Joyce J.M. Peternel

Person

Morgan Hill, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Reinforced removable pluggable module pull tabs
- Patent number 11,964,855
- Issue date Apr 23, 2024
- Cisco Technology, Inc.
- Li Li
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Socket locator
- Patent number 11,831,093
- Issue date Nov 28, 2023
- Cisco Technology, Inc.
- Matthew J. Traverso
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal packaging with fan out wafer level processing
- Patent number 11,756,861
- Issue date Sep 12, 2023
- Cisco Technology, Inc.
- Ashley J. M. Erickson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Removable pluggable module pull tabs
- Patent number 11,390,509
- Issue date Jul 19, 2022
- Cisco Technology, Inc.
- Joyce Peternel
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Thermal packaging with fan out wafer level processing
- Patent number 11,373,930
- Issue date Jun 28, 2022
- Cisco Technology, Inc.
- Ashley J. M. Erickson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reinforced removable pluggable module pull tabs
- Patent number 11,242,234
- Issue date Feb 8, 2022
- Cisco Technology, Inc.
- Li Li
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Connection features for electronic and optical packaging
- Patent number 11,215,775
- Issue date Jan 4, 2022
- Cisco Technology, Inc.
- Ashley J. Maker
- G02 - OPTICS
Information Patent Grant
Electromagnetic isolating ball spring
- Patent number 9,256,039
- Issue date Feb 9, 2016
- Cisco Technology, Inc.
- Joyce J. M. Peternel
- G02 - OPTICS

Patents Applicationslast 30 patents

Information Patent Application
SOCKET LOCATOR
- Publication number 20220320765
- Publication date Oct 6, 2022
- Cisco Technology, Inc.
- Matthew J. TRAVERSO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL PACKAGING WITH FAN OUT WAFER LEVEL PROCESSING
- Publication number 20220278022
- Publication date Sep 1, 2022
- Cisco Technology, Inc.
- Ashley J.M. ERICKSON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REINFORCED REMOVABLE PLUGGABLE MODULE PULL TABS
- Publication number 20220055879
- Publication date Feb 24, 2022
- Cisco Technology, Inc.
- Li Li
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
THERMAL PACKAGING WITH FAN OUT WAFER LEVEL PROCESSING
- Publication number 20210305128
- Publication date Sep 30, 2021
- Cisco Technology, Inc.
- Ashley J.M. ERICKSON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REMOVABLE PLUGGABLE MODULE PULL TABS
- Publication number 20210206612
- Publication date Jul 8, 2021
- Cisco Technology, Inc.
- Joyce Peternel
- B66 - HOISTING LIFTING HAULING
Information Patent Application
REINFORCED REMOVABLE PLUGGABLE MODULE PULL TABS
- Publication number 20210210902
- Publication date Jul 8, 2021
- Cisco Technology, Inc.
- Li Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTION FEATURES FOR ELECTRONIC AND OPTICAL PACKAGING
- Publication number 20210055489
- Publication date Feb 25, 2021
- Cisco Technology, Inc.
- Ashley J. MAKER
- G02 - OPTICS
Information Patent Application
COUPLING OPTICAL FIBER ARRAY WITH WAVEGUIDES OF PHOTONIC SUBASSEMBLY
- Publication number 20180003906
- Publication date Jan 4, 2018
- Cisco Technology, Inc.
- Ravinder KACHRU
- G02 - OPTICS
Information Patent Application
Electromagnetic Isolating Ball Spring
- Publication number 20140193121
- Publication date Jul 10, 2014
- Cisco Technology, Inc.
- Joyce J.M. Peternel
- G02 - OPTICS

Joyce J.M. Peternel

Person

Patents Grantslast 30 patents

Reinforced removable pluggable module pull tabs

Socket locator

Thermal packaging with fan out wafer level processing

Removable pluggable module pull tabs

Thermal packaging with fan out wafer level processing

Reinforced removable pluggable module pull tabs

Connection features for electronic and optical packaging

Electromagnetic isolating ball spring

Patents Applicationslast 30 patents

SOCKET LOCATOR

THERMAL PACKAGING WITH FAN OUT WAFER LEVEL PROCESSING

REINFORCED REMOVABLE PLUGGABLE MODULE PULL TABS

THERMAL PACKAGING WITH FAN OUT WAFER LEVEL PROCESSING

REMOVABLE PLUGGABLE MODULE PULL TABS

REINFORCED REMOVABLE PLUGGABLE MODULE PULL TABS

CONNECTION FEATURES FOR ELECTRONIC AND OPTICAL PACKAGING

COUPLING OPTICAL FIBER ARRAY WITH WAVEGUIDES OF PHOTONIC SUBASSEMBLY

Electromagnetic Isolating Ball Spring