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Seongnam-si, KR
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Patents Grants
last 30 patents
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Patent Grant
Method of fabricating semiconductor package and semiconductor package
Patent number
11,791,321
Issue date
Oct 17, 2023
Samsung Electronics Co., Ltd.
Tae-Young Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of fabricating semiconductor package and semiconductor package
Patent number
11,251,169
Issue date
Feb 15, 2022
Samsung Electronics Co., Ltd.
Tae-Young Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor module
Patent number
9,437,518
Issue date
Sep 6, 2016
Samsung Electronics Co., Ltd.
Jaebum Byun
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
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Patent Application
METHOD OF FABRICATING SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE
Publication number
20220157795
Publication date
May 19, 2022
Samsung Electronics Co., Ltd.
TAE-YOUNG LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF FABRICATING SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE
Publication number
20200203325
Publication date
Jun 25, 2020
Samsung Electronics Co., Ltd.
TAE-YOUNG LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR MODULE
Publication number
20140117528
Publication date
May 1, 2014
Samsung Electronics Co., Ltd.
Jaebum BYUN
H01 - BASIC ELECTRIC ELEMENTS