Jose L. Sanchez

Follow

Person

Boise, ID, US

People

Patents Grantslast 30 patents

Information Patent Grant
Using backgrind wafer tape to enable wafer mounting of bumped wafers
- Patent number 6,949,158
- Issue date Sep 27, 2005
- Micron Technology, Inc.
- Michael B. Ball
- B24 - GRINDING POLISHING
Information Patent Grant
Semiconductor film wafer cassette
- Patent number 5,638,958
- Issue date Jun 17, 1997
- Micron Technology, Inc.
- Jose L. Sanchez
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Using backgrind wafer tape to enable wafer mounting of bumped wafers
- Publication number 20050098887
- Publication date May 12, 2005
- Michael B. Ball
- B24 - GRINDING POLISHING
Information Patent Application
Using backgrind wafer tape to enable wafer mounting of bumped wafers
- Publication number 20020166625
- Publication date Nov 14, 2002
- Michael B. Ball
- B24 - GRINDING POLISHING