Joseph VAN NAUSDLE

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Hydrophobic feature to control adhesive flow
- Patent number 12,130,482
- Issue date Oct 29, 2024
- Intel Corporation
- Bassam Ziadeh
- G02 - OPTICS
Information Patent Grant
Dummy die structures of a packaged integrated circuit device
- Patent number 12,068,222
- Issue date Aug 20, 2024
- Intel Corporation
- Mitul Modi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PEDESTALS FOR SEMICONDUCTOR COMPONENTS EMBEDDED IN PACKAGE SUBSTRAT...
- Publication number 20250218958
- Publication date Jul 3, 2025
- Intel Corporation
- Brandon Christian Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICALLY EMBEDDED COMPONENTS IN PACKAGE SUBSTRATES
- Publication number 20250219021
- Publication date Jul 3, 2025
- Intel Corporation
- Bohan Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYDROPHOBIC FEATURE TO CONTROL ADHESIVE FLOW
- Publication number 20240402445
- Publication date Dec 5, 2024
- Intel Corporation
- Bassam ZIADEH
- G02 - OPTICS
Information Patent Application
HYDROPHOBIC FEATURE TO CONTROL ADHESIVE FLOW
- Publication number 20220196937
- Publication date Jun 23, 2022
- Intel Corporation
- Bassam ZIADEH
- G02 - OPTICS
Information Patent Application
DUMMY DIE STRUCTURES OF A PACKAGED INTEGRATED CIRCUIT DEVICE
- Publication number 20220102242
- Publication date Mar 31, 2022
- Intel Corporation
- Mitul Modi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUMMY DIE IN A RECESSED MOLD STRUCTURE OF A PACKAGED INTEGRATED CIR...
- Publication number 20220102231
- Publication date Mar 31, 2022
- Intel Corporation
- Mitul Modi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
KEEP OUT ZONE WITH HYDROPHOBIC SURFACE FOR INTEGRATED CIRCUIT (IC)...
- Publication number 20210233867
- Publication date Jul 29, 2021
- Intel Corporation
- Bassam ZIADEH
- H01 - BASIC ELECTRIC ELEMENTS

Joseph VAN NAUSDLE

Person

Patents Grantslast 30 patents

Hydrophobic feature to control adhesive flow

Dummy die structures of a packaged integrated circuit device

Patents Applicationslast 30 patents

PEDESTALS FOR SEMICONDUCTOR COMPONENTS EMBEDDED IN PACKAGE SUBSTRAT...

VERTICALLY EMBEDDED COMPONENTS IN PACKAGE SUBSTRATES

HYDROPHOBIC FEATURE TO CONTROL ADHESIVE FLOW

HYDROPHOBIC FEATURE TO CONTROL ADHESIVE FLOW

DUMMY DIE STRUCTURES OF A PACKAGED INTEGRATED CIRCUIT DEVICE

DUMMY DIE IN A RECESSED MOLD STRUCTURE OF A PACKAGED INTEGRATED CIR...

KEEP OUT ZONE WITH HYDROPHOBIC SURFACE FOR INTEGRATED CIRCUIT (IC)...