Jose Diaz

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Pembroke Pines, FL, US

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Patents Grantslast 30 patents

Information Patent Grant
Heat sink packaging assembly for electronic components
- Patent number 7,259,446
- Issue date Aug 21, 2007
- Motorola, Inc.
- Jose Diaz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical connections having pullout prevention feature
- Patent number 7,104,830
- Issue date Sep 12, 2006
- Jose Diaz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reversible heat sink packaging assembly for an integrated circuit
- Patent number 6,813,154
- Issue date Nov 2, 2004
- Motorola, Inc.
- Jose Diaz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal dissipation package for an electrical surface mount component
- Patent number 6,784,366
- Issue date Aug 31, 2004
- Motorola, Inc.
- Edmund B. Boucher
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SCALABLE INTERCHANGEABLE MULTIBAND POWER PACKAGE MOUNTING APPARATUS
- Publication number 20080079143
- Publication date Apr 3, 2008
- MOTOROLA, INC.
- Edmund B. Boucher
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Heat sink packaging assembly for electronic components
- Publication number 20070045822
- Publication date Mar 1, 2007
- Jose Diaz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Assembly for an electronic component
- Publication number 20070047210
- Publication date Mar 1, 2007
- Jose Diaz
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
REVERSIBLE HEAT SINK PACKAGING ASSEMBLY FOR AN INTEGRATED CIRCUIT
- Publication number 20040109292
- Publication date Jun 10, 2004
- Jose Diaz
- H01 - BASIC ELECTRIC ELEMENTS