Josh D. Woodland

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Kuna, ID, US

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Patents Grantslast 30 patents

Information Patent Grant
Methods for forming semiconductor device packages with photoimageab...
- Patent number 9,362,143
- Issue date Jun 7, 2016
- Micron Technology, Inc.
- Yangyang Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit constructions having through substrate vias and...
- Patent number 9,123,700
- Issue date Sep 1, 2015
- Micron Technology, Inc.
- Jaspreet S. Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dry flux bonding device and method
- Patent number 8,492,242
- Issue date Jul 23, 2013
- Micron Technology, Inc.
- Owen Fay
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHODS FOR FORMING SEMICONDUCTOR DEVICE PACKAGES WITH PHOTOIMAGEAB...
- Publication number 20130299986
- Publication date Nov 14, 2013
- Micron Technology, Inc.
- Yangyang Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DRY FLUX BONDING DEVICE AND METHOD
- Publication number 20130299868
- Publication date Nov 14, 2013
- Owen Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Constructions Having Through Substrate Vias And...
- Publication number 20130175698
- Publication date Jul 11, 2013
- Jaspreet S. Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DRY FLUX BONDING DEVICE AND METHOD
- Publication number 20110291146
- Publication date Dec 1, 2011
- Micron Technology, Inc.
- Owen Fay
- H01 - BASIC ELECTRIC ELEMENTS