JooYang EOM

Person

Gimpo-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor packages using package in package systems and related...
- Patent number 11,984,424
- Issue date May 14, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Inpil Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module package for direct cooling multiple power modules
- Patent number 11,848,320
- Issue date Dec 19, 2023
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jerome Teysseyre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module package for direct cooling multiple power modules
- Patent number 11,430,777
- Issue date Aug 30, 2022
- Semiconductor Components Industries, LLC
- Jerome Teysseyre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Clips for semiconductor package and related methods
- Patent number 11,264,311
- Issue date Mar 1, 2022
- Semiconductor Components Industries, LLC
- Inpil Yoo
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGES USING PACKAGE IN PACKAGE SYSTEMS AND RELATED...
- Publication number 20240258268
- Publication date Aug 1, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Inpil YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT-COOLING FOR SEMICONDUCTOR DEVICE MODULES
- Publication number 20240186211
- Publication date Jun 6, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- JooYang EOM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE PACKAGE FOR DIRECT COOLING MULTIPLE POWER MODULES
- Publication number 20240120328
- Publication date Apr 11, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jerome TEYSSEYRE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH POWER MODULE PACKAGE STRUCTURES
- Publication number 20230253362
- Publication date Aug 10, 2023
- Semiconductor Components Industries, LLC
- Seungwon IM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBMODULE SEMICONDUCTOR PACKAGE
- Publication number 20220406744
- Publication date Dec 22, 2022
- Semiconductor Components Industries, LLC
- JooYang EOM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE PACKAGE FOR DIRECT COOLING MULTIPLE POWER MODULES
- Publication number 20220406767
- Publication date Dec 22, 2022
- Semiconductor Components Industries, LLC
- Jerome TEYSSEYRE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CLIPS FOR SEMICONDUCTOR PACKAGE AND RELATED METHODS
- Publication number 20220173022
- Publication date Jun 2, 2022
- Semiconductor Components Industries, LLC
- Inpil YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT-COOLING FOR SEMICONDUCTOR DEVICE MODULES
- Publication number 20220157688
- Publication date May 19, 2022
- Semiconductor Components Industries, LLC
- JooYang EOM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE PACKAGE FOR DIRECT COOLING MULTIPLE POWER MODULES
- Publication number 20220157801
- Publication date May 19, 2022
- Semiconductor Components Industries, LLC
- Jerome TEYSSEYRE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES USING PACKAGE IN PACKAGE SYSTEMS AND RELATED...
- Publication number 20210242167
- Publication date Aug 5, 2021
- Semiconductor Components Industries, LLC
- Inpil YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CLIPS FOR SEMICONDUCTOR PACKAGE AND RELATED METHODS
- Publication number 20210111104
- Publication date Apr 15, 2021
- Semiconductor Components Industries, LLC
- Inpil YOO
- H01 - BASIC ELECTRIC ELEMENTS

JooYang EOM

Person

Patents Grantslast 30 patents

Semiconductor packages using package in package systems and related...

Power module package for direct cooling multiple power modules

Power module package for direct cooling multiple power modules

Clips for semiconductor package and related methods

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGES USING PACKAGE IN PACKAGE SYSTEMS AND RELATED...

DIRECT-COOLING FOR SEMICONDUCTOR DEVICE MODULES

POWER MODULE PACKAGE FOR DIRECT COOLING MULTIPLE POWER MODULES

HIGH POWER MODULE PACKAGE STRUCTURES

SUBMODULE SEMICONDUCTOR PACKAGE

POWER MODULE PACKAGE FOR DIRECT COOLING MULTIPLE POWER MODULES

CLIPS FOR SEMICONDUCTOR PACKAGE AND RELATED METHODS

DIRECT-COOLING FOR SEMICONDUCTOR DEVICE MODULES

POWER MODULE PACKAGE FOR DIRECT COOLING MULTIPLE POWER MODULES

SEMICONDUCTOR PACKAGES USING PACKAGE IN PACKAGE SYSTEMS AND RELATED...

CLIPS FOR SEMICONDUCTOR PACKAGE AND RELATED METHODS