Jovica Savic

Person

Downer's Grove, IL, US

People

Patents Grantslast 30 patents

Information Patent Grant
Heat dissipation in hermetically-sealed packaged devices
- Patent number 10,260,782
- Issue date Apr 16, 2019
- Cisco Technology, Inc.
- Jovica Savic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat dissipation in hermetically-sealed packaged devices
- Patent number 9,688,453
- Issue date Jun 27, 2017
- Cisco Technology, Inc.
- Jovica Savic
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Semiconductor package including an embedded circuit component withi...
- Patent number 9,414,497
- Issue date Aug 9, 2016
- Cisco Technology, Inc.
- Jovica Savic
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing a semiconductor package including an embedded circuit...
- Patent number 9,129,908
- Issue date Sep 8, 2015
- Cisco Technology, Inc.
- Jovica Savic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a capacitor having a copper electrode and a high...
- Patent number 7,605,048
- Issue date Oct 20, 2009
- Kemet Electronics Corporation
- Gregory J. Dunn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Tunable high impedance surface device
- Patent number 7,518,465
- Issue date Apr 14, 2009
- Motorola, Inc.
- Jovica Savic
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and methods relating to electrically conductive path inte...
- Patent number 7,463,113
- Issue date Dec 9, 2008
- Motorla, Inc.
- Aroon Tungare
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a printed circuit board
- Patent number 7,451,540
- Issue date Nov 18, 2008
- Motorola, Inc.
- Jaroslaw A. Magera
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for forming multi-layer embedded capacitors on a printed cir...
- Patent number 7,444,727
- Issue date Nov 4, 2008
- Motorola, Inc.
- Jovica Savic
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Capacitance laminate and printed circuit board apparatus and method
- Patent number 7,361,847
- Issue date Apr 22, 2008
- Motorola, Inc.
- Gregory J. Dunn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Textured dielectric patch antenna fabrication method
- Patent number 7,337,528
- Issue date Mar 4, 2008
- Motorola, Inc.
- Gregory J. Dunn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Meso-microelectromechanical system having a glass beam and method f...
- Patent number 7,217,369
- Issue date May 15, 2007
- Motorola, Inc.
- Jovica Savic
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Printed circuit dielectric foil and embedded capacitors
- Patent number 7,193,838
- Issue date Mar 20, 2007
- Motorola, Inc.
- Gregory J. Dunn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit patterned embedded capacitance layer
- Patent number 7,138,068
- Issue date Nov 21, 2006
- Motorola, Inc.
- Gregory J. Dunn
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Two-layer patterned resistor
- Patent number 7,105,913
- Issue date Sep 12, 2006
- Motorola, Inc.
- Gregory J. Dunn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric sheet, method for fabricating the dielectric sheet, prin...
- Patent number 7,079,373
- Issue date Jul 18, 2006
- Motorola, Inc.
- Gregory J. Dunn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit embedded capacitors
- Patent number 7,056,800
- Issue date Jun 6, 2006
- Motorola, Inc.
- Robert T. Croswell
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Polymer thick film resistor, layout cell, and method
- Patent number 7,038,571
- Issue date May 2, 2006
- Motorola, Inc.
- Gregory J. Dunn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-layer conductor-dielectric oxide structure
- Patent number 6,841,080
- Issue date Jan 11, 2005
- Motorola, Inc.
- Angus Kingon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-layer conductor-dielectric oxide structure
- Patent number 6,541,137
- Issue date Apr 1, 2003
- Motorola, Inc.
- Angus Kingon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing photodefined integral capacitor with self-a...
- Patent number 6,349,456
- Issue date Feb 26, 2002
- Motorola, Inc.
- Gregory J. Dunn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing an integral thin-film metal resistor
- Patent number 6,232,042
- Issue date May 15, 2001
- Motorola, Inc.
- Gregory J. Dunn
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Circuit board features with reduced parasitic capacitance and metho...
- Patent number 6,103,134
- Issue date Aug 15, 2000
- Motorola, Inc.
- Gregory J. Dunn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and reduction solution for metallizing a surface
- Patent number 5,545,430
- Issue date Aug 13, 1996
- Motorola, Inc.
- Yaroslaw A. Magera
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
HEAT DISSIPATION IN HERMETICALLY-SEALED PACKAGED DEVICES
- Publication number 20170234584
- Publication date Aug 17, 2017
- Cisco Technology, Inc.
- Jovica Savic
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
Heat Dissipation in Hermetically-Sealed Packaged Devices
- Publication number 20160229618
- Publication date Aug 11, 2016
- Cisco Technology, Inc.
- Jovica Savic
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
COUPLING OF AN INTERPOSER TO A PACKAGE SUBSTRATE
- Publication number 20160064320
- Publication date Mar 3, 2016
- Cisco Technology, Inc.
- Li Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Manufacturing a Semiconductor Package Including an Embedded Circuit...
- Publication number 20150342053
- Publication date Nov 26, 2015
- Cisco Technology, Inc.
- Jovica Savic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING A SEMICONDUCTOR PACKAGE INCLUDING AN EMBEDDED CIRCUIT...
- Publication number 20130122658
- Publication date May 16, 2013
- Cisco Technology, Inc.
- Jovica Savic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING AN EXTERNAL CIRCUIT ELEMENT
- Publication number 20130015557
- Publication date Jan 17, 2013
- Zhiping Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING A CAPACITOR HAVING A COPPER ELECTRODE AND A HIGH...
- Publication number 20080244885
- Publication date Oct 9, 2008
- MOTOROLA, INC.
- Gregory J. Dunn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TUNABLE HIGH IMPEDANCE SURFACE DEVICE
- Publication number 20080150657
- Publication date Jun 26, 2008
- MOTOROLA, INC.
- Jovica Savic
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR FABRICATING A PRINTED CIRCUIT BOARD
- Publication number 20080092376
- Publication date Apr 24, 2008
- MOTOROLA, INC.
- Jaroslaw A. Magera
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS AND METHODS RELATING TO ELECTRICALLY CONDUCTIVE PATH INTE...
- Publication number 20080013251
- Publication date Jan 17, 2008
- MOTOROLA, INC.
- Aroon V. Tungare
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING EMBEDDED CAPACITORS ON A PRINTED CURCUIT BOARD A...
- Publication number 20070209178
- Publication date Sep 13, 2007
- MOTOROLA, INC.
- Jovica Savic
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Capacitance laminate and printed circuit board apparatus and method
- Publication number 20070151758
- Publication date Jul 5, 2007
- Gregory J. Dunn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MESO-MICROELECTROMECHANICAL SYSTEM HAVING A GLASS BEAM AND METHOD F...
- Publication number 20060226732
- Publication date Oct 12, 2006
- Jovica Savic
- G02 - OPTICS
Information Patent Application
Printed circuit patterned embedded capacitance layer
- Publication number 20060207970
- Publication date Sep 21, 2006
- Gregory J. Dunn
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Textured dielectric and patch antenna fabrication method
- Publication number 20060137173
- Publication date Jun 29, 2006
- Gregory J. Dunn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dielectric sheet, method for fabricating the dielectric sheet, prin...
- Publication number 20050242997
- Publication date Nov 3, 2005
- Gregory J. Dunn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Meso-microelectromechanical system having a glass beam and method f...
- Publication number 20050134141
- Publication date Jun 23, 2005
- Jovica Savic
- G02 - OPTICS
Information Patent Application
Two-layer patterned resistor
- Publication number 20050133872
- Publication date Jun 23, 2005
- Gregory J. Dunn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Printed circuit dielectric foil and embedded capacitors
- Publication number 20050135074
- Publication date Jun 23, 2005
- Gregory J. Dunn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed circuit embedded capacitors
- Publication number 20050128720
- Publication date Jun 16, 2005
- Robert T. Croswell
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Polymer thick film resistor, layout cell, and method
- Publication number 20040239474
- Publication date Dec 2, 2004
- Gregory J. Dunn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for forming ceramic film capacitors
- Publication number 20040126484
- Publication date Jul 1, 2004
- Robert Croswell
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Multi-layer conductor-dielectric oxide structure
- Publication number 20030113443
- Publication date Jun 19, 2003
- MOTOROLA, INC.
- Augus Kingon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of manufacture of integral low and high value resistors on a...
- Publication number 20020013997
- Publication date Feb 7, 2002
- Gregory J. Dunn
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Jovica Savic

Person

Patents Grantslast 30 patents

Heat dissipation in hermetically-sealed packaged devices

Heat dissipation in hermetically-sealed packaged devices

Semiconductor package including an embedded circuit component withi...

Manufacturing a semiconductor package including an embedded circuit...

Method for forming a capacitor having a copper electrode and a high...

Tunable high impedance surface device

Apparatus and methods relating to electrically conductive path inte...

Method for fabricating a printed circuit board

Method for forming multi-layer embedded capacitors on a printed cir...

Capacitance laminate and printed circuit board apparatus and method

Textured dielectric patch antenna fabrication method

Meso-microelectromechanical system having a glass beam and method f...

Printed circuit dielectric foil and embedded capacitors

Printed circuit patterned embedded capacitance layer

Two-layer patterned resistor

Dielectric sheet, method for fabricating the dielectric sheet, prin...

Printed circuit embedded capacitors

Polymer thick film resistor, layout cell, and method

Multi-layer conductor-dielectric oxide structure

Multi-layer conductor-dielectric oxide structure

Method of manufacturing photodefined integral capacitor with self-a...

Method for manufacturing an integral thin-film metal resistor

Circuit board features with reduced parasitic capacitance and metho...

Method and reduction solution for metallizing a surface

Patents Applicationslast 30 patents

HEAT DISSIPATION IN HERMETICALLY-SEALED PACKAGED DEVICES

Heat Dissipation in Hermetically-Sealed Packaged Devices

COUPLING OF AN INTERPOSER TO A PACKAGE SUBSTRATE

Manufacturing a Semiconductor Package Including an Embedded Circuit...

MANUFACTURING A SEMICONDUCTOR PACKAGE INCLUDING AN EMBEDDED CIRCUIT...

SEMICONDUCTOR PACKAGE INCLUDING AN EXTERNAL CIRCUIT ELEMENT

METHOD FOR FORMING A CAPACITOR HAVING A COPPER ELECTRODE AND A HIGH...

TUNABLE HIGH IMPEDANCE SURFACE DEVICE

METHOD FOR FABRICATING A PRINTED CIRCUIT BOARD

APPARATUS AND METHODS RELATING TO ELECTRICALLY CONDUCTIVE PATH INTE...

METHOD FOR FORMING EMBEDDED CAPACITORS ON A PRINTED CURCUIT BOARD A...

Capacitance laminate and printed circuit board apparatus and method

MESO-MICROELECTROMECHANICAL SYSTEM HAVING A GLASS BEAM AND METHOD F...

Printed circuit patterned embedded capacitance layer

Textured dielectric and patch antenna fabrication method

Dielectric sheet, method for fabricating the dielectric sheet, prin...

Meso-microelectromechanical system having a glass beam and method f...

Two-layer patterned resistor

Printed circuit dielectric foil and embedded capacitors

Printed circuit embedded capacitors

Polymer thick film resistor, layout cell, and method

Method for forming ceramic film capacitors

Multi-layer conductor-dielectric oxide structure

Method of manufacture of integral low and high value resistors on a...