,093,278
Issue date
Jul 28, 2015
Stats Chippac Ltd.
JoonYoung Choi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit packaging system with interconnects
Patent number
9,059,108
Issue date
Jun 16, 2015
Stats Chippac Ltd.
DaeSik Choi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of forming recesses in substrate fo...
Patent number
8,994,048
Issue date
Mar 31, 2015
STATS ChipPAC, Ltd.
JoonYoung Choi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of forming bump structure with insu...
Patent number
8,835,301
Issue date
Sep 16, 2014
STATS ChipPAC, Ltd.
JoonYoung Choi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of forming multi-layered UBM with i...
Patent number
8,642,469
Issue date
Feb 4, 2014
STATS ChipPAC, Ltd.
DaeSik Choi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit packaging system with interconnects and method o...
Patent number
8,546,194
Issue date
Oct 1, 2013
Stats Chippac Ltd.
JoonYoung Choi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of forming a wafer level package st...
Patent number
8,288,203
Issue date
Oct 16, 2012
STATS ChipPAC, Ltd.
SungWon Cho
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
Semiconductor Device and Method of Forming Underfill Dam for Chip-t...
Publication number
20240021566
Publication date
Jan 18, 2024
STATS ChipPAC Pte Ltd.
WooSoon Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MAKING THE SAME
Publication number
20230411346
Publication date
Dec 21, 2023
STATS ChipPAC Pte Ltd.
JoonYoung CHOI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Individual Die Bonding Followed...
Publication number
20150001703
Publication date
Jan 1, 2015
STATS ChipPAC, Ltd.
JoonYoung Choi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Forming Bump Structure with Insu...
Publication number
20140319680
Publication date
Oct 30, 2014
JoonYoung Choi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Forming Multi-Layered UBM with I...
Publication number
20140070410
Publication date
Mar 13, 2014
STATS ChipPAC, Ltd.
DaeSik Choi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH INTERCONNECTS AND METHOD O...
Publication number
20130221543
Publication date
Aug 29, 2013
DaeSik Choi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH INTERCONNECTS AND METHOD O...
Publication number
20130157418
Publication date
Jun 20, 2013
JoonYoung Choi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Forming a Wafer Level Package St...
Publication number
20130001773
Publication date
Jan 3, 2013
STATS ChipPAC, Ltd.
SungWon Cho
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Forming a Wafer Level Package St...
Publication number
20120217629
Publication date
Aug 30, 2012
STATS ChipPAC, Ltd.
SungWon Cho
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Forming Bump Structure with Insu...
Publication number
20120217640
Publication date
Aug 30, 2012
STATS ChipPAC, Ltd.
JoonYoung Choi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Forming Multi-Layered UBM with I...
Publication number
20120211900
Publication date
Aug 23, 2012
STATS ChipPAC, Ltd.
DaeSik Choi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Forming Recesses in Substrate fo...
Publication number
20120146177
Publication date
Jun 14, 2012
STATS ChipPAC, Ltd.
JoonYoung Choi
H01 - BASIC ELECTRIC ELEMENTS