Josef Hirtreiter

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Viechtach, DE

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Patents Grantslast 30 patents

Information Patent Grant
Method of fabricating a chip package
- Patent number 8,912,087
- Issue date Dec 16, 2014
- Infineon Technologies AG
- Josef Hirtreiter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a component and device comprising a component
- Patent number 8,872,314
- Issue date Oct 28, 2014
- Infineon Technologies AG
- Horst Theuss
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a component and device having a component
- Patent number 8,482,135
- Issue date Jul 9, 2013
- Infineon Technologies AG
- Horst Theuss
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Patents Applicationslast 30 patents

Information Patent Application
CHIP PACKAGE AND A METHOD FOR MANUFACTURING A CHIP PACKAGE
- Publication number 20140035127
- Publication date Feb 6, 2014
- INFINEON TECHNOLOGIES AG
- Josef Hirtreiter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING A COMPONENT AND DEVICE COMPRISING A COMPONENT
- Publication number 20130277864
- Publication date Oct 24, 2013
- Horst Theuss
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for producing a component and device having a component
- Publication number 20080036099
- Publication date Feb 14, 2008
- INFINEON TECHNOLOGIES AG
- Horst Theuss
- H01 - BASIC ELECTRIC ELEMENTS