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Jordi GIMENEZ MANENT

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  • Sant Cugat del Valles, ES
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Patents Grantslast 30 patents

  • Information Patent Grant

    Supplying build material
    • Patent number 11,260,591
    • Issue date Mar 1, 2022
    • Hewlett-Packard Development Company, L.P.
    • Jordi Gimenez Manent
    • B33 - ADDITIVE MANUFACTURING TECHNOLOGY
  • Information Patent Grant

    Removable 3D build module comprising a memory
    • Patent number 11,072,027
    • Issue date Jul 27, 2021
    • Hewlett-Packard Development Company, L.P.
    • Fernando Juan
    • B22 - CASTING POWDER METALLURGY
  • Information Patent Grant

    Recoater for 3D printers
    • Patent number 10,751,940
    • Issue date Aug 25, 2020
    • Hewlett-Packard Development Company, L.P.
    • Haseeb Yusef
    • B22 - CASTING POWDER METALLURGY
  • Information Patent Grant

    Supplying build material
    • Patent number 10,569,467
    • Issue date Feb 25, 2020
    • Hewlett-Packard Development Company, L.P.
    • Jordi Gimenez Manent
    • B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Patents Applicationslast 30 patents

  • Information Patent Application

    SUPPLYING BUILD MATERIAL
    • Publication number 20200147885
    • Publication date May 14, 2020
    • Hewlett-Packard Development Company, L.P.
    • Jordi Gimenez Manent
    • B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
  • Information Patent Application

    RECOATER FOR 3D PRINTERS
    • Publication number 20190039301
    • Publication date Feb 7, 2019
    • Hewlett-Packard Development Company, L.P.
    • Haseeb YUSEF
    • B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
  • Information Patent Application

    SUPPLYING BUILD MATERIAL
    • Publication number 20180071985
    • Publication date Mar 15, 2018
    • Hewlett-Packard Development Company, L.P.
    • Jordi Gimenez Manent
    • B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
  • Information Patent Application

    REMOVABLE 3D BUILD MODULE COMPRISING A MEMORY
    • Publication number 20180001567
    • Publication date Jan 4, 2018
    • Hewlett-Packard Development Company, L.P.
    • Fernando JUAN
    • B33 - ADDITIVE MANUFACTURING TECHNOLOGY