Jürgen HÖGERL

Person

Regensburg, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Electronic module and method of manufacturing the same
- Patent number 9,847,274
- Issue date Dec 19, 2017
- Infineon Technologies AG
- Frank Winter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component with electronic chip between redistribution st...
- Patent number 9,385,111
- Issue date Jul 5, 2016
- Infineon Technologies Austria AG
- Manfred Mengel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Placement system for populating a substrate with electronic components
- Patent number 7,500,305
- Issue date Mar 10, 2009
- Qimonda AG
- Jürgen Högerl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for populating a substrate with electronic components
- Patent number 7,069,647
- Issue date Jul 4, 2006
- Infineon Technologies AG
- Jürgen Högerl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a semiconductor wafer, semiconductor chip, and...
- Patent number 6,960,829
- Issue date Nov 1, 2005
- Infineon Technologies AG
- Jürgen Högerl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component with a semiconductor chip and method for produ...
- Patent number 6,851,598
- Issue date Feb 8, 2005
- Infineon Technologies AG
- Uta Gebauer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor assembly with a semiconductor module
- Patent number 6,774,483
- Issue date Aug 10, 2004
- Infineon Technologies AG
- Jürgen Högerl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Configuration of a plurality of circuit modules
- Patent number 6,737,581
- Issue date May 18, 2004
- Infineon Technologies AG
- Jürgen Högerl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Module unit for memory modules and method for its production
- Patent number 6,665,182
- Issue date Dec 16, 2003
- Infineon Technologies AG
- Jürgen Högerl
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor module having interconnected semiconductor chips disp...
- Patent number 6,646,333
- Issue date Nov 11, 2003
- Infineon Technologies AG
- Jürgen Högerl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Housing for semiconductor chips
- Patent number 6,576,995
- Issue date Jun 10, 2003
- Infineon Technologies AG
- Jürgen Högerl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module with a number of semiconductor chips and a con...
- Patent number 6,507,106
- Issue date Jan 14, 2003
- Infineon Technologies AG
- Jürgen Högerl
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Electronic module and method of manufacturing the same
- Publication number 20170092563
- Publication date Mar 30, 2017
- INFINEON TECHNOLOGIES AG
- Frank WINTER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Placement system for populating a substrate with electronic components
- Publication number 20060123624
- Publication date Jun 15, 2006
- Infineon Technologies AG
- Jurgen Hogerl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and placement system for populating a substrate with electro...
- Publication number 20040111875
- Publication date Jun 17, 2004
- Jurgen Hogerl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor assembly with a semiconductor module
- Publication number 20030193085
- Publication date Oct 16, 2003
- Jurgen Hogerl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for producing a semiconductor wafer, semiconductor chip, and...
- Publication number 20030186487
- Publication date Oct 2, 2003
- Jurgen Hogerl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic component with a semiconductor chip and method for produ...
- Publication number 20030038157
- Publication date Feb 27, 2003
- Uta Gebauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Module unit for memory modules and method for its production
- Publication number 20030012001
- Publication date Jan 16, 2003
- Jurgen Hogerl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Configuration of a plurality of circuit modules
- Publication number 20020050376
- Publication date May 2, 2002
- Jurgen Hogerl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Housing for semiconductor chips
- Publication number 20010030359
- Publication date Oct 18, 2001
- Jurgen Hogerl
- H01 - BASIC ELECTRIC ELEMENTS

Jürgen HÖGERL

Person

Patents Grantslast 30 patents

Electronic module and method of manufacturing the same

Electronic component with electronic chip between redistribution st...

Placement system for populating a substrate with electronic components

Method for populating a substrate with electronic components

Method for producing a semiconductor wafer, semiconductor chip, and...

Electronic component with a semiconductor chip and method for produ...

Semiconductor assembly with a semiconductor module

Configuration of a plurality of circuit modules

Module unit for memory modules and method for its production

Semiconductor module having interconnected semiconductor chips disp...

Housing for semiconductor chips

Semiconductor module with a number of semiconductor chips and a con...

Patents Applicationslast 30 patents

Electronic module and method of manufacturing the same

Placement system for populating a substrate with electronic components

Method and placement system for populating a substrate with electro...

Semiconductor assembly with a semiconductor module

Method for producing a semiconductor wafer, semiconductor chip, and...

Electronic component with a semiconductor chip and method for produ...

Module unit for memory modules and method for its production

Configuration of a plurality of circuit modules

Housing for semiconductor chips