Joseph C. Barrett

Person

El Dorado, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Plastic ball grid array assembly
- Patent number 6,867,506
- Issue date Mar 15, 2005
- Intel Corporation
- Joseph C. Barrett
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plastic ball grid array assembly
- Patent number 6,605,492
- Issue date Aug 12, 2003
- Intel Corporation
- Joseph C. Barrett
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for creating printed circuit board substrates having solder...
- Patent number 6,564,452
- Issue date May 20, 2003
- Intel Corporation
- Joseph C. Barrett
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Underside heat slug for ball grid array packages
- Patent number 6,545,351
- Issue date Apr 8, 2003
- Intel Corporation
- Mark P. Jamieson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Plastic ball grid array package with improved moisture resistance
- Patent number 6,404,067
- Issue date Jun 11, 2002
- Intel Corporation
- Kuljeet Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board substrate having solder mask-free edges
- Patent number 6,310,298
- Issue date Oct 30, 2001
- Intel Corporation
- Joseph C. Barrett
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plastic ball grid array assembly
- Patent number 6,064,117
- Issue date May 16, 2000
- Intel Corporation
- Joseph C. Barrett
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Underside heat slug for ball grid array packages
- Patent number 6,060,777
- Issue date May 9, 2000
- Intel Corporation
- Mark P. Jamieson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for dissipating heat from a conductive layer in a circuit...
- Patent number 5,933,324
- Issue date Aug 3, 1999
- Intel Corporation
- Joseph C. Barrett
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method and apparatus for stacking multiple die in a flip chip semic...
- Publication number 20030183934
- Publication date Oct 2, 2003
- Joseph C. Barrett
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Plastic ball grid array assembly
- Publication number 20020048845
- Publication date Apr 25, 2002
- Joseph C. Barrett
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
A method for creating printed circuit board substrates having solde...
- Publication number 20020045294
- Publication date Apr 18, 2002
- Joseph C. Barrett
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Plastic ball grid array assembly
- Publication number 20020001874
- Publication date Jan 3, 2002
- Joseph C. Barrett
- H01 - BASIC ELECTRIC ELEMENTS

Joseph C. Barrett

Person

Patents Grantslast 30 patents

Plastic ball grid array assembly

Plastic ball grid array assembly

Method for creating printed circuit board substrates having solder...

Underside heat slug for ball grid array packages

Plastic ball grid array package with improved moisture resistance

Printed circuit board substrate having solder mask-free edges

Plastic ball grid array assembly

Underside heat slug for ball grid array packages

Apparatus for dissipating heat from a conductive layer in a circuit...

Patents Applicationslast 30 patents

Method and apparatus for stacking multiple die in a flip chip semic...

Plastic ball grid array assembly

A method for creating printed circuit board substrates having solde...

Plastic ball grid array assembly