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JoungUn Park
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Icheon-si, KR
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Patents Grants
last 30 patents
Information
Patent Grant
Semiconductor device and method of forming shielding layer grounded...
Patent number
9,123,663
Issue date
Sep 1, 2015
STATS ChipPAC, Ltd.
OhHan Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Double-sided semiconductor device and method of forming top-side an...
Patent number
8,137,995
Issue date
Mar 20, 2012
STATS ChipPAC, Ltd.
OhHan Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit package system with support structure under wire...
Patent number
8,035,211
Issue date
Oct 11, 2011
Stats Chippac Ltd.
WonJun Ko
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
Double-Sided Semiconductor Device and Method of Forming Top-Side an...
Publication number
20120153452
Publication date
Jun 21, 2012
STATS ChipPAC, Ltd.
OhHan Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Double-Sided Semiconductor Device and Method of Forming Top-Side an...
Publication number
20100148353
Publication date
Jun 17, 2010
STATS ChipPAC, Ltd.
OhHan Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Forming Shielding Layer Grounded...
Publication number
20090302436
Publication date
Dec 10, 2009
STATS ChipPAC, Ltd.
OhHan Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH SUPPORT STRUCTURE UNDER WIRE...
Publication number
20090243070
Publication date
Oct 1, 2009
WonJun Ko
H01 - BASIC ELECTRIC ELEMENTS