Joseph D. Dutson

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Hyde Park, UT, US

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Patents Grantslast 30 patents

Information Patent Grant
Method and apparatus for supporting a circuit component having sold...
- Patent number 7,434,309
- Issue date Oct 14, 2008
- Hewlett-Packard Development Company, L.P.
- Jeffrey L. Deeney
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Pin shroud
- Patent number 7,273,386
- Issue date Sep 25, 2007
- Hewlett-Packard Development Company, L.P.
- Richard E. Olson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wrap-around cooling arrangement for printed circuit board
- Patent number 6,882,536
- Issue date Apr 19, 2005
- Hewlett-Packard Development Company, L.P.
- Jeffrey L. Deeney
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Support assembly for an integrated circuit package having solder co...
- Patent number 6,791,184
- Issue date Sep 14, 2004
- Hewlett-Packard Development Company, L.P.
- Jeffrey L Deeney
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for supporting a circuit component having sold...
- Patent number 6,710,264
- Issue date Mar 23, 2004
- Hewlett-Packard Development Company, L.P.
- Jeffrey L. Deeney
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Pin Shroud
- Publication number 20060025005
- Publication date Feb 2, 2006
- Richard E. Olson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for supporting a circuit component having sold...
- Publication number 20040035606
- Publication date Feb 26, 2004
- Jeffrey L. Deeney
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Support assembly for an integrated circuit package having solder co...
- Publication number 20040017006
- Publication date Jan 29, 2004
- Jeffrey L. Deeney
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Wrap- around cooling arrangement for printed circuit board
- Publication number 20030202328
- Publication date Oct 30, 2003
- Jeffrey L. Deeney
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and apparatus for supporting a circuit component having sold...
- Publication number 20030094306
- Publication date May 22, 2003
- Jeffrey L. Deeney
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR