JoungIn Yang

Person

Koyang-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method of controlling warpage in semicondu...
- Patent number 9,406,579
- Issue date Aug 2, 2016
- STATS ChipPAC Pte. Ltd.
- DaeSik Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of backgrinding and singulation of...
- Patent number 9,401,289
- Issue date Jul 26, 2016
- STATS ChipPAC Pte. Ltd.
- MinJung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of depositing underfill material wi...
- Patent number 9,390,945
- Issue date Jul 12, 2016
- STATS ChipPAC Pte. Ltd.
- KyungHoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming thermal interface materi...
- Patent number 9,281,228
- Issue date Mar 8, 2016
- STATS ChipPAC, Ltd.
- DaeSik Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stackable package by using internal stacking modules
- Patent number 9,245,772
- Issue date Jan 26, 2016
- STATS ChipPAC, Ltd.
- JoungIn Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with heatsink cap and method of...
- Patent number 9,142,481
- Issue date Sep 22, 2015
- Stats Chippac Ltd.
- Gwangjin Kim
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Integrated circuit packaging system with heat slug and method of ma...
- Patent number 8,710,640
- Issue date Apr 29, 2014
- Stats Chippac Ltd.
- DaeSik Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package system with through vias and method of manufactu...
- Patent number 8,598,034
- Issue date Dec 3, 2013
- Stats Chippac Ltd.
- DongSam Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with embedded interconnect and...
- Patent number 8,476,775
- Issue date Jul 2, 2013
- Stats Chippac Ltd.
- JoungIn Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package system with interposer
- Patent number 8,035,210
- Issue date Oct 11, 2011
- Stats Chippac Ltd.
- Joungin Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package system with through vias and method of manufactu...
- Patent number 7,986,048
- Issue date Jul 26, 2011
- Stats Chippac Ltd.
- DongSam Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package system with internal stacking module interposer
- Patent number 7,901,987
- Issue date Mar 8, 2011
- Stats Chippac Ltd.
- Joungin Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package system with stacking module
- Patent number 7,804,166
- Issue date Sep 28, 2010
- Stats Chippac Ltd.
- Joungin Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stackable package by using internal stacking modules
- Patent number 7,800,211
- Issue date Sep 21, 2010
- STATS ChipPAC, Ltd.
- JoungIn Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked integrated circuit package-in-package system
- Patent number 7,482,203
- Issue date Jan 27, 2009
- Stats Chippac Ltd.
- Sungmin Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked integrated circuit package-in-package system
- Patent number 7,312,519
- Issue date Dec 25, 2007
- Stats Chippac Ltd.
- Sungmin Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked integrated circuit package-in-package system with recessed...
- Patent number 7,298,037
- Issue date Nov 20, 2007
- Stats Chippac Ltd.
- Choong Bin Yim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Stackable Package by Using Internal Stacking Modules
- Publication number 20140319702
- Publication date Oct 30, 2014
- JoungIn Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH WARPAGE PREVENTION MECHANI...
- Publication number 20130334714
- Publication date Dec 19, 2013
- YiSu Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH FILM ASSIST AND METHOD OF...
- Publication number 20130328220
- Publication date Dec 12, 2013
- KyungHoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Backgrinding and Singulation of...
- Publication number 20130320519
- Publication date Dec 5, 2013
- STATS ChipPAC, Ltd.
- MinJung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH HEATSINK CAP AND METHOD OF...
- Publication number 20130322023
- Publication date Dec 5, 2013
- Gwangjin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Controlling Warpage in Semicondu...
- Publication number 20130300004
- Publication date Nov 14, 2013
- STATS ChipPAC, Ltd.
- DaeSik Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Depositing Underfill Material Wi...
- Publication number 20130299995
- Publication date Nov 14, 2013
- STATS ChipPAC, Ltd.
- KyungHoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH HEAT SLUG AND METHOD OF MA...
- Publication number 20130154078
- Publication date Jun 20, 2013
- DaeSik Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Sloped Surface in Patter...
- Publication number 20130113118
- Publication date May 9, 2013
- STATS ChipPAC, Ltd.
- MinJung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Thermal Interface Materi...
- Publication number 20130105963
- Publication date May 2, 2013
- STATS ChipPAC, Ltd.
- DaeSik Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE SYSTEM WITH THROUGH VIAS AND METHOD OF MANUFACTU...
- Publication number 20130075933
- Publication date Mar 28, 2013
- DongSam Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE SYSTEM WITH THROUGH VIAS AND METHOD OF MANUFACTU...
- Publication number 20110254172
- Publication date Oct 20, 2011
- DongSam Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH EMBEDDED INTERCONNECT AND...
- Publication number 20110147906
- Publication date Jun 23, 2011
- JoungIn Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stackable Package By Using Internal Stacking Modules
- Publication number 20110024890
- Publication date Feb 3, 2011
- STATS ChipPAC, Ltd.
- JoungIn YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH LAYERED PACKAGING AND METH...
- Publication number 20100237482
- Publication date Sep 23, 2010
- JoungIn Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE SYSTEM WITH THROUGH VIAS AND METHOD OF MANUFACTU...
- Publication number 20100207262
- Publication date Aug 19, 2010
- DongSam Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH STACKING MODULE
- Publication number 20090236754
- Publication date Sep 24, 2009
- Joungin Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE SYSTEM WITH INTERNAL STACKING MODULE INTERPOSER
- Publication number 20090236718
- Publication date Sep 24, 2009
- Joungin Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH INTERPOSER
- Publication number 20090166835
- Publication date Jul 2, 2009
- Joungin Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stackable Package by Using Internal Stacking Modules
- Publication number 20090001540
- Publication date Jan 1, 2009
- STATS ChipPAC, Ltd.
- JoungIn YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked integrated circuit package-in-package system
- Publication number 20080105965
- Publication date May 8, 2008
- STATS ChipPAC Ltd.
- Sungmin Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked integrated circuit package-in-package system
- Publication number 20070158810
- Publication date Jul 12, 2007
- STATS ChipPAC Ltd.
- Sungmin Song
- H01 - BASIC ELECTRIC ELEMENTS

JoungIn Yang

Person

Patents Grantslast 30 patents

Semiconductor device and method of controlling warpage in semicondu...

Semiconductor device and method of backgrinding and singulation of...

Semiconductor device and method of depositing underfill material wi...

Semiconductor device and method of forming thermal interface materi...

Stackable package by using internal stacking modules

Integrated circuit packaging system with heatsink cap and method of...

Integrated circuit packaging system with heat slug and method of ma...

Package-on-package system with through vias and method of manufactu...

Integrated circuit packaging system with embedded interconnect and...

Integrated circuit package system with interposer

Package-on-package system with through vias and method of manufactu...

Package-on-package system with internal stacking module interposer

Integrated circuit package system with stacking module

Stackable package by using internal stacking modules

Stacked integrated circuit package-in-package system

Stacked integrated circuit package-in-package system

Stacked integrated circuit package-in-package system with recessed...

Patents Applicationslast 30 patents

Stackable Package by Using Internal Stacking Modules

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH WARPAGE PREVENTION MECHANI...

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH FILM ASSIST AND METHOD OF...

Semiconductor Device and Method of Backgrinding and Singulation of...

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH HEATSINK CAP AND METHOD OF...

Semiconductor Device and Method of Controlling Warpage in Semicondu...

Semiconductor Device and Method of Depositing Underfill Material Wi...

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH HEAT SLUG AND METHOD OF MA...

Semiconductor Device and Method of Forming Sloped Surface in Patter...

Semiconductor Device and Method of Forming Thermal Interface Materi...

PACKAGE-ON-PACKAGE SYSTEM WITH THROUGH VIAS AND METHOD OF MANUFACTU...

PACKAGE-ON-PACKAGE SYSTEM WITH THROUGH VIAS AND METHOD OF MANUFACTU...

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH EMBEDDED INTERCONNECT AND...

Stackable Package By Using Internal Stacking Modules

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH LAYERED PACKAGING AND METH...

PACKAGE-ON-PACKAGE SYSTEM WITH THROUGH VIAS AND METHOD OF MANUFACTU...

INTEGRATED CIRCUIT PACKAGE SYSTEM WITH STACKING MODULE

PACKAGE-ON-PACKAGE SYSTEM WITH INTERNAL STACKING MODULE INTERPOSER

INTEGRATED CIRCUIT PACKAGE SYSTEM WITH INTERPOSER

Stackable Package by Using Internal Stacking Modules

Stacked integrated circuit package-in-package system

Stacked integrated circuit package-in-package system