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Joseph M. Brand
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Boise, ID, US
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Patents Grants
last 30 patents
Information
Patent Grant
Systems enabling lower-stress processing of semiconductor device st...
Patent number
10,679,967
Issue date
Jun 9, 2020
Micron Technology, Inc.
Andrew M. Bayless
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods and system for processing semiconductor device structures
Patent number
10,403,598
Issue date
Sep 3, 2019
Micron Technology, Inc.
Andrew M. Bayless
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method and apparatus for removing encapsulating material from a pac...
Patent number
7,405,487
Issue date
Jul 29, 2008
Micron Technology, Inc.
Joseph M. Brand
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Microelectronic devices and methods for manufacturing and operating...
Patent number
7,306,974
Issue date
Dec 11, 2007
Micron Technology, Inc.
Joseph M. Brand
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method and apparatus for removing encapsulating material from a pac...
Patent number
7,273,769
Issue date
Sep 25, 2007
Micron Technology, Inc.
Joseph M. Brand
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Packaged microelectronic devices including first and second casings
Patent number
7,067,905
Issue date
Jun 27, 2006
Micron Technology, Inc.
Joseph M. Brand
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit device
Patent number
6,949,838
Issue date
Sep 27, 2005
Micron Technology, Inc.
Joseph M. Brand
B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information
Patent Grant
Method of fabricating an encapsulant lock feature in integrated cir...
Patent number
6,908,795
Issue date
Jun 21, 2005
Micron Technology, Inc.
Joseph M. Brand
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device encapsulators, methods of encapsulating semico...
Patent number
6,812,068
Issue date
Nov 2, 2004
Micron Technology, Inc.
Joseph M. Brand
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods of forming an integrated circuit device
Patent number
6,706,565
Issue date
Mar 16, 2004
Micron Technology, Inc.
Joseph M. Brand
B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information
Patent Grant
Method of forming heat sink and semiconductor chip assemblies
Patent number
6,706,560
Issue date
Mar 16, 2004
Micron Technology, Inc.
Joseph M. Brand
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Circuit, method of adhering an integrated circuit device to a subst...
Patent number
6,528,890
Issue date
Mar 4, 2003
Micron Technology, Inc.
Joseph M. Brand
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Controlling packaging encapsulant leakage
Patent number
6,521,980
Issue date
Feb 18, 2003
Micron Technology, Inc.
Patrick W. Tandy
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Circuit, method of adhering an integrated circuit device to a subst...
Patent number
6,498,052
Issue date
Dec 24, 2002
Micron Technology, Inc.
Joseph M. Brand
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods of forming a circuit and methods of preparing an integrated...
Patent number
6,461,894
Issue date
Oct 8, 2002
Micron Technology, Inc.
Joseph M. Brand
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of fabricating an encapsulant lock feature in integrated cir...
Patent number
6,423,581
Issue date
Jul 23, 2002
Micron Technology, Inc.
Joseph M. Brand
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of encapsulating semiconductor devices utilizing a dispensin...
Patent number
6,399,425
Issue date
Jun 4, 2002
Micron Technology, Inc.
Joseph M. Brand
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Controlling packaging encapsulant leakage
Patent number
6,395,579
Issue date
May 28, 2002
Micron Technology, Inc.
Patrick W. Tandy
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device encapsulators
Patent number
6,383,292
Issue date
May 7, 2002
Micron Technology, Inc.
Joseph M. Brand
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Encapsulation methods for semiconductive die packages
Patent number
6,379,991
Issue date
Apr 30, 2002
Micron Technology, Inc.
Ford B. Grigg
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit device and synchronous-link dynamic random acces...
Patent number
6,355,985
Issue date
Mar 12, 2002
Micron Technology, Inc.
Joseph M. Brand
B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information
Patent Grant
Method of forming heat sink and semiconductor chip assemblies
Patent number
6,355,506
Issue date
Mar 12, 2002
Micron Technology, Inc.
Joseph M. Brand
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Controlling packaging encapsulant leakage
Patent number
6,210,992
Issue date
Apr 3, 2001
Micron Technology, Inc.
Patrick W. Tandy
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of forming heat sink and semiconductor chip assemblies
Patent number
6,114,190
Issue date
Sep 5, 2000
Micron Technology, Inc.
Joseph M. Brand
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of forming a synchronous-link dynamic random access memory e...
Patent number
6,008,074
Issue date
Dec 28, 1999
Micron Technology, Inc.
Joseph M. Brand
B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Patents Applications
last 30 patents
Information
Patent Application
SYSTEMS ENABLING LOWER-STRESS PROCESSING OF SEMICONDUCTOR DEVICE ST...
Publication number
20190148335
Publication date
May 16, 2019
Micron Technology, Inc.
Andrew M. Bayless
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS AND SYSTEM FOR PROCESSING SEMICONDUCTOR DEVICE STRUCTURES
Publication number
20190051630
Publication date
Feb 14, 2019
Micron Technology, Inc.
Andrew M. Bayless
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method and apparatus for removing encapsulating material from a pac...
Publication number
20070031998
Publication date
Feb 8, 2007
Micron Technology, Inc.
Joseph M. Brand
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Microelectronic devices and methods for manufacturing and operating...
Publication number
20060040422
Publication date
Feb 23, 2006
Micron Technology, Inc.
Joseph M. Brand
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Microelectronic devices and methods for manufacturing and operating...
Publication number
20040026776
Publication date
Feb 12, 2004
Joseph M. Brand
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Integrated circuit device
Publication number
20030090008
Publication date
May 15, 2003
Micron Technology, Inc.
Joseph M. Brand
B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information
Patent Application
Method and apparatus for removing encapsulating material from a pac...
Publication number
20020190396
Publication date
Dec 19, 2002
Joseph M. Brand
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor device encapsulators, methods of encapsulating semico...
Publication number
20020119604
Publication date
Aug 29, 2002
Joseph M. Brand
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method of forming heat sink and semiconductor chip assemblies
Publication number
20020090760
Publication date
Jul 11, 2002
Joseph M. Brand
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method of fabricating an encapsulant lock feature in integrated cir...
Publication number
20020064907
Publication date
May 30, 2002
Joseph M. Brand
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF ENCAPSULATING SEMICONDUCTOR DEVICES UTILIZING A DISPENSIN...
Publication number
20020058360
Publication date
May 16, 2002
JOSEPH M. BRAND
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE UTILING AN ENCAPSULANT FOR LOCKING A SEMICONDU...
Publication number
20020030257
Publication date
Mar 14, 2002
JOSEPH M. BRAND
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Circuit, method of adhering an integrated circuit device to a subst...
Publication number
20020028535
Publication date
Mar 7, 2002
Joseph M. Brand
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS OF FORMING A CIRCUIT AND METHODS OF PREPARING AN INTEGRATED...
Publication number
20020019075
Publication date
Feb 14, 2002
Joseph M. Brand
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS OF FORMING AN INTEGRATED CIRCUIT DEVICE
Publication number
20010036686
Publication date
Nov 1, 2001
JOSEPH M. BRAND
B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information
Patent Application
SEMICONDUCTOR PROCESSING METHODS OF FORMING ENCAPSULANT OVER SEMICO...
Publication number
20010012641
Publication date
Aug 9, 2001
FORD B. GRIGG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Controlling packaging encapsulant leakage
Publication number
20010008780
Publication date
Jul 19, 2001
Patrick W. Tandy
H01 - BASIC ELECTRIC ELEMENTS