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Joseph Fernandez
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Gilbert, AZ, US
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Patents Grants
last 30 patents
Information
Patent Grant
Integrated circuit package having interchip bonding and method ther...
Patent number
6,333,549
Issue date
Dec 25, 2001
Microchip Technology Incorporated
Steve V. Drehobl
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stress reducing lead-frame for plastic encapsulation
Patent number
6,306,684
Issue date
Oct 23, 2001
Microchip Technology Incorporated
David Richardson
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for reducing die cracking in integrated circuits
Patent number
6,245,597
Issue date
Jun 12, 2001
Microchip Technology Incorporated
Joseph Fernandez
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Combination inductive coil and integrated circuit semiconductor chi...
Patent number
6,180,433
Issue date
Jan 30, 2001
Microchip Technology Incorporated
Lee Furey
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Integrated circuit package having interchip bonding and method ther...
Patent number
6,159,765
Issue date
Dec 12, 2000
Microchip Technology, Incorporated
Steve V. Drehobl
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Apparatus and method for removing semiconductor chips from a diced...
Patent number
6,139,676
Issue date
Oct 31, 2000
Microchip Technology Incorporated
Joseph D. Fernandez
B32 - LAYERED PRODUCTS
Information
Patent Grant
Combination inductive coil and integrated circuit semiconductor chi...
Patent number
5,909,050
Issue date
Jun 1, 1999
Microchip Technology Incorporated
Lee Furey
G06 - COMPUTING CALCULATING COUNTING
Patents Applications
last 30 patents
Information
Patent Application
Integrated circuit package having interchip bonding and method ther...
Publication number
20010002065
Publication date
May 31, 2001
Steve V. Drehobl
H01 - BASIC ELECTRIC ELEMENTS