Josef Gaida

Person

Berlin, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Acidic aqueous composition for electrolytic copper plating
- Patent number 12,071,702
- Issue date Aug 27, 2024
- Atotech Deutschland GmbH
- Kun Si
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Acidic aqueous composition for electrolytically depositing a copper...
- Patent number 12,054,843
- Issue date Aug 6, 2024
- Atotech Deutschland GmbH & Co. KG
- Ralf Schmidt
- C07 - ORGANIC CHEMISTRY
Information Patent Grant
Bath and method for filling a vertical interconnect access or trenc...
- Patent number 11,091,849
- Issue date Aug 17, 2021
- Atotech Deutschland GmbH
- Josef Gaida
- C07 - ORGANIC CHEMISTRY
Information Patent Grant
Acidic aqueous composition for electrolytic copper plating
- Patent number 11,035,051
- Issue date Jun 15, 2021
- Atotech Deutschland GmbH
- Kun Si
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Etching solution for copper and copper alloy surfaces
- Patent number 10,619,251
- Issue date Apr 14, 2020
- Atotech Deutschland GmbH
- Fabian Michalik
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Wire bondable surface for microelectronic devices
- Patent number 9,076,773
- Issue date Jul 7, 2015
- Atotech Deutschland GmbH
- Albrecht Uhlig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrodeposition method with analysis of the electrolytic bath by...
- Patent number 9,057,145
- Issue date Jun 16, 2015
- Atotech Deutschland GmbH
- Jürgen Barthelmes
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Stress-reduced Ni-P/Pd stacks for bondable wafer surfaces
- Patent number 8,986,789
- Issue date Mar 24, 2015
- Atotech Deutschland GmbH
- Albrecht Uhlig
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Iron-containing nanoparticles with double coating and their use in...
- Patent number 6,576,221
- Issue date Jun 10, 2003
- Institut fur Diagnostikforschung GmbH
- Mayk Kresse
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Iron-containing nanoparticles with double coating and their use in...
- Patent number 6,048,515
- Issue date Apr 11, 2000
- Institut fur Diagnostikforschung GmbH
- Mayk Kresse
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
3-,8-substituted deuteroporphyrin derivatives, pharmaceutical agent...
- Patent number 5,849,259
- Issue date Dec 15, 1998
- Institut fur Diagnostikforschung GmbH
- Christoph Stephan Hilger
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE

Patents Applicationslast 30 patents

Information Patent Application
ACIDIC AQUEOUS COMPOSITION FOR ELECTROLYTICALLY DEPOSITING A COPPER...
- Publication number 20230142446
- Publication date May 11, 2023
- Atotech Deutschland GmbH & Co. KG
- Ralf SCHMIDT
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
A METHOD FOR ACTIVATING A SURFACE OF A NON-CONDUCTIVE OR CARBON-FIB...
- Publication number 20220154343
- Publication date May 19, 2022
- Atotech Deutschland GmbH
- Josef GAIDA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ACIDIC AQUEOUS COMPOSITION FOR ELECTROLYTIC COPPER PLATING
- Publication number 20210262105
- Publication date Aug 26, 2021
- Atotech Deutschland GmbH
- Kun SI
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
A BATH AND METHOD FOR FILLING A VERTICAL INTERCONNECT ACCESS OR TRE...
- Publication number 20200199766
- Publication date Jun 25, 2020
- Atotech Deutschland GmbH
- Josef GAIDA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ACIDIC AQUEOUS COMPOSITION FOR ELECTROLYTIC COPPER PLATING
- Publication number 20190203369
- Publication date Jul 4, 2019
- Atotech Deutschland GmbH
- Kun SI
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ETCHING SOLUTION FOR COPPER AND COPPER ALLOY SURFACES
- Publication number 20190003061
- Publication date Jan 3, 2019
- Atotech Deutschland GmbH
- Fabian MICHALIK
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
WIRE BONDABLE SURFACE FOR MICROELECTRONIC DEVICES
- Publication number 20140110844
- Publication date Apr 24, 2014
- Atotech Deutschland GmbH
- Albrecht Uhlig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRESS-REDUCED NI-P/PD STACKS FOR BONDABLE WAFER SURFACES
- Publication number 20110200842
- Publication date Aug 18, 2011
- Atotech Deutschland GmbH
- Albrecht Uhlig
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Electrodeposition method with analysis of the electrolytic bath by...
- Publication number 20100059384
- Publication date Mar 11, 2010
- Atotech Deutschland GmbH
- Jürgen Barthelmes
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Iron-containing nanoparticles with double coating and their use in...
- Publication number 20030185757
- Publication date Oct 2, 2003
- Mayk Kresse
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
Iron-containing nanoparticles with double coating and their use in...
- Publication number 20020141943
- Publication date Oct 3, 2002
- Institut fur Diagnostikforschung GmbH
- Mayk Kresse
- B82 - NANO-TECHNOLOGY

Josef Gaida

Person

Patents Grantslast 30 patents

Acidic aqueous composition for electrolytic copper plating

Acidic aqueous composition for electrolytically depositing a copper...

Bath and method for filling a vertical interconnect access or trenc...

Acidic aqueous composition for electrolytic copper plating

Etching solution for copper and copper alloy surfaces

Wire bondable surface for microelectronic devices

Electrodeposition method with analysis of the electrolytic bath by...

Stress-reduced Ni-P/Pd stacks for bondable wafer surfaces

Iron-containing nanoparticles with double coating and their use in...

Iron-containing nanoparticles with double coating and their use in...

3-,8-substituted deuteroporphyrin derivatives, pharmaceutical agent...

Patents Applicationslast 30 patents

ACIDIC AQUEOUS COMPOSITION FOR ELECTROLYTICALLY DEPOSITING A COPPER...

A METHOD FOR ACTIVATING A SURFACE OF A NON-CONDUCTIVE OR CARBON-FIB...

ACIDIC AQUEOUS COMPOSITION FOR ELECTROLYTIC COPPER PLATING

A BATH AND METHOD FOR FILLING A VERTICAL INTERCONNECT ACCESS OR TRE...

ACIDIC AQUEOUS COMPOSITION FOR ELECTROLYTIC COPPER PLATING

ETCHING SOLUTION FOR COPPER AND COPPER ALLOY SURFACES

WIRE BONDABLE SURFACE FOR MICROELECTRONIC DEVICES

STRESS-REDUCED NI-P/PD STACKS FOR BONDABLE WAFER SURFACES

Electrodeposition method with analysis of the electrolytic bath by...

Iron-containing nanoparticles with double coating and their use in...

Iron-containing nanoparticles with double coating and their use in...