Jordan Mizerak

Person

Boston, MA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Thermal management of electronics using co-located microjet nozzles...
- Patent number 12,100,643
- Issue date Sep 24, 2024
- JetCool Technologies, Inc.
- Jordan Mizerak
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Flow-through, hot-spot-targeting immersion cooling assembly
- Patent number 12,048,118
- Issue date Jul 23, 2024
- Jetcool Technologies Inc.
- Bernard Malouin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Actively cooled heat-dissipation lids for computer processors and a...
- Patent number 12,016,157
- Issue date Jun 18, 2024
- JetCool Technlologies Inc.
- Bernard Malouin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
High temperature electronic device thermal management system
- Patent number 11,963,341
- Issue date Apr 16, 2024
- Jetcool Technologies Inc.
- Bernard Malouin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Direct contact fluid based cooling module
- Patent number 11,844,193
- Issue date Dec 12, 2023
- JetCool Technologies, Inc.
- Jordan Mizerak
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Re-entrant flow cold plate
- Patent number 11,277,937
- Issue date Mar 15, 2022
- Jetcool Technologies Inc.
- Bernard Malouin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Direct contact fluid based cooling module
- Patent number 11,191,184
- Issue date Nov 30, 2021
- Jetcool Technologies Inc.
- Jordan Mizerak
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Actively Cooled Heat-Dissipation Lids for Computer Processors and P...
- Publication number 20240206128
- Publication date Jun 20, 2024
- Jetcool Technologies Inc.
- Bernard MALOUIN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
High Temperature Electronic Device Thermal Management System
- Publication number 20240090180
- Publication date Mar 14, 2024
- Jetcool Technologies Inc.
- Bernard Malouin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Ship-and-Install Electronics Assembly with Multifunctional Interfac...
- Publication number 20230284416
- Publication date Sep 7, 2023
- Jetcool Technologies Inc.
- Bernard Malouin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Actively Cooled Heat-Dissipation Lids for Computer Processors and A...
- Publication number 20230284421
- Publication date Sep 7, 2023
- Jetcool Technologies Inc.
- Bernard MALOUIN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Liquid-In-Liquid Cooling System for Electronic Components
- Publication number 20230156959
- Publication date May 18, 2023
- Jetcool Technologies Inc.
- Bernard Malouin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Flow-Through, Hot-Spot-Targeting Immersion Cooling Assembly
- Publication number 20230048500
- Publication date Feb 16, 2023
- Jetcool Technologies Inc.
- Bernard Malouin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Re-Entrant Flow Cold Plate
- Publication number 20220408592
- Publication date Dec 22, 2022
- Jetcool Technologies Inc.
- Bernard Malouin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DIRECT CONTACT FLUID BASED COOLING MODULE
- Publication number 20220338375
- Publication date Oct 20, 2022
- Jetcool Technologies Inc.
- Jordan Mizerak
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Conformal Cooling Assembly with Substrate Fluid-Proofing for Multi-...
- Publication number 20220230937
- Publication date Jul 21, 2022
- Jetcool Technologies Inc.
- Bernard MALOUIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Material, Variable Heat Flux Cold Plate
- Publication number 20220117115
- Publication date Apr 14, 2022
- Jetcool Technologies Inc.
- Bernard Malouin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
High Temperature Electronic Device Thermal Management System
- Publication number 20220087076
- Publication date Mar 17, 2022
- Jetcool Technologies Inc.
- Bernard Malouin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Re-Entrant Flow Cold Plate
- Publication number 20210037676
- Publication date Feb 4, 2021
- Jetcool Technologies Inc.
- Bernard Malouin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Microjet-Cooled Flanges for Electronic Devices
- Publication number 20200350233
- Publication date Nov 5, 2020
- Jetcool Technologies, Inc.
- Jordan Mizerak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Direct Contact Fluid Based Cooling Module
- Publication number 20200352053
- Publication date Nov 5, 2020
- Jetcool Technologies, Inc.
- Jordan Mizerak
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Thermal Management of Electronics Using Co-located Microjet Nozzles...
- Publication number 20200343160
- Publication date Oct 29, 2020
- Jetcool Technologies, Inc.
- Jordan Mizerak
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
Fluid-Pressure Assisted Coaxial Fluid Elements, Fittings and Assemb...
- Publication number 20200326025
- Publication date Oct 15, 2020
- Jetcool Technologies Inc.
- Bernard Malouin
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...

Jordan Mizerak

Person

Patents Grantslast 30 patents

Thermal management of electronics using co-located microjet nozzles...

Flow-through, hot-spot-targeting immersion cooling assembly

Actively cooled heat-dissipation lids for computer processors and a...

High temperature electronic device thermal management system

Direct contact fluid based cooling module

Re-entrant flow cold plate

Direct contact fluid based cooling module

Patents Applicationslast 30 patents

Actively Cooled Heat-Dissipation Lids for Computer Processors and P...

High Temperature Electronic Device Thermal Management System

Ship-and-Install Electronics Assembly with Multifunctional Interfac...

Actively Cooled Heat-Dissipation Lids for Computer Processors and A...

Liquid-In-Liquid Cooling System for Electronic Components

Flow-Through, Hot-Spot-Targeting Immersion Cooling Assembly

Re-Entrant Flow Cold Plate

DIRECT CONTACT FLUID BASED COOLING MODULE

Conformal Cooling Assembly with Substrate Fluid-Proofing for Multi-...

Multi-Material, Variable Heat Flux Cold Plate

High Temperature Electronic Device Thermal Management System

Re-Entrant Flow Cold Plate

Microjet-Cooled Flanges for Electronic Devices

Direct Contact Fluid Based Cooling Module

Thermal Management of Electronics Using Co-located Microjet Nozzles...

Fluid-Pressure Assisted Coaxial Fluid Elements, Fittings and Assemb...