Jose Carlos Arroyo

Person

Allen, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device assembly with pre-reflowed solder
- Patent number 12,132,027
- Issue date Oct 29, 2024
- Texas Instruments Incorporated
- James Raymond Maliclic Baello
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe having organic, polymerizable photo-imageable adhesion layer
- Patent number 10,672,692
- Issue date Jun 2, 2020
- Texas Instruments Incorporated
- Jaimal Mallory Williamson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor substrate having stress-absorbing surface layer
- Patent number 10,490,515
- Issue date Nov 26, 2019
- Texas Instruments Incorporated
- Jaimal M. Williamson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor substrate having stress-absorbing surface layer
- Patent number 10,347,589
- Issue date Jul 9, 2019
- Texas Instruments Incorporated
- Jaimal M. Williamson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for forming leadframe having organic, polymerizable photo-i...
- Patent number 9,934,989
- Issue date Apr 3, 2018
- Texas Instruments Incorporated
- Jaimal Mallory Williamson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor substrate having stress-absorbing surface layer
- Patent number 9,673,065
- Issue date Jun 6, 2017
- Texas Instruments Incorporated
- Jaimal M. Williamson
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLY WITH PRE-REFLOWED SOLDER
- Publication number 20250022841
- Publication date Jan 16, 2025
- TEXAS INSTRUMENTS INCORPORATED
- James Raymond Maliclic Baello
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONICS DEVICE PACKAGE AND METHODS
- Publication number 20230411262
- Publication date Dec 21, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Osvaldo Lopez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLY WITH PRE-REFLOWED SOLDER
- Publication number 20220122940
- Publication date Apr 21, 2022
- TEXAS INSTRUMENTS INCORPORATED
- James Raymond Maliclic Baello
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Substrate Having Stress-Absorbing Surface Layer
- Publication number 20190279944
- Publication date Sep 12, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Jaimal M. Williamson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS FOR FORMING LEADFRAME HAVING ORGANIC, POLYMERIZABLE PHOTO-I...
- Publication number 20180096859
- Publication date Apr 5, 2018
- TEXAS INSTRUMENTS INCORPORATED
- Jaimal Mallory Williamson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Leadframe Having Organic, Polymerizable Photo-Imageable Adhesion Layer
- Publication number 20180096860
- Publication date Apr 5, 2018
- TEXAS INSTRUMENTS INCORPORATED
- Jaimal Mallory Williamson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Substrate Having Stress-Absorbing Surface Layer
- Publication number 20170229405
- Publication date Aug 10, 2017
- TEXAS INSTRUMENTS INCORPORATED
- Jaimal M. Williamson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR SUBSTRATE HAVING STRESS-ABSORBING SURFACE LAYER
- Publication number 20150021762
- Publication date Jan 22, 2015
- TEXAS INSTRUMENTS INCORPORATED
- Jaimal M. Williamson
- H01 - BASIC ELECTRIC ELEMENTS

Jose Carlos Arroyo

Person

Patents Grantslast 30 patents

Semiconductor device assembly with pre-reflowed solder

Leadframe having organic, polymerizable photo-imageable adhesion layer

Semiconductor substrate having stress-absorbing surface layer

Semiconductor substrate having stress-absorbing surface layer

Process for forming leadframe having organic, polymerizable photo-i...

Semiconductor substrate having stress-absorbing surface layer

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE ASSEMBLY WITH PRE-REFLOWED SOLDER

MICROELECTRONICS DEVICE PACKAGE AND METHODS

SEMICONDUCTOR DEVICE ASSEMBLY WITH PRE-REFLOWED SOLDER

Semiconductor Substrate Having Stress-Absorbing Surface Layer

PROCESS FOR FORMING LEADFRAME HAVING ORGANIC, POLYMERIZABLE PHOTO-I...

Leadframe Having Organic, Polymerizable Photo-Imageable Adhesion Layer

Semiconductor Substrate Having Stress-Absorbing Surface Layer

SEMICONDUCTOR SUBSTRATE HAVING STRESS-ABSORBING SURFACE LAYER