Josef Hoglauer

Person

Munchen, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Connection structure and electronic component
- Patent number 10,109,609
- Issue date Oct 23, 2018
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip-embedded packages with backside die connection
- Patent number 9,437,516
- Issue date Sep 6, 2016
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Switched-mode power converter with split partitioning
- Patent number 9,312,760
- Issue date Apr 12, 2016
- Infineon Technologies Austria AG
- Christoph Sandner
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Semiconductor packaging arrangement
- Patent number 9,196,577
- Issue date Nov 24, 2015
- Infineon Technologies AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component, arrangement and method
- Patent number 9,196,554
- Issue date Nov 24, 2015
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die and package with source down and sensing configur...
- Patent number 9,123,701
- Issue date Sep 1, 2015
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with top-side insulation layer
- Patent number 9,099,391
- Issue date Aug 4, 2015
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-die package with separate inter-die interconnects
- Patent number 9,054,040
- Issue date Jun 9, 2015
- Infineon Technologies Austria AG
- Khalil Hosseini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-level semiconductor package
- Patent number 9,041,170
- Issue date May 26, 2015
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redistribution board, electronic component and module
- Patent number 8,975,735
- Issue date Mar 10, 2015
- Infineon Technologies AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with integrated coils
- Patent number 8,169,285
- Issue date May 1, 2012
- Infineon Technologies Austria AG
- Josef Höglauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit including inductive device and ferromagnetic mat...
- Patent number 8,149,080
- Issue date Apr 3, 2012
- Infineon Technologies AG
- Bernhard Knott
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method for testing a contact region of a semiconductor module
- Patent number 7,265,564
- Issue date Sep 4, 2007
- Infineon Technologies AG
- Ralf Otremba
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR CHIP, CHIP SYSTEM, METHOD OF FORMING A SEMICONDUCTOR...
- Publication number 20230230903
- Publication date Jul 20, 2023
- INFINEON TECHNOLOGIES AG
- Hooi Boon TEOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Devices Including a Premolded Leadframe and a Semicon...
- Publication number 20230197577
- Publication date Jun 22, 2023
- INFINEON TECHNOLOGIES AG
- Thorsten Scharf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CRYOSTAT SOCKET FOR HOLDING AN ION TRAP DEVICE MOUNTED ON A SUBSTRA...
- Publication number 20230168023
- Publication date Jun 1, 2023
- Infineon Technologies Austria AG
- Günther Lohmann
- F25 - REFRIGERATION OR COOLING COMBINED HEATING AND REFRIGERATION SYSTEMS HEA...
Information Patent Application
Connection Structure and Electronic Component
- Publication number 20150200178
- Publication date Jul 16, 2015
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip-Embedded Packages with Backside Die Connection
- Publication number 20150194362
- Publication date Jul 9, 2015
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Packaging Arrangement
- Publication number 20150194373
- Publication date Jul 9, 2015
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SWITCHED-MODE POWER CONVERTER WITH SPLIT PARTITIONING
- Publication number 20150171748
- Publication date Jun 18, 2015
- Infineon Technologies Austria AG
- Christoph Sandner
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
Electronic Component, Arrangement and Method
- Publication number 20150091176
- Publication date Apr 2, 2015
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Redistribution Board, Electronic Component and Module
- Publication number 20150041859
- Publication date Feb 12, 2015
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE AND PACKAGE WITH SOURCE DOWN AND SENSING CONFIGUR...
- Publication number 20150014858
- Publication date Jan 15, 2015
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Level Semiconductor Package
- Publication number 20140291849
- Publication date Oct 2, 2014
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package with Top-Side Insulation Layer
- Publication number 20140264944
- Publication date Sep 18, 2014
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Die Package with Separate Inter-Die Interconnects
- Publication number 20140240945
- Publication date Aug 28, 2014
- Infineon Technologies Austria AG
- Khalil Hosseini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT INCLUDING INDUCTIVE DEVICE AND FERROMAGNETIC MAT...
- Publication number 20090079529
- Publication date Mar 26, 2009
- Bernhard Knott
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for testing a contact region of a semiconductor module
- Publication number 20060066336
- Publication date Mar 30, 2006
- Ralf Otremba
- G01 - MEASURING TESTING

Josef Hoglauer

Person

Patents Grantslast 30 patents

Connection structure and electronic component

Chip-embedded packages with backside die connection

Switched-mode power converter with split partitioning

Semiconductor packaging arrangement

Electronic component, arrangement and method

Semiconductor die and package with source down and sensing configur...

Semiconductor package with top-side insulation layer

Multi-die package with separate inter-die interconnects

Multi-level semiconductor package

Redistribution board, electronic component and module

Semiconductor device with integrated coils

Integrated circuit including inductive device and ferromagnetic mat...

Method for testing a contact region of a semiconductor module

Patents Applicationslast 30 patents

SEMICONDUCTOR CHIP, CHIP SYSTEM, METHOD OF FORMING A SEMICONDUCTOR...

Semiconductor Devices Including a Premolded Leadframe and a Semicon...

CRYOSTAT SOCKET FOR HOLDING AN ION TRAP DEVICE MOUNTED ON A SUBSTRA...

Connection Structure and Electronic Component

Chip-Embedded Packages with Backside Die Connection

Semiconductor Packaging Arrangement

SWITCHED-MODE POWER CONVERTER WITH SPLIT PARTITIONING

Electronic Component, Arrangement and Method

Redistribution Board, Electronic Component and Module

SEMICONDUCTOR DIE AND PACKAGE WITH SOURCE DOWN AND SENSING CONFIGUR...

Multi-Level Semiconductor Package

Semiconductor Package with Top-Side Insulation Layer

Multi-Die Package with Separate Inter-Die Interconnects

INTEGRATED CIRCUIT INCLUDING INDUCTIVE DEVICE AND FERROMAGNETIC MAT...

Method for testing a contact region of a semiconductor module