Joseph T. Kung

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Santa Clara, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Microelectromechanical systems using thermocompression bonding
- Patent number 7,750,462
- Issue date Jul 6, 2010
- Microassembly Technologies, Inc.
- Michael Bennett Cohn
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectromechanical systems using thermocompression bonding
- Patent number 7,276,789
- Issue date Oct 2, 2007
- Microassembly Technologies, Inc.
- Michael B. Cohn
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectromechanical systems using thermocompression bonding
- Patent number 6,853,067
- Issue date Feb 8, 2005
- Microassembly Technologies, Inc.
- Michael B. Cohn
- B81 - MICRO-STRUCTURAL TECHNOLOGY