Jooyoung Oh

Person

  • Asan-Si, KR

Patents Grantslast 30 patents

  • Information Patent Grant

    Semiconductor package

    • Patent number 11,862,608
    • Issue date Jan 2, 2024
    • Samsung Electronics Co., Ltd.
    • Jooyoung Oh
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor package

    • Patent number 11,842,977
    • Issue date Dec 12, 2023
    • Samsung Electronics Co., Ltd.
    • Jooyoung Oh
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

  • Information Patent Application

    SEMICONDUCTOR PACKAGE

    • Publication number 20250140726
    • Publication date May 1, 2025
    • Samsung Electronics Co., Ltd.
    • Kyunglyul LEE
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE

    • Publication number 20250054896
    • Publication date Feb 13, 2025
    • Samsung Electronics Co., Ltd.
    • Jooyoung OH
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CAMERA MODULE AND ELECTRONIC DEVICE COMPRISING SAME

    • Publication number 20240419013
    • Publication date Dec 19, 2024
    • Samsung Electronics Co., Ltd.
    • Youngjae HWANG
    • G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
  • Information Patent Application

    SEMICONDUCTOR PACKAGE

    • Publication number 20240063144
    • Publication date Feb 22, 2024
    • Samsung Electronics Co., Ltd.
    • Jooyoung OH
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE INCLUDING AN ADHESIVE STRUCTURE

    • Publication number 20240014164
    • Publication date Jan 11, 2024
    • Samsung Electronics Co., Ltd.
    • Jooyoung OH
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGES HAVING ADHESIVE MEMBERS

    • Publication number 20230098993
    • Publication date Mar 30, 2023
    • Samsung Electronics Co., Ltd.
    • Jooyoung Oh
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE USING THE SAME

    • Publication number 20230027559
    • Publication date Jan 26, 2023
    • Samsung Electronics Co., Ltd.
    • Jooyoung Oh
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE

    • Publication number 20230017908
    • Publication date Jan 19, 2023
    • Samsung Electronics Co., Ltd.
    • Jooyoung OH
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE

    • Publication number 20220208717
    • Publication date Jun 30, 2022
    • Samsung Electronics Co., Ltd.
    • Jooyoung Oh
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE

    • Publication number 20220208729
    • Publication date Jun 30, 2022
    • Samsung Electronics Co., Ltd.
    • Jooyoung Oh
    • H01 - BASIC ELECTRIC ELEMENTS