Joseph F. Maniscalco

Person

Lake Katrine, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Replacement bottom electrode structure for MRAM devices
- Patent number 12,167,700
- Issue date Dec 10, 2024
- International Business Machines Corporation
- Oscar van der Straten
Information Patent Grant
Multi-diameter magnetic random-access memory pillar structure
- Patent number 12,108,685
- Issue date Oct 1, 2024
- International Business Machines Corporation
- Oscar van der Straten
Information Patent Grant
Encapsulated top via interconnects
- Patent number 12,040,230
- Issue date Jul 16, 2024
- International Business Machines Corporation
- Oscar van der Straten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magneto-resistive random access memory with laterally-recessed free...
- Patent number 11,758,819
- Issue date Sep 12, 2023
- International Business Machines Corporation
- Oscar van der Straten
- G11 - INFORMATION STORAGE
Information Patent Grant
Dual damascene crossbar array for disabling a defective resistive s...
- Patent number 11,682,471
- Issue date Jun 20, 2023
- International Business Machines Corporation
- Joseph F. Maniscalco
- G11 - INFORMATION STORAGE
Information Patent Grant
Dual damascene with short liner
- Patent number 11,664,271
- Issue date May 30, 2023
- International Business Machines Corporation
- Koichi Motoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnects having air gap spacers
- Patent number 11,430,690
- Issue date Aug 30, 2022
- International Business Machines Corporation
- Kenneth Chun Kuen Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pillar bump with noble metal seed layer for advanced heterogeneous...
- Patent number 11,380,641
- Issue date Jul 5, 2022
- International Business Machines Corporation
- Joseph F. Maniscalco
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fully-aligned top-via structures with top-via trim
- Patent number 11,282,768
- Issue date Mar 22, 2022
- International Business Machines Corporation
- Kenneth C. K. Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnects with enlarged contact area
- Patent number 11,183,455
- Issue date Nov 23, 2021
- International Business Machines Corporation
- Koichi Motoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulated top via interconnects
- Patent number 11,177,171
- Issue date Nov 16, 2021
- International Business Machines Corporation
- Oscar van der Straten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures with cobalt-infused ruthenium liner and a c...
- Patent number 11,158,538
- Issue date Oct 26, 2021
- International Business Machines Corporation
- Joseph F. Maniscalco
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid sidewall barrier facilitating low resistance interconnection
- Patent number 11,069,566
- Issue date Jul 20, 2021
- International Business Machines Corporation
- Oscar van der Straten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnects having air gap spacers
- Patent number 10,950,493
- Issue date Mar 16, 2021
- International Business Machines Corporation
- Kenneth Chun Kuen Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Advanced interconnects containing an IMT liner
- Patent number 10,930,589
- Issue date Feb 23, 2021
- International Business Machines Corporation
- Joseph F. Maniscalco
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Void-free metallic interconnect structures with self-formed diffusi...
- Patent number 10,903,116
- Issue date Jan 26, 2021
- International Business Machines Corporation
- Joseph F. Maniscalco
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low resistance metal-insulator-metal capacitor electrode
- Patent number 10,840,325
- Issue date Nov 17, 2020
- International Business Machines Corporation
- Joseph F. Maniscalco
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Back end of line metallization structures
- Patent number 10,741,748
- Issue date Aug 11, 2020
- International Business Machines Corporation
- Joseph F. Maniscalco
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Back end of line metallization structures
- Patent number 10,686,126
- Issue date Jun 16, 2020
- International Business Machiness Corporation
- Joseph F. Maniscalco
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low resistance interconnect structure with partial seed enhancement...
- Patent number 10,546,815
- Issue date Jan 28, 2020
- International Business Machines Corporation
- Oscar van der Straten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Void-free metallic interconnect structures with self-formed diffusi...
- Patent number 10,529,622
- Issue date Jan 7, 2020
- International Business Machines Corporation
- Joseph F. Maniscalco
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Advanced interconnects containing an IMT liner
- Patent number 10,468,346
- Issue date Nov 5, 2019
- International Business Machines Corporation
- Joseph F. Maniscalco
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low resistance seed enhancement spacers for voidless interconnect s...
- Patent number 10,431,542
- Issue date Oct 1, 2019
- International Business Machines Corporation
- Praneet Adusumilli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low resistance seed enhancement spacers for voidless interconnect s...
- Patent number 10,049,980
- Issue date Aug 14, 2018
- International Business Machines Corporation
- Praneet Adusumilli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photoresist compositions with cyclic olefin polymers and hydrophobi...
- Patent number 6,562,554
- Issue date May 13, 2003
- International Business Machines Corporation
- Pushkara Rao Varanasi
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Photoresist compositions with cyclic olefin polymers and hydrophobi...
- Patent number 6,124,074
- Issue date Sep 26, 2000
- International Business Machines Corporation
- Pushkara Rao Varanasi
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Semiconductor package having etched-back silver-copper braze
- Patent number 5,896,869
- Issue date Apr 27, 1999
- International Business Machines Corporation
- Joseph Francis Maniscalco
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
MAGNETO-RESISTIVE RANDOM ACCESS MEMORY WITH LATERALLY-RECESSED FREE...
- Publication number 20230371394
- Publication date Nov 16, 2023
- International Business Machines Corporation
- Oscar van der Straten
- G11 - INFORMATION STORAGE
Information Patent Application
MAGNETIC TUNNEL JUNCTION STRUCTURE FOR MRAM
- Publication number 20230200255
- Publication date Jun 22, 2023
- International Business Machines Corporation
- Oscar van der Straten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TOP VIA INTERCONNECT STRUCTURE WITH TEXTURE SUPPRESSION LAYERS
- Publication number 20230187343
- Publication date Jun 15, 2023
- International Business Machines Corporation
- Oscar van der Straten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAGNETIC TUNNEL JUNCTION WITH AN ETCHED BOTTOM ELECTRODE HAVING NON...
- Publication number 20230180622
- Publication date Jun 8, 2023
- International Business Machines Corporation
- Koichi Motoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCHING OF MAGNETIC TUNNEL JUNCTION (MTJ) STACK FOR MAGNETORESISTIV...
- Publication number 20230144157
- Publication date May 11, 2023
- International Business Machines Corporation
- Koichi Motoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MRAM BOTTOM ELECTRODE SHROUD
- Publication number 20230137421
- Publication date May 4, 2023
- International Business Machines Corporation
- Oscar van der Straten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONICAL MAGNETIC RANDOM ACCESS MEMORY PILLAR STRUCTURES
- Publication number 20230109291
- Publication date Apr 6, 2023
- International Business Machines Corporation
- Oscar van der Straten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-DIAMETER MAGNETIC RANDOM-ACCESS MEMORY PILLAR STRUCTURE
- Publication number 20230087231
- Publication date Mar 23, 2023
- International Business Machines Corporation
- Oscar van der Straten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REPLACEMENT BOTTOM ELECTRODE STRUCTURE FOR MRAM DEVICES
- Publication number 20230044333
- Publication date Feb 9, 2023
- International Business Machines Corporation
- Oscar van der Straten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MRAM STRUCTURE WITH MULTILAYER ENCAPSULATION
- Publication number 20220367788
- Publication date Nov 17, 2022
- International Business Machines Corporation
- Oscar van der Straten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAGNETO-RESISTIVE RANDOM ACCESS MEMORY WITH LATERALLY-RECESSED FREE...
- Publication number 20220190235
- Publication date Jun 16, 2022
- International Business Machines Corporation
- Oscar van der Straten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PILLAR BUMP WITH NOBLE METAL SEED LAYER FOR ADVANCED HETEROGENEOUS...
- Publication number 20220139858
- Publication date May 5, 2022
- International Business Machines Corporation
- Joseph F. Maniscalco
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENCAPSULATED TOP VIA INTERCONNECTS
- Publication number 20220044967
- Publication date Feb 10, 2022
- International Business Machines Corporation
- Oscar van der Straten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL DAMASCENE CROSSBAR ARRAY FOR DISABLING A DEFECTIVE RESISTIVE S...
- Publication number 20210375389
- Publication date Dec 2, 2021
- International Business Machines Corporation
- Joseph F. Maniscalco
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTS WITH ENLARGED CONTACT AREA
- Publication number 20210327803
- Publication date Oct 21, 2021
- International Business Machines Corporation
- Koichi Motoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURES WITH COBALT-INFUSED RUTHENIUM LINER AND A C...
- Publication number 20210242082
- Publication date Aug 5, 2021
- International Business Machines Corporation
- Joseph F. Maniscalco
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FULLY-ALIGNED TOP-VIA STRUCTURES WITH TOP-VIA TRIM
- Publication number 20210143085
- Publication date May 13, 2021
- International Business Machines Corporation
- Kenneth C. K. Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTS HAVING AIR GAP SPACERS
- Publication number 20210118722
- Publication date Apr 22, 2021
- International Business Machines Corporation
- Kenneth Chun Kuen Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENCAPSULATED TOP VIA INTERCONNECTS
- Publication number 20210098293
- Publication date Apr 1, 2021
- International Business Machines Corporation
- Oscar van der Straten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTS HAVING AIR GAP SPACERS
- Publication number 20210090938
- Publication date Mar 25, 2021
- International Business Machines Corporation
- Kenneth Chun Kuen Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER METALLIZATION FILL
- Publication number 20200350201
- Publication date Nov 5, 2020
- International Business Machines Corporation
- Koichi Motoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID SIDEWALL BARRIER FACILITATING LOW RESISTANCE INTERCONNECTION
- Publication number 20200118870
- Publication date Apr 16, 2020
- International Business Machines Corporation
- Oscar van der Straten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACK END OF LINE METALLIZATION STRUCTURES
- Publication number 20200083435
- Publication date Mar 12, 2020
- International Business Machines Corporation
- Joseph F. Maniscalco
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADVANCED INTERCONNECTS CONTAINING AN IMT LINER
- Publication number 20200027829
- Publication date Jan 23, 2020
- International Business Machines Corporation
- Joseph F. Maniscalco
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VOID-FREE METALLIC INTERCONNECT STRUCTURES WITH SELF-FORMED DIFFUSI...
- Publication number 20200020577
- Publication date Jan 16, 2020
- International Business Machines Corporation
- Joseph F. Maniscalco
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VOID-FREE METALLIC INTERCONNECT STRUCTURES WITH SELF-FORMED DIFFUSI...
- Publication number 20200020581
- Publication date Jan 16, 2020
- International Business Machines Corporation
- Joseph F. Maniscalco
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACK END OF LINE METALLIZATION STRUCTURES
- Publication number 20190393409
- Publication date Dec 26, 2019
- International Business Machines Corporation
- Joseph F. Maniscalco
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW RESISTANCE INTERCONNECT STRUCTURE WITH PARTIAL SEED ENHANCEMENT...
- Publication number 20190371735
- Publication date Dec 5, 2019
- International Business Machines Corporation
- Oscar van der Straten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW RESISTANCE METAL-INSULATOR-METAL CAPACITOR ELECTRODE
- Publication number 20190319088
- Publication date Oct 17, 2019
- International Business Machines Corporation
- Joseph F. Maniscalco
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADVANCED INTERCONNECTS CONTAINING AN IMT LINER
- Publication number 20190311985
- Publication date Oct 10, 2019
- International Business Machines Corporation
- Joseph F. Maniscalco
- H01 - BASIC ELECTRIC ELEMENTS

Joseph F. Maniscalco

Person

Patents Grantslast 30 patents

Replacement bottom electrode structure for MRAM devices

Multi-diameter magnetic random-access memory pillar structure

Encapsulated top via interconnects

Magneto-resistive random access memory with laterally-recessed free...

Dual damascene crossbar array for disabling a defective resistive s...

Dual damascene with short liner

Interconnects having air gap spacers

Pillar bump with noble metal seed layer for advanced heterogeneous...

Fully-aligned top-via structures with top-via trim

Interconnects with enlarged contact area

Encapsulated top via interconnects

Interconnect structures with cobalt-infused ruthenium liner and a c...

Hybrid sidewall barrier facilitating low resistance interconnection

Interconnects having air gap spacers

Advanced interconnects containing an IMT liner

Void-free metallic interconnect structures with self-formed diffusi...

Low resistance metal-insulator-metal capacitor electrode

Back end of line metallization structures

Back end of line metallization structures

Low resistance interconnect structure with partial seed enhancement...

Void-free metallic interconnect structures with self-formed diffusi...

Advanced interconnects containing an IMT liner

Low resistance seed enhancement spacers for voidless interconnect s...

Low resistance seed enhancement spacers for voidless interconnect s...

Photoresist compositions with cyclic olefin polymers and hydrophobi...

Photoresist compositions with cyclic olefin polymers and hydrophobi...

Semiconductor package having etched-back silver-copper braze

Patents Applicationslast 30 patents

MAGNETO-RESISTIVE RANDOM ACCESS MEMORY WITH LATERALLY-RECESSED FREE...

MAGNETIC TUNNEL JUNCTION STRUCTURE FOR MRAM

TOP VIA INTERCONNECT STRUCTURE WITH TEXTURE SUPPRESSION LAYERS

MAGNETIC TUNNEL JUNCTION WITH AN ETCHED BOTTOM ELECTRODE HAVING NON...

ETCHING OF MAGNETIC TUNNEL JUNCTION (MTJ) STACK FOR MAGNETORESISTIV...

MRAM BOTTOM ELECTRODE SHROUD

CONICAL MAGNETIC RANDOM ACCESS MEMORY PILLAR STRUCTURES

MULTI-DIAMETER MAGNETIC RANDOM-ACCESS MEMORY PILLAR STRUCTURE

REPLACEMENT BOTTOM ELECTRODE STRUCTURE FOR MRAM DEVICES

MRAM STRUCTURE WITH MULTILAYER ENCAPSULATION

MAGNETO-RESISTIVE RANDOM ACCESS MEMORY WITH LATERALLY-RECESSED FREE...

PILLAR BUMP WITH NOBLE METAL SEED LAYER FOR ADVANCED HETEROGENEOUS...

ENCAPSULATED TOP VIA INTERCONNECTS

DUAL DAMASCENE CROSSBAR ARRAY FOR DISABLING A DEFECTIVE RESISTIVE S...

INTERCONNECTS WITH ENLARGED CONTACT AREA

INTERCONNECT STRUCTURES WITH COBALT-INFUSED RUTHENIUM LINER AND A C...

FULLY-ALIGNED TOP-VIA STRUCTURES WITH TOP-VIA TRIM

INTERCONNECTS HAVING AIR GAP SPACERS

ENCAPSULATED TOP VIA INTERCONNECTS

INTERCONNECTS HAVING AIR GAP SPACERS

COPPER METALLIZATION FILL

HYBRID SIDEWALL BARRIER FACILITATING LOW RESISTANCE INTERCONNECTION

BACK END OF LINE METALLIZATION STRUCTURES

ADVANCED INTERCONNECTS CONTAINING AN IMT LINER

VOID-FREE METALLIC INTERCONNECT STRUCTURES WITH SELF-FORMED DIFFUSI...

VOID-FREE METALLIC INTERCONNECT STRUCTURES WITH SELF-FORMED DIFFUSI...

BACK END OF LINE METALLIZATION STRUCTURES

LOW RESISTANCE INTERCONNECT STRUCTURE WITH PARTIAL SEED ENHANCEMENT...

LOW RESISTANCE METAL-INSULATOR-METAL CAPACITOR ELECTRODE

ADVANCED INTERCONNECTS CONTAINING AN IMT LINER