Joseph B. Petrini

Person

Gilbert, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Thermal interface structures for integrated circuit packages
- Patent number 11,869,824
- Issue date Jan 9, 2024
- Intel Corporation
- Kyle J. Arrington
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liquid metal thermal interface material application
- Patent number 11,679,407
- Issue date Jun 20, 2023
- Intel Corporation
- Kyle Jordan Arrington
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Apparatuses, methods, and systems for thermomechanical protection o...
- Patent number 11,609,614
- Issue date Mar 21, 2023
- Intel Corporation
- Ali Moradi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Liquid metal TIM with STIM-like performance with no BSM and BGA com...
- Patent number 11,551,994
- Issue date Jan 10, 2023
- Intel Corporation
- Kelly Lofgreen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conformable heat sink interface with a high thermal conductivity
- Patent number 11,464,139
- Issue date Oct 4, 2022
- Intel Corporation
- Kelly Lofgreen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for inspection of a package assembly with a thermal solution
- Patent number 10,600,699
- Issue date Mar 24, 2020
- Intel Corporation
- Aastha Uppal
- G01 - MEASURING TESTING
Information Patent Grant
Torque controlled driver apparatus and method
- Patent number 10,576,590
- Issue date Mar 3, 2020
- Intel Corporation
- Batsegaw K. Gebrehiwot
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High performance transient uniform cooling solution for thermal com...
- Patent number 9,943,931
- Issue date Apr 17, 2018
- Intel Corporation
- Zhihua Li
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermal compression bonding process cooling manifold
- Patent number 9,748,199
- Issue date Aug 29, 2017
- Intel Corporation
- Hemanth Dhavaleswarapu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High performance transient uniform cooling solution for thermal com...
- Patent number 9,434,029
- Issue date Sep 6, 2016
- Intel Corporation
- Zhihua Li
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermal compression bonding process cooling manifold
- Patent number 9,282,650
- Issue date Mar 8, 2016
- Intel Corporation
- Hemanth Dhavaleswarapu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHODS AND APPARATUS FOR MULTI-ZONE TEMPERATURE CONTROL OF JET IMP...
- Publication number 20250079262
- Publication date Mar 6, 2025
- Intel Corporation
- Sami Mohammed Alelyani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS TO IMPROVE THERMAL DISSIPATION AND MECHANICAL...
- Publication number 20250014967
- Publication date Jan 9, 2025
- Intel Corporation
- Kyle Jordan Arrington
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPLIANT INSERTS FOR PIN DIPPING PROCESSES
- Publication number 20250006691
- Publication date Jan 2, 2025
- Intel Corporation
- George Robinson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENHANCED JET IMPINGEMENT LEAK PREVENTION FOR INTEGRATED CIRCUIT
- Publication number 20240175917
- Publication date May 30, 2024
- Intel Corporation
- Ruben NUNEZ BLANCO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUSES, METHODS, AND SYSTEMS FOR THERMO-MECHANICAL PROTECTION...
- Publication number 20210389805
- Publication date Dec 16, 2021
- Intel Corporation
- Ali MORADI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
THERMAL INTERFACE STRUCTURES FOR INTEGRATED CIRCUIT PACKAGES
- Publication number 20210134698
- Publication date May 6, 2021
- Intel Corporation
- Kyle J. Arrington
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID METAL THERMAL INTERFACE MATERIAL APPLICATION
- Publication number 20210101175
- Publication date Apr 8, 2021
- Kyle Jordan Arrington
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
CONFORMABLE HEAT SINK INTERFACE WITH A HIGH THERMAL CONDUCTIVITY
- Publication number 20200146183
- Publication date May 7, 2020
- Intel Corporation
- Kelly Lofgreen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIQUID METAL TIM WITH STIM-LIKE PERFORMANCE WITH NO BSM AND BGA COM...
- Publication number 20200098661
- Publication date Mar 26, 2020
- Intel Corporation
- Kelly LOFGREEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR INSPECTION OF A PACKAGE ASSEMBLY WITH A THERMAL SOLUTION
- Publication number 20190067135
- Publication date Feb 28, 2019
- Intel Corporation
- Aastha Uppal
- G01 - MEASURING TESTING
Information Patent Application
TORQUE CONTROLLED DRIVER APPARATUS AND METHOD
- Publication number 20180141173
- Publication date May 24, 2018
- Intel Corporation
- Betsegaw K. Gebrehiwot
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH PERFORMANCE TRANSIENT UNIFORM COOLING SOLUTION FOR THERMAL COM...
- Publication number 20170014957
- Publication date Jan 19, 2017
- Intel Corporation
- Zhihua Li
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMAL COMPRESSION BONDING PROCESS COOLING MANIFOLD
- Publication number 20160211238
- Publication date Jul 21, 2016
- Intel Corporation
- Hemanth Dhavaleswarapu
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Application
THERMAL COMPRESSION BONDING PROCESS COOLING MANIFOLD
- Publication number 20150173209
- Publication date Jun 18, 2015
- Hemanth Dhavaleswarapu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH PERFORMANCE TRANSIENT UNIFORM COOLING SOLUTION FOR THERMAL COM...
- Publication number 20130299133
- Publication date Nov 14, 2013
- Zhihua Li
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Joseph B. Petrini

Person

Patents Grantslast 30 patents

Thermal interface structures for integrated circuit packages

Liquid metal thermal interface material application

Apparatuses, methods, and systems for thermomechanical protection o...

Liquid metal TIM with STIM-like performance with no BSM and BGA com...

Conformable heat sink interface with a high thermal conductivity

Apparatus for inspection of a package assembly with a thermal solution

Torque controlled driver apparatus and method

High performance transient uniform cooling solution for thermal com...

Thermal compression bonding process cooling manifold

High performance transient uniform cooling solution for thermal com...

Thermal compression bonding process cooling manifold

Patents Applicationslast 30 patents

METHODS AND APPARATUS FOR MULTI-ZONE TEMPERATURE CONTROL OF JET IMP...

METHODS AND APPARATUS TO IMPROVE THERMAL DISSIPATION AND MECHANICAL...

COMPLIANT INSERTS FOR PIN DIPPING PROCESSES

ENHANCED JET IMPINGEMENT LEAK PREVENTION FOR INTEGRATED CIRCUIT

APPARATUSES, METHODS, AND SYSTEMS FOR THERMO-MECHANICAL PROTECTION...

THERMAL INTERFACE STRUCTURES FOR INTEGRATED CIRCUIT PACKAGES

LIQUID METAL THERMAL INTERFACE MATERIAL APPLICATION

CONFORMABLE HEAT SINK INTERFACE WITH A HIGH THERMAL CONDUCTIVITY

LIQUID METAL TIM WITH STIM-LIKE PERFORMANCE WITH NO BSM AND BGA COM...

APPARATUS FOR INSPECTION OF A PACKAGE ASSEMBLY WITH A THERMAL SOLUTION

TORQUE CONTROLLED DRIVER APPARATUS AND METHOD

HIGH PERFORMANCE TRANSIENT UNIFORM COOLING SOLUTION FOR THERMAL COM...

THERMAL COMPRESSION BONDING PROCESS COOLING MANIFOLD

THERMAL COMPRESSION BONDING PROCESS COOLING MANIFOLD

HIGH PERFORMANCE TRANSIENT UNIFORM COOLING SOLUTION FOR THERMAL COM...