Joseph David Greco

Person

San Jose, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Extended through wafer vias for power delivery in face-to-face dies
- Patent number 11,973,060
- Issue date Apr 30, 2024
- NVIDIA Corporation
- Joseph Greco
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Face-to-face dies with probe pads for pre-assembly testing
- Patent number 11,699,662
- Issue date Jul 11, 2023
- NVIDIA Corporation
- Joseph Greco
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Face-to-face dies with a void for enhanced inductor performance
- Patent number 11,616,023
- Issue date Mar 28, 2023
- NVIDIA Corporation
- Joseph Greco
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Face-to-face dies with enhanced power delivery using extended TSVS
- Patent number 11,127,719
- Issue date Sep 21, 2021
- NVIDIA Corporation
- Joseph Greco
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System with a high power chip and a low power chip having low inter...
- Patent number 9,728,481
- Issue date Aug 8, 2017
- NVIDIA Corporation
- Abraham F. Yee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dynamic yield prediction
- Patent number 9,470,743
- Issue date Oct 18, 2016
- NVIDIA Corporation
- Nicholas Callegari
- G01 - MEASURING TESTING
Information Patent Grant
Apparatus, system, and method for graphics memory hub
- Patent number 8,194,085
- Issue date Jun 5, 2012
- NVIDIA Corporation
- Joseph David Greco
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Method of fabricating a pad over active circuit I.C. with frame sup...
- Patent number 8,017,520
- Issue date Sep 13, 2011
- NVIDIA Corporation
- Inderjit Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pad over active circuit system and method with meshed support struc...
- Patent number 7,791,193
- Issue date Sep 7, 2010
- NVIDIA Corporation
- Inderjit Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pad over active circuit system and method with frame support structure
- Patent number 7,649,269
- Issue date Jan 19, 2010
- NVIDIA Corporation
- Inderjit Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pad over active circuit system and method with frame support structure
- Patent number 7,495,343
- Issue date Feb 24, 2009
- NVIDIA Corporation
- Inderjit Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus, system, and method for graphics memory hub
- Patent number 7,477,257
- Issue date Jan 13, 2009
- NVIDIA Corporation
- Joseph David Greco
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Pad over active circuit system and method with meshed support struc...
- Patent number 7,453,158
- Issue date Nov 18, 2008
- NVIDIA Corporation
- Inderjit Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a pad over active circuit I.C. with meshed su...
- Patent number 7,429,528
- Issue date Sep 30, 2008
- NVIDIA Corporation
- Inderjit Singh
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FACE-TO-FACE DIES WITH A VOID FOR ENHANCED INDUCTOR PERFORMANCE
- Publication number 20230230925
- Publication date Jul 20, 2023
- NVIDIA Corporation
- Joseph Greco
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EXTENDED THROUGH WAFER VIAS FOR POWER DELIVERY IN FACE-TO-FACE DIES
- Publication number 20210384168
- Publication date Dec 9, 2021
- NVIDIA Corporation
- Joseph Greco
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FACE-TO-FACE DIES WITH A VOID FOR ENHANCED INDUCTOR PERFORMANCE
- Publication number 20210233849
- Publication date Jul 29, 2021
- NVIDIA Corporation
- Joseph Greco
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FACE-TO-FACE DIES WITH PROBE PADS FOR PRE-ASSEMBLY TESTING
- Publication number 20210233850
- Publication date Jul 29, 2021
- NVIDIA Corporation
- Joseph Greco
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FACE-TO-FACE DIES WITH ENHANCED POWER DELIVERY USING EXTENDED TSVS
- Publication number 20210233893
- Publication date Jul 29, 2021
- Joseph Greco
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DYNAMIC YIELD PREDICTION
- Publication number 20150253373
- Publication date Sep 10, 2015
- NVIDIA Corporation
- Nicholas CALLEGARI
- G01 - MEASURING TESTING
Information Patent Application
SYSTEM WITH A HIGH POWER CHIP AND A LOW POWER CHIP HAVING LOW INTER...
- Publication number 20130058067
- Publication date Mar 7, 2013
- Abraham F. YEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus, System, and Method For Graphics Memory Hub
- Publication number 20090079748
- Publication date Mar 26, 2009
- NVIDIA Corporation
- Joseph David Greco
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PAD OVER ACTIVE CIRCUIT SYSTEM AND METHOD WITH MESHED SUPPORT STRUC...
- Publication number 20080067687
- Publication date Mar 20, 2008
- NVIDIA CORPORATION
- Inderjit Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PAD OVER ACTIVE CIRCUIT SYSTEM AND METHOD WITH FRAME SUPPORT STRUCTURE
- Publication number 20080062623
- Publication date Mar 13, 2008
- NVIDIA CORPORATION
- Inderjit Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus, system, and method for graphics memory hub
- Publication number 20070139426
- Publication date Jun 21, 2007
- Joseph David Greco
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Method of fabricating a pad over active circuit I.C. with meshed su...
- Publication number 20050164484
- Publication date Jul 28, 2005
- NVIDIA CORPORATION
- Inderjit Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of fabricating a pad over active circuit I.C. with frame sup...
- Publication number 20050146012
- Publication date Jul 7, 2005
- NVIDIA CORPORATION
- Inderjit Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Pad over active circuit system and method with meshed support struc...
- Publication number 20050023700
- Publication date Feb 3, 2005
- NVIDIA CORPORATION
- Inderjit Singh
- H01 - BASIC ELECTRIC ELEMENTS

Joseph David Greco

Person

Patents Grantslast 30 patents

Extended through wafer vias for power delivery in face-to-face dies

Face-to-face dies with probe pads for pre-assembly testing

Face-to-face dies with a void for enhanced inductor performance

Face-to-face dies with enhanced power delivery using extended TSVS

System with a high power chip and a low power chip having low inter...

Dynamic yield prediction

Apparatus, system, and method for graphics memory hub

Method of fabricating a pad over active circuit I.C. with frame sup...

Pad over active circuit system and method with meshed support struc...

Pad over active circuit system and method with frame support structure

Pad over active circuit system and method with frame support structure

Apparatus, system, and method for graphics memory hub

Pad over active circuit system and method with meshed support struc...

Method of fabricating a pad over active circuit I.C. with meshed su...

Patents Applicationslast 30 patents

FACE-TO-FACE DIES WITH A VOID FOR ENHANCED INDUCTOR PERFORMANCE

EXTENDED THROUGH WAFER VIAS FOR POWER DELIVERY IN FACE-TO-FACE DIES

FACE-TO-FACE DIES WITH A VOID FOR ENHANCED INDUCTOR PERFORMANCE

FACE-TO-FACE DIES WITH PROBE PADS FOR PRE-ASSEMBLY TESTING

FACE-TO-FACE DIES WITH ENHANCED POWER DELIVERY USING EXTENDED TSVS

DYNAMIC YIELD PREDICTION

SYSTEM WITH A HIGH POWER CHIP AND A LOW POWER CHIP HAVING LOW INTER...

Apparatus, System, and Method For Graphics Memory Hub

PAD OVER ACTIVE CIRCUIT SYSTEM AND METHOD WITH MESHED SUPPORT STRUC...

PAD OVER ACTIVE CIRCUIT SYSTEM AND METHOD WITH FRAME SUPPORT STRUCTURE

Apparatus, system, and method for graphics memory hub

Method of fabricating a pad over active circuit I.C. with meshed su...

Method of fabricating a pad over active circuit I.C. with frame sup...

Pad over active circuit system and method with meshed support struc...