Joseph Nelson

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Saint Paul, MN, US

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Patents Grantslast 30 patents

Information Patent Grant
Fluidization of agglomerated solder microspheres
- Patent number 11,247,285
- Issue date Feb 15, 2022
- Seagate Technology LLC
- Aaron Collins
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
PROCESS FOR HIGH DENSITY SOLDER INTERCONNECT
- Publication number 20240157457
- Publication date May 16, 2024
- SEAGATE TECHNOLOGY LLC
- Daniel Glen Hardy
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR