Jorge Contreras Perez

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Zapopan, MX

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Patents Grantslast 30 patents

Information Patent Grant
Multi-surface heat sink suitable for multi-chip packages
- Patent number 11,495,518
- Issue date Nov 8, 2022
- Intel Corporation
- Shrenik Kothari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for detaching a microprocessor from a heat sink
- Patent number 11,296,009
- Issue date Apr 5, 2022
- Intel Corporation
- Rolf Laido
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ENVIRONMENTAL SEALING FOR ELECTRONICS CHIP PACKAGE SOCKETS
- Publication number 20250218909
- Publication date Jul 3, 2025
- Intel Corporation
- Donald Tiendung TRAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE INTEGRATED TORSION LOADING MECHANISM
- Publication number 20230395460
- Publication date Dec 7, 2023
- Intel Corporation
- David Shia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-SURFACE HEAT SINK SUITABLE FOR MULTI-CHIP PACKAGES
- Publication number 20200251403
- Publication date Aug 6, 2020
- Intel Corporation
- Shrenik Kothari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR DETACHING A MICROPROCESSOR FROM A HEAT SINK
- Publication number 20190304871
- Publication date Oct 3, 2019
- Intel Corporation
- Rolf Laido
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR