Joshua Tseng

Person

Linkou Township, TW

People

Patents Grantslast 30 patents

Information Patent Grant
High-K dielectric metal gate device structure
- Patent number 7,829,949
- Issue date Nov 9, 2010
- Taiwan Semconductor Manufacturing Co., Ltd
- Joshua Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-k dielectric metal gate device structure and method for formin...
- Patent number 7,625,791
- Issue date Dec 1, 2009
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Joshua Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to implement stress free polishing
- Patent number 7,544,606
- Issue date Jun 9, 2009
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jean Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for improving low-K dielectrics by supercritical fluid treat...
- Patent number 7,387,973
- Issue date Jun 17, 2008
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ching-Ya Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming dual damascenes with supercritical fluid treatments
- Patent number 7,332,449
- Issue date Feb 19, 2008
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ching-Ya Wang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
High-K dielectric metal gate device structure
- Publication number 20100044800
- Publication date Feb 25, 2010
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Joshua Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-K DIELECTRIC METAL GATE DEVICE STRUCTURE AND METHOD FOR FORMIN...
- Publication number 20090108365
- Publication date Apr 30, 2009
- Taiwan Semiconductor Manufacturing Co., LTD
- Joshua Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for forming dual damascenes with supercritical fluid treatments
- Publication number 20070241455
- Publication date Oct 18, 2007
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ching-Ya Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Novel method to implement stress free polishing
- Publication number 20060276030
- Publication date Dec 7, 2006
- Jean Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for improving low-K dielectrics by supercritical fluid treat...
- Publication number 20060073697
- Publication date Apr 6, 2006
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ching-Ya Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIB exposure of alignment marks in MIM technology
- Publication number 20050186753
- Publication date Aug 25, 2005
- Ping-Hsu Chen
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
Method of integrating post-etching cleaning process with deposition...
- Publication number 20050158664
- Publication date Jul 21, 2005
- Joshua Tseng
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY

Joshua Tseng

Person

Patents Grantslast 30 patents

High-K dielectric metal gate device structure

High-k dielectric metal gate device structure and method for formin...

Method to implement stress free polishing

Method for improving low-K dielectrics by supercritical fluid treat...

Method for forming dual damascenes with supercritical fluid treatments

Patents Applicationslast 30 patents

High-K dielectric metal gate device structure

HIGH-K DIELECTRIC METAL GATE DEVICE STRUCTURE AND METHOD FOR FORMIN...

Method for forming dual damascenes with supercritical fluid treatments

Novel method to implement stress free polishing

Method for improving low-K dielectrics by supercritical fluid treat...

FIB exposure of alignment marks in MIM technology

Method of integrating post-etching cleaning process with deposition...