Joseph M. Benedetto

Person

Monument, CO, US

People

Patents Grantslast 30 patents

Information Patent Grant
Wafer structure for electronic integrated circuit manufacturing
- Patent number 9,799,516
- Issue date Oct 24, 2017
- Aeroflex Colorado Springs Inc.
- David B. Kerwin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer structure for electronic integrated circuit manufacturing
- Patent number 9,799,653
- Issue date Oct 24, 2017
- Aeroflex Colorado Springs Inc.
- David B. Kerwin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer structure for electronic integrated circuit manufacturing
- Patent number 9,786,608
- Issue date Oct 10, 2017
- Aeroflex Colorado Springs Inc.
- David B. Kerwin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer structure for electronic integrated circuit manufacturing
- Patent number 9,646,835
- Issue date May 9, 2017
- Aeroflex Colorado Springs Inc.
- David B. Kerwin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer structure for electronic integrated circuit manufacturing
- Patent number 9,396,947
- Issue date Jul 19, 2016
- Aeroflex Colorado Springs Inc.
- David B. Kerwin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer structure for electronic integrated circuit manufacturing
- Patent number 9,378,955
- Issue date Jun 28, 2016
- Aeroflex Colorado Springs Inc.
- David B. Kerwin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer structure for electronic integrated circuit manufacturing
- Patent number 9,378,956
- Issue date Jun 28, 2016
- Aeroflex Colorado Springs Inc.
- David B. Kerwin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer structure for electronic integrated circuit manufacturing
- Patent number 9,312,133
- Issue date Apr 12, 2016
- Aeroflex Colorado Springs Inc.
- David B. Kerwin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radiation shielded carriers for sensitive electronics
- Patent number 6,650,003
- Issue date Nov 18, 2003
- Aeroflex UTMC Microelectronic Systems, Inc.
- Joseph M. Benedetto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radiation shield and radiation shielded integrated circuit device
- Patent number 6,452,263
- Issue date Sep 17, 2002
- Aeroflex UTMC Microelectronic Systems, Inc.
- Joseph Benedetto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Raised pedestal radiation shield for sensitive electronics
- Patent number 6,121,672
- Issue date Sep 19, 2000
- UTMC Microelectronic Systems Inc.
- Joseph M. Benedetto
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
WAFER STRUCTURE FOR ELECTRONIC INTEGRATED CIRCUIT MANUFACTURING
- Publication number 20160300837
- Publication date Oct 13, 2016
- AEROFLEX COLORADO SPRINGS INC.
- David B. Kerwin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER STRUCTURE FOR ELECTRONIC INTEGRATED CIRCUIT MANUFACTURING
- Publication number 20160276289
- Publication date Sep 22, 2016
- AEROFLEX COLORADO SPRINGS INC.
- David B. Kerwin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER STRUCTURE FOR ELECTRONIC INTEGRATED CIRCUIT MANUFACTURING
- Publication number 20160268135
- Publication date Sep 15, 2016
- AEROFLEX COLORADO SPRINGS INC.
- David B. Kerwin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER STRUCTURE FOR ELECTRONIC INTEGRATED CIRCUIT MANUFACTURING
- Publication number 20160260609
- Publication date Sep 8, 2016
- AEROFLEX COLORADO SPRINGS INC.
- David B. Kerwin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER STRUCTURE FOR ELECTRONIC INTEGRATED CIRCUIT MANUFACTURING
- Publication number 20130049177
- Publication date Feb 28, 2013
- AEROFLEX COLORADO SPRINGS INC.
- David B. Kerwin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER STRUCTURE FOR ELECTRONIC INTEGRATED CIRCUIT MANUFACTURING
- Publication number 20130049147
- Publication date Feb 28, 2013
- AEROFLEX COLORADO SPRINGS INC.
- David B. Kerwin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER STRUCTURE FOR ELECTRONIC INTEGRATED CIRCUIT MANUFACTURING
- Publication number 20130049175
- Publication date Feb 28, 2013
- AEROFLEX COLORADO SPRINGS INC.
- David B. Kerwin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER STRUCTURE FOR ELECTRONIC INTEGRATED CIRCUIT MANUFACTURING
- Publication number 20130049178
- Publication date Feb 28, 2013
- AEROFLEX COLORADO SPRINGS INC.
- David B. Kerwin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER STRUCTURE FOR ELECTRONIC INTEGRATED CIRCUIT MANUFACTURING
- Publication number 20130049173
- Publication date Feb 28, 2013
- AEROFLEX COLORADO SPRINGS INC.
- David B. Kerwin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER STRUCTURE FOR ELECTRONIC INTEGRATED CIRCUIT MANUFACTURING
- Publication number 20130049174
- Publication date Feb 28, 2013
- AEROFLEX COLORADO SPRINGS INC.
- David B. Kerwin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for radiation hardening N-channel MOS transistors
- Publication number 20030143811
- Publication date Jul 31, 2003
- Joseph Benedetto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for radiation hardening N-channel MOS transistors
- Publication number 20030036236
- Publication date Feb 20, 2003
- Joseph Benedetto
- H01 - BASIC ELECTRIC ELEMENTS

Joseph M. Benedetto

Person

Patents Grantslast 30 patents

Wafer structure for electronic integrated circuit manufacturing

Wafer structure for electronic integrated circuit manufacturing

Wafer structure for electronic integrated circuit manufacturing

Wafer structure for electronic integrated circuit manufacturing

Wafer structure for electronic integrated circuit manufacturing

Wafer structure for electronic integrated circuit manufacturing

Wafer structure for electronic integrated circuit manufacturing

Wafer structure for electronic integrated circuit manufacturing

Radiation shielded carriers for sensitive electronics

Radiation shield and radiation shielded integrated circuit device

Raised pedestal radiation shield for sensitive electronics

Patents Applicationslast 30 patents

WAFER STRUCTURE FOR ELECTRONIC INTEGRATED CIRCUIT MANUFACTURING

WAFER STRUCTURE FOR ELECTRONIC INTEGRATED CIRCUIT MANUFACTURING

WAFER STRUCTURE FOR ELECTRONIC INTEGRATED CIRCUIT MANUFACTURING

WAFER STRUCTURE FOR ELECTRONIC INTEGRATED CIRCUIT MANUFACTURING

WAFER STRUCTURE FOR ELECTRONIC INTEGRATED CIRCUIT MANUFACTURING

WAFER STRUCTURE FOR ELECTRONIC INTEGRATED CIRCUIT MANUFACTURING

WAFER STRUCTURE FOR ELECTRONIC INTEGRATED CIRCUIT MANUFACTURING

WAFER STRUCTURE FOR ELECTRONIC INTEGRATED CIRCUIT MANUFACTURING

WAFER STRUCTURE FOR ELECTRONIC INTEGRATED CIRCUIT MANUFACTURING

WAFER STRUCTURE FOR ELECTRONIC INTEGRATED CIRCUIT MANUFACTURING

Method for radiation hardening N-channel MOS transistors

Method for radiation hardening N-channel MOS transistors