Joseph VAN NAUSDLE

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Chandler, AZ, US

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Patents Grantslast 30 patents

Information Patent Grant
Dummy die structures of a packaged integrated circuit device
- Patent number 12,068,222
- Issue date Aug 20, 2024
- Intel Corporation
- Mitul Modi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DUMMY DIE STRUCTURES OF A PACKAGED INTEGRATED CIRCUIT DEVICE
- Publication number 20220102242
- Publication date Mar 31, 2022
- Intel Corporation
- Mitul Modi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUMMY DIE IN A RECESSED MOLD STRUCTURE OF A PACKAGED INTEGRATED CIR...
- Publication number 20220102231
- Publication date Mar 31, 2022
- Intel Corporation
- Mitul Modi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
KEEP OUT ZONE WITH HYDROPHOBIC SURFACE FOR INTEGRATED CIRCUIT (IC)...
- Publication number 20210233867
- Publication date Jul 29, 2021
- Intel Corporation
- Bassam ZIADEH
- H01 - BASIC ELECTRIC ELEMENTS