Jose Felixminia PALAGUD JR.

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Seremban, MY

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Patents Grantslast 30 patents

Information Patent Grant
Quad flat no leads package with locking feature
- Patent number 10,825,754
- Issue date Nov 3, 2020
- Semiconductor Components Industries, LLC
- Soon Wei Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip packages with stabilized die pads
- Patent number 10,438,877
- Issue date Oct 8, 2019
- Semiconductor Components Industries, LLC
- Jose Felixminia Palagud
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
QUAD FLAT NO LEADS PACKAGE WITH LOCKING FEATURE
- Publication number 20210043550
- Publication date Feb 11, 2021
- Semiconductor Components Industries, LLC
- Soon Wei WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP PACKAGES WITH STABILIZED DIE PADS
- Publication number 20190287884
- Publication date Sep 19, 2019
- Semiconductor Components Industries, LLC
- Jose Felixminia PALAGUD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
QUAD FLAT NO LEADS PACKAGE
- Publication number 20180040539
- Publication date Feb 8, 2018
- Semiconductor Components Industries, LLC
- Soon Wei WANG
- H01 - BASIC ELECTRIC ELEMENTS