Joungln Yang

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Koyang-si, KR

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Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit packaging system having warpage prevention struc...
- Patent number 8,723,310
- Issue date May 13, 2014
- Stats Chippac Ltd.
- YiSu Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package system with through vias and method of manufactu...
- Patent number 8,334,601
- Issue date Dec 18, 2012
- Stats Chippac Ltd.
- DongSam Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with layered packaging and meth...
- Patent number 7,863,100
- Issue date Jan 4, 2011
- Stats Chippac Ltd.
- Joungln Yang
- H01 - BASIC ELECTRIC ELEMENTS