Joseph W. Parks JR.

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Aloha, OR, US

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Patents Grantslast 30 patents

Information Patent Grant
Microbump cluster probing architecture for 2.5D and 3D dies
- Patent number 12,163,982
- Issue date Dec 10, 2024
- Intel Corporation
- Jagat Shakya
- G01 - MEASURING TESTING
Information Patent Grant
Apparatuses and methods for monitoring health of probing u-bump clu...
- Patent number 11,740,282
- Issue date Aug 29, 2023
- Intel Corporation
- Jagat Shakya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
In die stepping sort
- Patent number 10,429,439
- Issue date Oct 1, 2019
- Intel Corporation
- Dae-Woo Kim
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
MICROBUMP CLUSTER PROBING ARCHITECTURE FOR 2.5D AND 3D DIES
- Publication number 20230314479
- Publication date Oct 5, 2023
- Intel Corporation
- Jagat SHAKYA
- G01 - MEASURING TESTING
Information Patent Application
IN DIE STEPPING SORT
- Publication number 20180003765
- Publication date Jan 4, 2018
- Dae-Woo Kim
- G01 - MEASURING TESTING