Joungphil LEE

Person

Suwon-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Thermal conductive film
- Patent number 12,183,653
- Issue date Dec 31, 2024
- Samsung Electronics Co., Ltd.
- Joungphil Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-conductive film sheet and semiconductor package including the same
- Patent number 12,062,633
- Issue date Aug 13, 2024
- Samsung Electronics Co., Ltd.
- Joungphil Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal interface material paste and semiconductor package
- Patent number 11,876,031
- Issue date Jan 16, 2024
- Samsung Electronics Co., Ltd.
- Joungphil Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive film, semiconductor apparatus using the same, and semicond...
- Patent number 11,355,413
- Issue date Jun 7, 2022
- Samsung Electronics Co., Ltd.
- Joungphil Lee
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Semiconductor package and semiconductor module
- Patent number 10,553,546
- Issue date Feb 4, 2020
- Samsung Electronics Co., Ltd.
- Joungphil Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and semiconductor module
- Patent number 10,433,469
- Issue date Oct 1, 2019
- Samsung Electronics Co., Ltd.
- Joungphil Lee
- B32 - LAYERED PRODUCTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230187303
- Publication date Jun 15, 2023
- Samsung Electronics Co., Ltd.
- JOUNGPHIL LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL CONDUCTIVE FILM
- Publication number 20220246491
- Publication date Aug 4, 2022
- Samsung Electronics Co., Ltd.
- Joungphil LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NON-CONDUCTIVE FILM SHEET AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20220189902
- Publication date Jun 16, 2022
- Samsung Electronics Co., Ltd.
- Joungphil Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL INTERFACE MATERIAL PASTE AND SEMICONDUCTOR PACKAGE
- Publication number 20220020664
- Publication date Jan 20, 2022
- Samsung Electronics Co., Ltd.
- Joungphil LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE FILM, SEMICONDUCTOR APPARATUS USING THE SAME, AND SEMICOND...
- Publication number 20200211920
- Publication date Jul 2, 2020
- Samsung Electronics Co., Ltd.
- Joungphil LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR MODULE
- Publication number 20190281736
- Publication date Sep 12, 2019
- Samsung Electronics Co., Ltd.
- Joungphil LEE
- B32 - LAYERED PRODUCTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR MODULE
- Publication number 20190198450
- Publication date Jun 27, 2019
- Samsung Electronics Co., Ltd.
- Joungphil LEE
- H01 - BASIC ELECTRIC ELEMENTS

Joungphil LEE

Person

Patents Grantslast 30 patents

Thermal conductive film

Non-conductive film sheet and semiconductor package including the same

Thermal interface material paste and semiconductor package

Adhesive film, semiconductor apparatus using the same, and semicond...

Semiconductor package and semiconductor module

Semiconductor package and semiconductor module

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE

THERMAL CONDUCTIVE FILM

NON-CONDUCTIVE FILM SHEET AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

THERMAL INTERFACE MATERIAL PASTE AND SEMICONDUCTOR PACKAGE

ADHESIVE FILM, SEMICONDUCTOR APPARATUS USING THE SAME, AND SEMICOND...

SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR MODULE

SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR MODULE