Joseph V. Cesna

Person

Niles, IL, US

People

Patents Grantslast 30 patents

Information Patent Grant
Apparatus and method for the face-up surface treatment of wafers
- Patent number 6,168,683
- Issue date Jan 2, 2001
- SpeedFam-IPEC Corporation
- Joseph V. Cesna
- B24 - GRINDING POLISHING
Information Patent Grant
Wafer polishing with improved backing arrangement
- Patent number 6,142,857
- Issue date Nov 7, 2000
- SpeedFam-IPEC Corporation
- Joseph V. Cesna
- B24 - GRINDING POLISHING
Information Patent Grant
Method and apparatus for improved semiconductor wafer polishing
- Patent number 6,102,779
- Issue date Aug 15, 2000
- Speedfam-IPEC, Inc.
- Joseph V. Cesna
- B24 - GRINDING POLISHING
Information Patent Grant
Wafer polishing carrier and ring extension therefor
- Patent number 6,089,961
- Issue date Jul 18, 2000
- SpeedFam-IPEC Corporation
- Joseph V. Cesna
- B24 - GRINDING POLISHING
Information Patent Grant
Method and apparatus for improved semiconductor wafer polishing
- Patent number 5,993,293
- Issue date Nov 30, 1999
- Speedram Corporation
- Joseph V. Cesna
- B24 - GRINDING POLISHING
Information Patent Grant
Wafer polishing with improved end point detection
- Patent number 5,972,162
- Issue date Oct 26, 1999
- Speedfam Corporation
- Joseph V. Cesna
- B24 - GRINDING POLISHING
Information Patent Grant
Method and apparatus for monitoring and controlling the flatness of...
- Patent number 5,951,370
- Issue date Sep 14, 1999
- SpeedFam-IPEC Corp.
- Joseph V. Cesna
- B24 - GRINDING POLISHING
Information Patent Grant
Methods and apparatus for conditioning grinding stones
- Patent number 5,938,506
- Issue date Aug 17, 1999
- SpeedFam-IPEC Corporation
- Clinton Fruitman
- B24 - GRINDING POLISHING
Information Patent Grant
In-situ polishing pad flatness control
- Patent number 5,868,605
- Issue date Feb 9, 1999
- Speedfam Corporation
- Joseph V. Cesna
- B24 - GRINDING POLISHING
Information Patent Grant
Dual column abrading machine
- Patent number 5,803,798
- Issue date Sep 8, 1998
- Speedfam Corporation
- Joseph V. Cesna
- B24 - GRINDING POLISHING
Information Patent Grant
Bearing assembly for wafer planarization carrier
- Patent number 5,791,978
- Issue date Aug 11, 1998
- Speedfam Corporation
- Joseph V. Cesna
- B24 - GRINDING POLISHING
Information Patent Grant
Backing pad
- Patent number 5,791,975
- Issue date Aug 11, 1998
- Speedfam Corporation
- Joseph V. Cesna
- B24 - GRINDING POLISHING
Information Patent Grant
Dual column abrading machine
- Patent number 5,782,678
- Issue date Jul 21, 1998
- Speedfam Corporation
- Joseph V. Cesna
- B24 - GRINDING POLISHING
Information Patent Grant
Dual column abrading machine
- Patent number 5,595,529
- Issue date Jan 21, 1997
- Speedfam Corporation
- Joseph V. Cesna
- B24 - GRINDING POLISHING
Information Patent Grant
Device for conditioning polishing pads
- Patent number 5,486,131
- Issue date Jan 23, 1996
- Speedfam Corporation
- Joseph V. Cesna
- B24 - GRINDING POLISHING
Information Patent Grant
Automated free abrasive machine for one side piece part machining
- Patent number 5,224,304
- Issue date Jul 6, 1993
- Speedfam Corporation
- Joseph V. Cesna
- B24 - GRINDING POLISHING
Information Patent Grant
Control valve assembly for abrasive slurry
- Patent number 4,593,716
- Issue date Jun 10, 1986
- Speedfam Corporation
- Joseph V. Cesna
- B24 - GRINDING POLISHING
Information Patent Grant
Liquid waxless fixturing of microsize wafers
- Patent number 4,519,168
- Issue date May 28, 1985
- Speedfam Corporation
- Joseph V. Cesna
- B24 - GRINDING POLISHING
Information Patent Grant
Bearing mount for lapping machine pressure plate
- Patent number 4,270,314
- Issue date Jun 2, 1981
- Speedfam Corporation
- Joseph V. Cesna
- B24 - GRINDING POLISHING

Joseph V. Cesna

Person

Patents Grantslast 30 patents

Apparatus and method for the face-up surface treatment of wafers

Wafer polishing with improved backing arrangement

Method and apparatus for improved semiconductor wafer polishing

Wafer polishing carrier and ring extension therefor

Method and apparatus for improved semiconductor wafer polishing

Wafer polishing with improved end point detection

Method and apparatus for monitoring and controlling the flatness of...

Methods and apparatus for conditioning grinding stones

In-situ polishing pad flatness control

Dual column abrading machine

Bearing assembly for wafer planarization carrier

Backing pad

Dual column abrading machine

Dual column abrading machine

Device for conditioning polishing pads

Automated free abrasive machine for one side piece part machining

Control valve assembly for abrasive slurry

Liquid waxless fixturing of microsize wafers

Bearing mount for lapping machine pressure plate