Joseph S. STEFFLER

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Waterloo, CA

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and package
- Patent number 11,757,170
- Issue date Sep 12, 2023
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Gareth Pryce Weale
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a semiconductor device
- Patent number 11,139,552
- Issue date Oct 5, 2021
- Semiconductor Components Industries, LLC
- Gareth Pryce Weale
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure for semiconductor devices
- Patent number 11,049,792
- Issue date Jun 29, 2021
- Semiconductor Components Industries, LLC
- Gareth Pryce Weale
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density semiconductor package and related methods
- Patent number 10,468,336
- Issue date Nov 5, 2019
- Semiconductor Components Industries, LLC
- Joseph S. Steffler
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF FORMING A SEMICONDUCTOR DEVICE
- Publication number 20210408666
- Publication date Dec 30, 2021
- Semiconductor Components Industries, LLC
- Gareth Pryce WEALE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY SEMICONDUCTOR PACKAGE AND RELATED METHODS
- Publication number 20170345745
- Publication date Nov 30, 2017
- Semiconductor Components Industries, LLC
- Joseph S. STEFFLER
- H01 - BASIC ELECTRIC ELEMENTS