JOSEPH O. LIU

Person

DALLAS, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Efficient redistribution layer topology
- Patent number 12,142,586
- Issue date Nov 12, 2024
- Texas Instruments Incorporated
- Vivek Swaminathan Sridharan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semicondutor package substrate with die cavity and redistribution l...
- Patent number 11,854,922
- Issue date Dec 26, 2023
- Texas Instruments Incorporated
- Vivek Swaminathan Sridharan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Front side laser-based wafer dicing
- Patent number 11,664,276
- Issue date May 30, 2023
- Texas Instruments Incorporated
- Matthew John Sherbin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Efficient redistribution layer topology
- Patent number 11,380,637
- Issue date Jul 5, 2022
- Texas Instruments Incorporated
- Vivek Swaminathan Sridharan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
EFFICIENT REDISTRIBUTION LAYER TOPOLOGY
- Publication number 20250029943
- Publication date Jan 23, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Vivek Swaminathan SRIDHARAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRE-WAFER FABRICATION LASER DICING
- Publication number 20250006501
- Publication date Jan 2, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Hao ZHANG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LASER ABLATION FOR DIE SEPARATION TO REDUCE LASER SPLASH AND ELECTR...
- Publication number 20230387036
- Publication date Nov 30, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Michael Todd Wyant
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EFFICIENT REMOVAL OF STREET TEST DEVICES DURING WAFER DICING
- Publication number 20230274978
- Publication date Aug 31, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Michael Todd WYANT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FRONT SIDE LASER-BASED WAFER DICING
- Publication number 20230260839
- Publication date Aug 17, 2023
- TEXAS INSTRUMENTS INCORPORATED
- MATTHEW JOHN SHERBIN
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SINGULATING SEMICONDUCTOR WAFERS
- Publication number 20230253251
- Publication date Aug 10, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Qing Ran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPLASH RESISTANT LASER WAFER SINGULATION BY CRACK LENGTH CONTROL
- Publication number 20230170257
- Publication date Jun 1, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Yang Liu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUTOR PACKAGE SUBSTRATE WITH DIE CAVITY AND REDISTRIBUTION L...
- Publication number 20220406673
- Publication date Dec 22, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Vivek Swaminathan SRIDHARAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EFFICIENT REDISTRIBUTION LAYER TOPOLOGY
- Publication number 20220328438
- Publication date Oct 13, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Vivek Swaminathan SRIDHARAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EFFICIENT REDISTRIBUTION LAYER TOPOLOGY
- Publication number 20210384150
- Publication date Dec 9, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Vivek Swaminathan SRIDHARAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FRONT SIDE LASER-BASED WAFER DICING
- Publication number 20200176314
- Publication date Jun 4, 2020
- TEXAS INSTRUMENTS INCORPORATED
- MATTHEW JOHN SHERBIN
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

JOSEPH O. LIU

Person

Patents Grantslast 30 patents

Efficient redistribution layer topology

Semicondutor package substrate with die cavity and redistribution l...

Front side laser-based wafer dicing

Efficient redistribution layer topology

Patents Applicationslast 30 patents

EFFICIENT REDISTRIBUTION LAYER TOPOLOGY

PRE-WAFER FABRICATION LASER DICING

LASER ABLATION FOR DIE SEPARATION TO REDUCE LASER SPLASH AND ELECTR...

EFFICIENT REMOVAL OF STREET TEST DEVICES DURING WAFER DICING

FRONT SIDE LASER-BASED WAFER DICING

SINGULATING SEMICONDUCTOR WAFERS

SPLASH RESISTANT LASER WAFER SINGULATION BY CRACK LENGTH CONTROL

SEMICONDUTOR PACKAGE SUBSTRATE WITH DIE CAVITY AND REDISTRIBUTION L...

EFFICIENT REDISTRIBUTION LAYER TOPOLOGY

EFFICIENT REDISTRIBUTION LAYER TOPOLOGY

FRONT SIDE LASER-BASED WAFER DICING