Joseph Abel

Person

West Linn, OR, US

People

Patents Grantslast 30 patents

Information Patent Grant
In-situ PECVD cap layer
- Patent number 12,252,782
- Issue date Mar 18, 2025
- Lam Research Corporation
- Jeremy David Fields
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for providing doped silicon using a diffusion barrier layer
- Patent number 12,125,705
- Issue date Oct 22, 2024
- Lam Research Corporation
- Purushottam Kumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Oxidative conversion in atomic layer deposition processes
- Patent number 12,087,574
- Issue date Sep 10, 2024
- Lam Research Corporation
- Douglas Walter Agnew
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Dielectric gapfill using atomic layer deposition (ALD), inhibitor p...
- Patent number 12,049,699
- Issue date Jul 30, 2024
- Lam Research Corporation
- Joseph Abel
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Low-κ ALD gap-fill methods and material
- Patent number 12,020,923
- Issue date Jun 25, 2024
- Lam Research Corporation
- Joseph R. Abel
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of improving deposition induced CD imbalance using spatially...
- Patent number 11,651,963
- Issue date May 16, 2023
- Lam Research Corporation
- Ishtak Karim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface modified depth controlled deposition for plasma based depos...
- Patent number 11,373,862
- Issue date Jun 28, 2022
- Lam Research Corporation
- Joseph Abel
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Dielectric gapfill using atomic layer deposition (ALD), inhibitor p...
- Patent number 11,293,098
- Issue date Apr 5, 2022
- Lam Research Corporation
- Joseph Abel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of improving deposition induced CD imbalance using spatially...
- Patent number 10,978,302
- Issue date Apr 13, 2021
- Lam Research Corporation
- Ishtak Karim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface modified depth controlled deposition for plasma based depos...
- Patent number 10,727,046
- Issue date Jul 28, 2020
- Lam Research Corporation
- Joseph Abel
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Dielectric gapfill of high aspect ratio features utilizing a sacrif...
- Patent number 10,658,172
- Issue date May 19, 2020
- Lam Research Corporation
- Joseph R. Abel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method monitoring chamber drift
- Patent number 10,636,686
- Issue date Apr 28, 2020
- Lam Research Corporation
- Joseph Abel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric gapfill of high aspect ratio features utilizing a sacrif...
- Patent number 10,269,559
- Issue date Apr 23, 2019
- Lam Research Corporation
- Joseph Abel
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD TO SMOOTH SIDEWALL ROUGHNESS AND MAINTAIN REENTRANT STRUCTUR...
- Publication number 20250054752
- Publication date Feb 13, 2025
- LAM RESEARCH CORPORATION
- Dustin Zachary Austin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR PROVIDING DOPED SILICON USING A DIFFUSION BARRIER LAYER
- Publication number 20250046613
- Publication date Feb 6, 2025
- LAM RESEARCH CORPORATION
- Purushottam KUMAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW-K ALD GAP-FILL METHODS AND MATERIAL
- Publication number 20240347337
- Publication date Oct 17, 2024
- LAM RESEARCH CORPORATION
- Joseph R. Abel
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PLASMA ENHANCED ATOMIC LAYER DEPOSITION OF SILICON-CONTAINING FILMS
- Publication number 20240327973
- Publication date Oct 3, 2024
- LAM RESEARCH CORPORATION
- Ravi KUMAR
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
APPARATUSES FOR UNIFORM FLUID DELIVERY IN A MULTI-STATION SEMICONDU...
- Publication number 20240222151
- Publication date Jul 4, 2024
- LAM RESEARCH CORPORATION
- Eli Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IN-SITU FILM ANNEALING IN SUBSTRATE PROCESSING
- Publication number 20240167153
- Publication date May 23, 2024
- LAM RESEARCH CORPORATION
- Awnish Gupta
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
IMPURITY REDUCTION IN SILICON-CONTAINING FILMS
- Publication number 20230317449
- Publication date Oct 5, 2023
- LAM RESEARCH CORPORATION
- Awnish Gupta
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
REDUCING INTRALEVEL CAPACITANCE IN SEMICONDUCTOR DEVICES
- Publication number 20230307290
- Publication date Sep 28, 2023
- LAM RESEARCH CORPORATION
- Joseph R. ABEL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONFORMAL THERMAL CVD WITH CONTROLLED FILM PROPERTIES AND HIGH DEPO...
- Publication number 20230245896
- Publication date Aug 3, 2023
- LAM RESEARCH CORPORATION
- Awnish Gupta
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEAM MITIGATION AND INTEGRATED LINER FOR GAP FILL
- Publication number 20230175117
- Publication date Jun 8, 2023
- LAM RESEARCH CORPORATION
- Dustin Zachary AUSTIN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
LOSS PREVENTION DURING ATOMIC LAYER DEPOSITION
- Publication number 20230154754
- Publication date May 18, 2023
- LAM RESEARCH CORPORATION
- Jason Alexander VARNELL
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
NON-PLASMA ENHANCED DEPOSITION FOR RECESS ETCH MATCHING
- Publication number 20230087976
- Publication date Mar 23, 2023
- LAM RESEARCH CORPORATION
- Ian John Curtin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IN-SITU PECVD CAP LAYER
- Publication number 20230002887
- Publication date Jan 5, 2023
- LAM RESEARCH CORPORATION
- Jeremy David FIELDS
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHODS TO ENABLE SEAMLESS HIGH QUALITY GAPFILL
- Publication number 20220384186
- Publication date Dec 1, 2022
- LAM RESEARCH CORPORATION
- Douglas Walter Agnew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GAS FEED SYSTEM FOR SURFACE MODIFIED DEPTH CONTROLLED DEPOSITION FO...
- Publication number 20220301866
- Publication date Sep 22, 2022
- LAM RESEARCH CORPORATION
- Joseph Abel
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
DYNAMIC PROCESS CONTROL IN SEMICONDUCTOR MANUFACTURING
- Publication number 20220293442
- Publication date Sep 15, 2022
- LAM RESEARCH CORPORATION
- Purushottam Kumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IN-SITU CONTROL OF FILM PROPERTIES DURING ATOMIC LAYER DEPOSITION
- Publication number 20220238325
- Publication date Jul 28, 2022
- LAM RESEARCH CORPORATION
- Douglas Walter Agnew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIELECTRIC GAPFILL USING ATOMIC LAYER DEPOSITION (ALD), INHIBITOR P...
- Publication number 20220205096
- Publication date Jun 30, 2022
- LAM RESEARCH CORPORATION
- Joseph ABEL
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR PROVIDING DOPED SILICON
- Publication number 20220165563
- Publication date May 26, 2022
- LAM RESEARCH CORPORATION
- Purushottam KUMAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW-K ALD GAP-FILL METHODS AND MATERIAL
- Publication number 20220037146
- Publication date Feb 3, 2022
- LAM RESEARCH CORPORATION
- Joseph R. Abel
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD ANDD APPARATUS FOR ATOMIC LAYER DEPOSITION OR CHEMICAL VAPOR...
- Publication number 20210398780
- Publication date Dec 23, 2021
- LAM RESEARCH CORPORATION
- Adrien LAVOIE
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
MODIFYING HYDROPHOBICITY OF A WAFER SURFACE USING AN ORGANOSILICON...
- Publication number 20210384029
- Publication date Dec 9, 2021
- LAM RESEARCH CORPORATION
- Jeremy D. Fields
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OXIDATIVE CONVERSION IN ATOMIC LAYER DEPOSITION PROCESSES
- Publication number 20210272801
- Publication date Sep 2, 2021
- LAM RESEARCH CORPORATION
- Douglas Walter Agnew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF IMPROVING DEPOSITION INDUCED CD IMBALANCE USING SPATIALLY...
- Publication number 20210202250
- Publication date Jul 1, 2021
- LAM RESEARCH CORPORATION
- Ishtak KARIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SURFACE MODIFIED DEPTH CONTROLLED DEPOSITION FOR PLASMA BASED DEPOS...
- Publication number 20200357636
- Publication date Nov 12, 2020
- LAM RESEARCH CORPORATION
- Joseph Abel
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
DIELECTRIC GAPFILL USING ATOMIC LAYER DEPOSITION (ALD), INHIBITOR P...
- Publication number 20200017967
- Publication date Jan 16, 2020
- LAM RESEARCH CORPORATION
- Joseph ABEL
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SURFACE MODIFIED DEPTH CONTROLLED DEPOSITION FOR PLASMA BASED DEPOS...
- Publication number 20200013616
- Publication date Jan 9, 2020
- LAM RESEARCH CORPORATION
- Joseph Abel
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD MONITORING CHAMBER DRIFT
- Publication number 20190267268
- Publication date Aug 29, 2019
- LAM RESEARCH CORPORATION
- Joseph ABEL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIELECTRIC GAPFILL OF HIGH ASPECT RATIO FEATURES UTILIZING A SACRIF...
- Publication number 20190206677
- Publication date Jul 4, 2019
- LAM RESEARCH CORPORATION
- Joseph R. Abel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF IMPROVING DEPOSITION INDUCED CD IMBALANCE USING SPATIALLY...
- Publication number 20190164757
- Publication date May 30, 2019
- LAM RESEARCH CORPORATION
- Ishtak KARIM
- H01 - BASIC ELECTRIC ELEMENTS

Joseph Abel

Person

Patents Grantslast 30 patents

In-situ PECVD cap layer

Method for providing doped silicon using a diffusion barrier layer

Oxidative conversion in atomic layer deposition processes

Dielectric gapfill using atomic layer deposition (ALD), inhibitor p...

Low-κ ALD gap-fill methods and material

Method of improving deposition induced CD imbalance using spatially...

Surface modified depth controlled deposition for plasma based depos...

Dielectric gapfill using atomic layer deposition (ALD), inhibitor p...

Method of improving deposition induced CD imbalance using spatially...

Surface modified depth controlled deposition for plasma based depos...

Dielectric gapfill of high aspect ratio features utilizing a sacrif...

Method monitoring chamber drift

Dielectric gapfill of high aspect ratio features utilizing a sacrif...

Patents Applicationslast 30 patents

METHOD TO SMOOTH SIDEWALL ROUGHNESS AND MAINTAIN REENTRANT STRUCTUR...

METHOD FOR PROVIDING DOPED SILICON USING A DIFFUSION BARRIER LAYER

LOW-K ALD GAP-FILL METHODS AND MATERIAL

PLASMA ENHANCED ATOMIC LAYER DEPOSITION OF SILICON-CONTAINING FILMS

APPARATUSES FOR UNIFORM FLUID DELIVERY IN A MULTI-STATION SEMICONDU...

IN-SITU FILM ANNEALING IN SUBSTRATE PROCESSING

IMPURITY REDUCTION IN SILICON-CONTAINING FILMS

REDUCING INTRALEVEL CAPACITANCE IN SEMICONDUCTOR DEVICES

CONFORMAL THERMAL CVD WITH CONTROLLED FILM PROPERTIES AND HIGH DEPO...

SEAM MITIGATION AND INTEGRATED LINER FOR GAP FILL

LOSS PREVENTION DURING ATOMIC LAYER DEPOSITION

NON-PLASMA ENHANCED DEPOSITION FOR RECESS ETCH MATCHING

IN-SITU PECVD CAP LAYER

METHODS TO ENABLE SEAMLESS HIGH QUALITY GAPFILL

GAS FEED SYSTEM FOR SURFACE MODIFIED DEPTH CONTROLLED DEPOSITION FO...

DYNAMIC PROCESS CONTROL IN SEMICONDUCTOR MANUFACTURING

IN-SITU CONTROL OF FILM PROPERTIES DURING ATOMIC LAYER DEPOSITION

DIELECTRIC GAPFILL USING ATOMIC LAYER DEPOSITION (ALD), INHIBITOR P...

METHOD FOR PROVIDING DOPED SILICON

LOW-K ALD GAP-FILL METHODS AND MATERIAL

METHOD ANDD APPARATUS FOR ATOMIC LAYER DEPOSITION OR CHEMICAL VAPOR...

MODIFYING HYDROPHOBICITY OF A WAFER SURFACE USING AN ORGANOSILICON...

OXIDATIVE CONVERSION IN ATOMIC LAYER DEPOSITION PROCESSES

METHOD OF IMPROVING DEPOSITION INDUCED CD IMBALANCE USING SPATIALLY...

SURFACE MODIFIED DEPTH CONTROLLED DEPOSITION FOR PLASMA BASED DEPOS...

DIELECTRIC GAPFILL USING ATOMIC LAYER DEPOSITION (ALD), INHIBITOR P...

SURFACE MODIFIED DEPTH CONTROLLED DEPOSITION FOR PLASMA BASED DEPOS...

METHOD MONITORING CHAMBER DRIFT

DIELECTRIC GAPFILL OF HIGH ASPECT RATIO FEATURES UTILIZING A SACRIF...

METHOD OF IMPROVING DEPOSITION INDUCED CD IMBALANCE USING SPATIALLY...