Josef Hoeglauer

Person

Muenchen, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Method of forming a semiconductor module
- Patent number 12,087,740
- Issue date Sep 10, 2024
- Infineon Technologies Austria AG
- Angela Kessler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with clip having through hole accommodating component-relat...
- Patent number 12,027,436
- Issue date Jul 2, 2024
- Infineon Technologies AG
- Angela Kessler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor system having an inductor module attached to a...
- Patent number 11,996,771
- Issue date May 28, 2024
- Infineon Technologies Austria AG
- Petteri Palm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package, semiconductor module and methods for manufac...
- Patent number 11,978,692
- Issue date May 7, 2024
- Infineon Technologies Austria AG
- Sergey Yuferev
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 11,817,430
- Issue date Nov 14, 2023
- Infineon Technologies Austria AG
- Angela Kessler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a semiconductor package
- Patent number 11,776,882
- Issue date Oct 3, 2023
- Infineon Technologies Austria AG
- Markus Dinkel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a power semiconductor system
- Patent number 11,539,291
- Issue date Dec 27, 2022
- Infineon Technologies Austria AG
- Petteri Palm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Clip frame assembly, semiconductor package having a lead frame and...
- Patent number 11,515,244
- Issue date Nov 29, 2022
- Infineon Technologies AG
- Bun Kian Tay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating a semiconductor pac...
- Patent number 11,302,610
- Issue date Apr 12, 2022
- Infineon Technologies Austria AG
- Markus Dinkel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Clip frame assembly, semiconductor package having a lead frame and...
- Patent number 10,964,628
- Issue date Mar 30, 2021
- Infineon Technologies AG
- Thorsten Scharf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing an SMD package with top side cooling
- Patent number 10,903,133
- Issue date Jan 26, 2021
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing inductor modules and power semiconductor s...
- Patent number 10,833,583
- Issue date Nov 10, 2020
- Infineon Technologies Austria AG
- Petteri Palm
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
SMD package with flat contacts to prevent bottleneck
- Patent number 10,699,987
- Issue date Jun 30, 2020
- tInfineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reinforcement for electrical connectors
- Patent number 10,700,037
- Issue date Jun 30, 2020
- Infineon Technologies AG
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor systems having inductor modules, and methods of...
- Patent number 10,601,314
- Issue date Mar 24, 2020
- Infineon Technologies Austria AG
- Petteri Palm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
SMD package with top side cooling
- Patent number 10,566,260
- Issue date Feb 18, 2020
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Half bridge circuit, method of operating a half bridge circuit and...
- Patent number 10,224,912
- Issue date Mar 5, 2019
- Infineon Technologies Austria AG
- Ralf Otremba
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Semiconductor chip package having a repeating footprint pattern
- Patent number 10,204,845
- Issue date Feb 12, 2019
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor component having inner and outer semiconductor compon...
- Patent number 9,991,183
- Issue date Jun 5, 2018
- Infineon Technologies Austria AG
- Josef Hoeglauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip carrier structure, chip package and method of manufacturing th...
- Patent number 9,824,958
- Issue date Nov 21, 2017
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transistor arrangement with semiconductor chips between two substrates
- Patent number 9,806,029
- Issue date Oct 31, 2017
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lateral element isolation device
- Patent number 9,786,584
- Issue date Oct 10, 2017
- Infineon Technologies AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor housing with rear-side structuring
- Patent number 9,627,292
- Issue date Apr 18, 2017
- Infineon Technologies AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip semiconductor power device
- Patent number 9,515,060
- Issue date Dec 6, 2016
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages having multiple lead frames and methods of f...
- Patent number 9,449,902
- Issue date Sep 20, 2016
- Infineon Technologies AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and method for manufacturing the same
- Patent number 9,437,548
- Issue date Sep 6, 2016
- Infineon Technologies Austria AG
- Henrik Ewe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a chip arrangement
- Patent number 9,412,626
- Issue date Aug 9, 2016
- Infineon Technologies AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip arrangement, a method for manufacturing a chip arrangement, in...
- Patent number 9,397,018
- Issue date Jul 19, 2016
- Infineon Technologies AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 9,362,240
- Issue date Jun 7, 2016
- Infineon Technologies Austria AG
- Khalil Hosseini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip arrangement, a method for manufacturing a chip arrangement, in...
- Patent number 9,362,193
- Issue date Jun 7, 2016
- Infineon Technologies AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Methods for Manufacturing a Semiconductor Package and a Semiconduct...
- Publication number 20240258213
- Publication date Aug 1, 2024
- Infineon Technologies Austria AG
- Sergey Yuferev
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Forming a Semiconductor Module
- Publication number 20240047431
- Publication date Feb 8, 2024
- Infineon Technologies Austria AG
- Angela Kessler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PROCESSING A SEMICONDUCTOR WAFER, SEMICONDUCTOR DIE, AND...
- Publication number 20230197663
- Publication date Jun 22, 2023
- Chuan Cheah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR SYSTEM HAVING AN INDUCTOR MODULE ATTACHED TO A...
- Publication number 20230127874
- Publication date Apr 27, 2023
- Petteri Palm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING A LEAD FRAME AND A CLIP FRAME
- Publication number 20230051100
- Publication date Feb 16, 2023
- INFINEON TECHNOLOGIES AG
- Bun Kian Tay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH CLIP HAVING THROUGH HOLE ACCOMMODATING COMPONENT-RELAT...
- Publication number 20220254696
- Publication date Aug 11, 2022
- INFINEON TECHNOLOGIES AG
- Angela KESSLER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING A SEMICONDUCTOR PACKAGE
- Publication number 20220230941
- Publication date Jul 21, 2022
- Markus Dinkel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20220093573
- Publication date Mar 24, 2022
- Infineon Technologies Austria AG
- Angela Kessler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package, Semiconductor Module and Methods for Manufac...
- Publication number 20220084915
- Publication date Mar 17, 2022
- Sergey Yuferev
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES INCLUDING PARALLEL ELECTRICALLY CONDUCTIVE LA...
- Publication number 20210287964
- Publication date Sep 16, 2021
- INFINEON TECHNOLOGIES AG
- Petteri PALM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING A LEAD FRAME AND A CLIP FRAME
- Publication number 20210166998
- Publication date Jun 3, 2021
- INFINEON TECHNOLOGIES AG
- Thorsten Scharf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF PRODUCING INDUCTOR MODULES AND POWER SEMICONDUCTOR SYSTE...
- Publication number 20210036610
- Publication date Feb 4, 2021
- Petteri Palm
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING A CAVITY IN ITS PACKAGE BODY
- Publication number 20210035876
- Publication date Feb 4, 2021
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Clip Frame Assembly, Semiconductor Package Having a Lead Frame and...
- Publication number 20200273790
- Publication date Aug 27, 2020
- Bun Kian Tay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Clip Frame Assembly, Semiconductor Package Having a Lead Frame and...
- Publication number 20200273781
- Publication date Aug 27, 2020
- Thorsten Scharf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of Manufacturing Inductor Modules and Power Semiconductor S...
- Publication number 20200212798
- Publication date Jul 2, 2020
- Petteri Palm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Producing an SMD Package with Top Side Cooling
- Publication number 20200144150
- Publication date May 7, 2020
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package and Method of Fabricating a Semiconductor Pac...
- Publication number 20200135619
- Publication date Apr 30, 2020
- Markus Dinkel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Manufacturing a Multi-Chip Semiconductor Power Device
- Publication number 20200083207
- Publication date Mar 12, 2020
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Leadframe, Semiconductor Package and Method
- Publication number 20200051898
- Publication date Feb 13, 2020
- Chau Fatt Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REINFORCEMENT FOR ELECTRICAL CONNECTORS
- Publication number 20190148332
- Publication date May 16, 2019
- Infineon Technologies Americas Corp.
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Systems Having Inductor Modules, and Methods of...
- Publication number 20190081562
- Publication date Mar 14, 2019
- Infineon Technologies Austria AG
- Petteri Palm
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
SMD Package with Top Side Cooling
- Publication number 20190080980
- Publication date Mar 14, 2019
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SMD Package
- Publication number 20180301398
- Publication date Oct 18, 2018
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Leadframe and method of manufacturing the same
- Publication number 20180158758
- Publication date Jun 7, 2018
- Infineon Technologies Austria AG
- Ralf OTREMBA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor Chip Package Having a Repeating Footprint Pattern
- Publication number 20180061745
- Publication date Mar 1, 2018
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Half Bridge Circuit, Method of Operating a Half Bridge Circuit and...
- Publication number 20170288654
- Publication date Oct 5, 2017
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Manufacturing a Multi-Chip Semiconductor Power Device
- Publication number 20170047315
- Publication date Feb 16, 2017
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Device Including a Logic Semiconductor Chip Having a Contact Electr...
- Publication number 20160315033
- Publication date Oct 27, 2016
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Component Having Inner and Outer Semiconductor Compon...
- Publication number 20160111346
- Publication date Apr 21, 2016
- Infineon Technologies Austria AG
- Josef Hoeglauer
- H01 - BASIC ELECTRIC ELEMENTS

Josef Hoeglauer

Person

Patents Grantslast 30 patents

Method of forming a semiconductor module

Package with clip having through hole accommodating component-relat...

Power semiconductor system having an inductor module attached to a...

Semiconductor package, semiconductor module and methods for manufac...

Semiconductor module

Method of fabricating a semiconductor package

Method of manufacturing a power semiconductor system

Clip frame assembly, semiconductor package having a lead frame and...

Semiconductor package and method of fabricating a semiconductor pac...

Clip frame assembly, semiconductor package having a lead frame and...

Method of producing an SMD package with top side cooling

Methods of manufacturing inductor modules and power semiconductor s...

SMD package with flat contacts to prevent bottleneck

Reinforcement for electrical connectors

Power semiconductor systems having inductor modules, and methods of...

SMD package with top side cooling

Half bridge circuit, method of operating a half bridge circuit and...

Semiconductor chip package having a repeating footprint pattern

Semiconductor component having inner and outer semiconductor compon...

Chip carrier structure, chip package and method of manufacturing th...

Transistor arrangement with semiconductor chips between two substrates

Lateral element isolation device

Semiconductor housing with rear-side structuring

Multi-chip semiconductor power device

Semiconductor packages having multiple lead frames and methods of f...

Chip package and method for manufacturing the same

Method for manufacturing a chip arrangement

Chip arrangement, a method for manufacturing a chip arrangement, in...

Electronic device

Chip arrangement, a method for manufacturing a chip arrangement, in...

Patents Applicationslast 30 patents

Methods for Manufacturing a Semiconductor Package and a Semiconduct...

Method of Forming a Semiconductor Module

METHOD OF PROCESSING A SEMICONDUCTOR WAFER, SEMICONDUCTOR DIE, AND...

POWER SEMICONDUCTOR SYSTEM HAVING AN INDUCTOR MODULE ATTACHED TO A...

SEMICONDUCTOR PACKAGE HAVING A LEAD FRAME AND A CLIP FRAME

PACKAGE WITH CLIP HAVING THROUGH HOLE ACCOMMODATING COMPONENT-RELAT...

METHOD OF FABRICATING A SEMICONDUCTOR PACKAGE

SEMICONDUCTOR MODULE

Semiconductor Package, Semiconductor Module and Methods for Manufac...

SEMICONDUCTOR DEVICES INCLUDING PARALLEL ELECTRICALLY CONDUCTIVE LA...

SEMICONDUCTOR PACKAGE HAVING A LEAD FRAME AND A CLIP FRAME

METHODS OF PRODUCING INDUCTOR MODULES AND POWER SEMICONDUCTOR SYSTE...

SEMICONDUCTOR PACKAGE INCLUDING A CAVITY IN ITS PACKAGE BODY

Clip Frame Assembly, Semiconductor Package Having a Lead Frame and...

Clip Frame Assembly, Semiconductor Package Having a Lead Frame and...

Methods of Manufacturing Inductor Modules and Power Semiconductor S...

Method of Producing an SMD Package with Top Side Cooling

Semiconductor Package and Method of Fabricating a Semiconductor Pac...

Method of Manufacturing a Multi-Chip Semiconductor Power Device

Leadframe, Semiconductor Package and Method

REINFORCEMENT FOR ELECTRICAL CONNECTORS

Power Semiconductor Systems Having Inductor Modules, and Methods of...

SMD Package with Top Side Cooling

SMD Package

Leadframe and method of manufacturing the same

Semiconductor Chip Package Having a Repeating Footprint Pattern

Half Bridge Circuit, Method of Operating a Half Bridge Circuit and...

Method of Manufacturing a Multi-Chip Semiconductor Power Device

Device Including a Logic Semiconductor Chip Having a Contact Electr...

Semiconductor Component Having Inner and Outer Semiconductor Compon...