Joshua FREIER

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Portland, OR, US

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Patents Applicationslast 30 patents

Information Patent Application
DOUBLE-SIDED INTEGRATED CIRCUIT PACKAGE APPARATUS AND RELATED METHODS
- Publication number 20250208204
- Publication date Jun 26, 2025
- Intel Corporation
- Joshua Dean Freier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND SYSTEM FOR A VACUUM COMPATIBLE ELECTRICAL INTERFACE, ENA...
- Publication number 20240219452
- Publication date Jul 4, 2024
- Intel Corporation
- Prasoon JOSHI
- G01 - MEASURING TESTING
Information Patent Application
COUPLING A THERMALLY CONDUCTIVE PLATE TO A SEMICONDUCTOR DEVICE FOR...
- Publication number 20240103073
- Publication date Mar 28, 2024
- Intel Corporation
- Patrick PARDY
- H01 - BASIC ELECTRIC ELEMENTS