Joshua Collins

Person

Sunnyvale, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Atomic layer deposition of metal films
- Patent number 11,970,776
- Issue date Apr 30, 2024
- Lam Research Corporation
- Joshua Collins
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of depositing tungsten and other metals in 3D NAND structures
- Patent number 11,549,175
- Issue date Jan 10, 2023
- Lam Research Corporation
- Gorun Butail
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for preventing line bending during metal fill process
- Patent number 11,355,345
- Issue date Jun 7, 2022
- Lam Research Corporation
- Adam Jandl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Atomic layer deposition of tungsten for enhanced fill and reduced s...
- Patent number 11,225,712
- Issue date Jan 18, 2022
- Lam Research Corporation
- Joshua Collins
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Low resistivity films containing molybdenum
- Patent number 10,777,453
- Issue date Sep 15, 2020
- Lam Research Corporation
- Shruti Vivek Thombare
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for preventing line bending during metal fill process
- Patent number 10,573,522
- Issue date Feb 25, 2020
- Lam Research Corporation
- Adam Jandl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming low resistivity fluorine free tungsten film without nucleation
- Patent number 10,546,751
- Issue date Jan 28, 2020
- Lam Research Corporation
- Hanna Bamnolker
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Low resistivity films containing molybdenum
- Patent number 10,510,590
- Issue date Dec 17, 2019
- Lam Research Corporation
- Shruti Vivek Thombare
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Atomic layer deposition of tungsten for enhanced fill and reduced s...
- Patent number 10,214,807
- Issue date Feb 26, 2019
- Lam Research Corporation
- Joshua Collins
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Vapor delivery method and apparatus for solid and liquid precursors
- Patent number 10,087,523
- Issue date Oct 2, 2018
- Lam Research Corporation
- Joshua Collins
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of forming low resistivity fluorine free tungsten film witho...
- Patent number 9,978,605
- Issue date May 22, 2018
- Lam Research Corporation
- Hanna Bamnolker
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Directional SiO2 etch using plasma pre-treatment and high-temperatu...
- Patent number 9,653,318
- Issue date May 16, 2017
- Applied Materials, Inc.
- David T. Or
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of preparing tungsten and tungsten nitride thin films using...
- Patent number 9,595,470
- Issue date Mar 14, 2017
- Lam Research Corporation
- Hanna Bamnolker
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for producing ultra-thin tungsten layers with improved step...
- Patent number 9,583,385
- Issue date Feb 28, 2017
- Novellus Systems, Inc.
- Sang-Hyeob Lee
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plasma treatment of film for impurity removal
- Patent number 9,275,865
- Issue date Mar 1, 2016
- Applied Materials, Inc.
- Benjamin C. Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Directional SiO2 etch using plasma pre-treatment and high-temperatu...
- Patent number 9,245,769
- Issue date Jan 26, 2016
- Applied Materials, Inc.
- David T. Or
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Directional SiO2 etch using low-temperature etchant deposition and...
- Patent number 9,202,745
- Issue date Dec 1, 2015
- Applied Materials, Inc.
- David T. Or
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Directional SiO2 etch using plasma pre-treatment and high-temperatu...
- Patent number 9,177,780
- Issue date Nov 3, 2015
- Applied Materials, Inc.
- David T. Or
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tungsten growth modulation by controlling surface composition
- Patent number 9,169,556
- Issue date Oct 27, 2015
- Applied Materials, Inc.
- Kai Wu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for producing ultra-thin tungsten layers with improved step...
- Patent number 9,076,843
- Issue date Jul 7, 2015
- Novellus Systems, Inc.
- Sang-Hyeob Lee
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Boron ionization for aluminum oxide etch enhancement
- Patent number 9,051,655
- Issue date Jun 9, 2015
- Applied Materials, Inc.
- Kai Wu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Directional SIO2 etch using low-temperature etchant deposition and...
- Patent number 8,980,761
- Issue date Mar 17, 2015
- Applied Materials, Inc.
- David T. Or
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low temperature high pressure high H2/WF6 ratio W process for 3D NA...
- Patent number 8,900,999
- Issue date Dec 2, 2014
- Applied Materials, Inc.
- Kai Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High temperature tungsten metallization process
- Patent number 8,835,311
- Issue date Sep 16, 2014
- Applied Materials, Inc.
- Joshua Collins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High temperature tungsten metallization process
- Patent number 8,617,985
- Issue date Dec 31, 2013
- Applied Materials, Inc.
- Joshua Collins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for growing low-resistivity tungsten for high aspect ratio...
- Patent number 8,409,985
- Issue date Apr 2, 2013
- Novellus Systems, Inc.
- Lana Hiului Chan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods for growing low-resistivity tungsten film
- Patent number 8,048,805
- Issue date Nov 1, 2011
- Novellus Systems, Inc.
- Lana Hiului Chan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Adsorption based material removal process
- Patent number 8,043,972
- Issue date Oct 25, 2011
- Novellus Systems, Inc.
- Xinye Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for growing low-resistivity tungsten for high aspect ratio...
- Patent number 7,955,972
- Issue date Jun 7, 2011
- Novellus Systems, Inc.
- Lana Hiului Chan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Reducing silicon attack and improving resistivity of tungsten nitri...
- Patent number 7,754,604
- Issue date Jul 13, 2010
- Novellus Systems, Inc.
- Panya Wongsenakhum
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LOW RESISTIVITY FILMS CONTAINING MOLYBDENUM
- Publication number 20240297075
- Publication date Sep 5, 2024
- LAM RESEARCH CORPORATION
- Shruti Vivek THOMBARE
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
DEPOSITION OF METAL FILMS
- Publication number 20240271281
- Publication date Aug 15, 2024
- LAM RESEARCH CORPORATION
- Joshua COLLINS
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SELF-LIMITING GROWTH
- Publication number 20230290680
- Publication date Sep 14, 2023
- LAM RESEARCH CORPORATION
- Joshua Collins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLYBDENUM FILL
- Publication number 20220375792
- Publication date Nov 24, 2022
- LAM RESEARCH CORPORATION
- Lawrence SCHLOSS
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
DEPOSITION OF METAL FILMS
- Publication number 20220356579
- Publication date Nov 10, 2022
- LAM RESEARCH CORPORATION
- Joshua Collins
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR PREVENTING LINE BENDING DURING METAL FILL PROCESS
- Publication number 20220262640
- Publication date Aug 18, 2022
- LAM RESEARCH CORPORATION
- Adam Jandl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW RESISTIVITY FILMS CONTAINING MOLYBDENUM
- Publication number 20220223471
- Publication date Jul 14, 2022
- LAM RESEARCH CORPORATION
- Shruti Vivek THOMBARE
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
VAPOR ACCUMULATOR FOR CORROSIVE GASES WITH PURGING
- Publication number 20220213599
- Publication date Jul 7, 2022
- LAM RESEARCH CORPORATION
- Gary Bridger Lind
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
DEPOSITION OF METAL FILMS
- Publication number 20220195598
- Publication date Jun 23, 2022
- LAM RESEARCH CORPORATION
- Joshua Collins
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF DEPOSITING TUNGSTEN AND OTHER METALS IN 3D NAND STRUCTURES
- Publication number 20210238736
- Publication date Aug 5, 2021
- LAM RESEARCH CORPORATION
- Gorun Butail
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SELF-LIMITING GROWTH
- Publication number 20200402846
- Publication date Dec 24, 2020
- LAM RESEARCH CORPORATION
- Joshua Collins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW RESISTIVITY FILMS CONTAINING MOLYBDENUM
- Publication number 20200365456
- Publication date Nov 19, 2020
- LAM RESEARCH CORPORATION
- Shruti Vivek Thombare
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PREVENTING LINE BENDING DURING METAL FILL PROCESS
- Publication number 20200144066
- Publication date May 7, 2020
- LAM RESEARCH CORPORATION
- Adam Jandl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW RESISTIVITY FILMS CONTAINING MOLYBDENUM
- Publication number 20200075403
- Publication date Mar 5, 2020
- LAM RESEARCH CORPORATION
- Shruti Vivek Thombare
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ATOMIC LAYER DEPOSITION OF TUNGSTEN FOR ENHANCED FILL AND REDUCED S...
- Publication number 20190185992
- Publication date Jun 20, 2019
- LAM RESEARCH CORPORATION
- Joshua Collins
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
LOW RESISTIVITY FILMS CONTAINING MOLYBDENUM
- Publication number 20180294187
- Publication date Oct 11, 2018
- LAM RESEARCH CORPORATION
- Shruti Vivek Thombare
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMING LOW RESISTIVITY FLUORINE FREE TUNGSTEN FILM WITHOUT NUCLEATION
- Publication number 20180240675
- Publication date Aug 23, 2018
- LAM RESEARCH CORPORATION
- Hanna Bamnolker
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR PREVENTING LINE BENDING DURING METAL FILL PROCESS
- Publication number 20180053660
- Publication date Feb 22, 2018
- LAM RESEARCH CORPORATION
- Adam Jandl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ATOMIC LAYER DEPOSITION OF TUNGSTEN FOR ENHANCED FILL AND REDUCED S...
- Publication number 20170350008
- Publication date Dec 7, 2017
- LAM RESEARCH CORPORATION
- Joshua Collins
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
VAPOR MANIFOLD WITH INTEGRATED VAPOR CONCENTRATION SENSOR
- Publication number 20170342562
- Publication date Nov 30, 2017
- LAM RESEARCH CORPORATION
- Gary Bridger Lind
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
VAPOR DELIVERY METHOD AND APPARATUS FOR SOLID AND LIQUID PRECURSORS
- Publication number 20170335450
- Publication date Nov 23, 2017
- LAM RESEARCH CORPORATION
- Joshua Collins
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF FORMING LOW RESISTIVITY FLUORINE FREE TUNGSTEN FILM WITHO...
- Publication number 20170117155
- Publication date Apr 27, 2017
- LAM RESEARCH CORPORATION
- Hanna Bamnolker
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
DIRECTIONAL SIO2 ETCH USING PLASMA PRE-TREATMENT AND HIGH-TEMPERATU...
- Publication number 20160247689
- Publication date Aug 25, 2016
- Applied Materials, Inc.
- David T. OR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FILLING HIGH ASPECT RATIO FEATURES WITH FLUORINE FREE TU...
- Publication number 20150348840
- Publication date Dec 3, 2015
- LAM RESEARCH CORPORATION
- Hanna Bamnolker
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHODS OF PREPARING TUNGSTEN AND TUNGSTEN NITRIDE THIN FILMS USING...
- Publication number 20150325475
- Publication date Nov 12, 2015
- LAM RESEARCH CORPORATION
- Hanna Bamnolker
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR PRODUCING ULTRA-THIN TUNGSTEN LAYERS WITH IMPROVED STEP...
- Publication number 20150279732
- Publication date Oct 1, 2015
- Novellus Systems, Inc.
- Sang-Hyeob Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BORON IONIZATION FOR ALUMINUM OXIDE ETCH ENHANCEMENT
- Publication number 20150076110
- Publication date Mar 19, 2015
- Applied Materials, Inc.
- Kai WU
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
DIRECTIONAL SIO2 ETCH USING PLASMA PRE-TREATMENT AND HIGH-TEMPERATU...
- Publication number 20150072508
- Publication date Mar 12, 2015
- Applied Materials, Inc.
- David T. OR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECTIONAL SIO2 ETCH USING LOW-TEMPERATURE ETCHANT DEPOSITION AND...
- Publication number 20140363979
- Publication date Dec 11, 2014
- David T. OR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TUNGSTEN DEPOSITION SEQUENCE
- Publication number 20140273451
- Publication date Sep 18, 2014
- Benjamin C. Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Joshua Collins

Person

Patents Grantslast 30 patents

Atomic layer deposition of metal films

Method of depositing tungsten and other metals in 3D NAND structures

Method for preventing line bending during metal fill process

Atomic layer deposition of tungsten for enhanced fill and reduced s...

Low resistivity films containing molybdenum

Method for preventing line bending during metal fill process

Forming low resistivity fluorine free tungsten film without nucleation

Low resistivity films containing molybdenum

Atomic layer deposition of tungsten for enhanced fill and reduced s...

Vapor delivery method and apparatus for solid and liquid precursors

Method of forming low resistivity fluorine free tungsten film witho...

Directional SiO2 etch using plasma pre-treatment and high-temperatu...

Methods of preparing tungsten and tungsten nitride thin films using...

Method for producing ultra-thin tungsten layers with improved step...

Plasma treatment of film for impurity removal

Directional SiO2 etch using plasma pre-treatment and high-temperatu...

Directional SiO2 etch using low-temperature etchant deposition and...

Directional SiO2 etch using plasma pre-treatment and high-temperatu...

Tungsten growth modulation by controlling surface composition

Method for producing ultra-thin tungsten layers with improved step...

Boron ionization for aluminum oxide etch enhancement

Directional SIO2 etch using low-temperature etchant deposition and...

Low temperature high pressure high H2/WF6 ratio W process for 3D NA...

High temperature tungsten metallization process

High temperature tungsten metallization process

Methods for growing low-resistivity tungsten for high aspect ratio...

Methods for growing low-resistivity tungsten film

Adsorption based material removal process

Methods for growing low-resistivity tungsten for high aspect ratio...

Reducing silicon attack and improving resistivity of tungsten nitri...

Patents Applicationslast 30 patents

LOW RESISTIVITY FILMS CONTAINING MOLYBDENUM

DEPOSITION OF METAL FILMS

SELF-LIMITING GROWTH

MOLYBDENUM FILL

DEPOSITION OF METAL FILMS

METHOD FOR PREVENTING LINE BENDING DURING METAL FILL PROCESS

LOW RESISTIVITY FILMS CONTAINING MOLYBDENUM

VAPOR ACCUMULATOR FOR CORROSIVE GASES WITH PURGING

DEPOSITION OF METAL FILMS

METHOD OF DEPOSITING TUNGSTEN AND OTHER METALS IN 3D NAND STRUCTURES

SELF-LIMITING GROWTH

LOW RESISTIVITY FILMS CONTAINING MOLYBDENUM

METHOD FOR PREVENTING LINE BENDING DURING METAL FILL PROCESS

LOW RESISTIVITY FILMS CONTAINING MOLYBDENUM

ATOMIC LAYER DEPOSITION OF TUNGSTEN FOR ENHANCED FILL AND REDUCED S...

LOW RESISTIVITY FILMS CONTAINING MOLYBDENUM

FORMING LOW RESISTIVITY FLUORINE FREE TUNGSTEN FILM WITHOUT NUCLEATION

METHOD FOR PREVENTING LINE BENDING DURING METAL FILL PROCESS

ATOMIC LAYER DEPOSITION OF TUNGSTEN FOR ENHANCED FILL AND REDUCED S...

VAPOR MANIFOLD WITH INTEGRATED VAPOR CONCENTRATION SENSOR

VAPOR DELIVERY METHOD AND APPARATUS FOR SOLID AND LIQUID PRECURSORS

METHOD OF FORMING LOW RESISTIVITY FLUORINE FREE TUNGSTEN FILM WITHO...

DIRECTIONAL SIO2 ETCH USING PLASMA PRE-TREATMENT AND HIGH-TEMPERATU...

METHODS OF FILLING HIGH ASPECT RATIO FEATURES WITH FLUORINE FREE TU...

METHODS OF PREPARING TUNGSTEN AND TUNGSTEN NITRIDE THIN FILMS USING...

METHOD FOR PRODUCING ULTRA-THIN TUNGSTEN LAYERS WITH IMPROVED STEP...

BORON IONIZATION FOR ALUMINUM OXIDE ETCH ENHANCEMENT

DIRECTIONAL SIO2 ETCH USING PLASMA PRE-TREATMENT AND HIGH-TEMPERATU...

DIRECTIONAL SIO2 ETCH USING LOW-TEMPERATURE ETCHANT DEPOSITION AND...

TUNGSTEN DEPOSITION SEQUENCE