Jürgen Portmann

Person

Munchen, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Electric component with sensitive component structures and method f...
- Patent number 11,245,977
- Issue date Feb 8, 2022
- Snaptrack, Inc.
- Christian Bauer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Stacked modules
- Patent number 11,239,170
- Issue date Feb 1, 2022
- Snaptrack, Inc.
- Andreas Franz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
MEMS component having a high integration density
- Patent number 10,680,159
- Issue date Jun 9, 2020
- Snaptrack, Inc.
- Thomas Metzger
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS component and method for encapsulating MEMS components
- Patent number 10,164,166
- Issue date Dec 25, 2018
- Snaptrack, Inc.
- Hans Krüger
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for producing a cased electrical component
- Patent number 10,154,582
- Issue date Dec 11, 2018
- Snaptrack, Inc.
- Wolfgang Pahl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Top-port MEMS microphone and method of manufacturing the same
- Patent number 10,136,226
- Issue date Nov 20, 2018
- TDK Corporation
- Jan Tue Ravnkilde
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS component and method for encapsulating MEMS components
- Patent number 9,853,204
- Issue date Dec 26, 2017
- Snaptrack, Inc.
- Hans Krüger
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Cased electrical component
- Patent number 9,844,128
- Issue date Dec 12, 2017
- Snaptrack, Inc.
- Wolfgang Pahl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a sensor
- Patent number 9,278,854
- Issue date Mar 8, 2016
- Epcos AG
- Wolfgang Pahl
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Encapsulation of an MEMS component and a method for producing said...
- Patent number 9,006,868
- Issue date Apr 14, 2015
- EPCOS AG
- Christian Bauer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Encapsulated electronic component and production method
- Patent number 7,388,281
- Issue date Jun 17, 2008
- EPCOS AG
- Hans Krueger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulated component which is small in terms of height and method...
- Patent number 6,982,380
- Issue date Jan 3, 2006
- EPCOS AG
- Christian Hoffmann
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MODULE AND METHOD FOR PRODUCING A PLURALITY OF MODULES
- Publication number 20190164892
- Publication date May 30, 2019
- SnapTrack, Inc.
- Andreas FRANZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMS COMPONENT AND METHOD FOR ENCAPSULATING MEMS COMPONENTS
- Publication number 20180097172
- Publication date Apr 5, 2018
- SnapTrack, Inc.
- Hans KRÜGER
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CASED ELECTRICAL COMPONENT
- Publication number 20180054886
- Publication date Feb 22, 2018
- SnapTrack, Inc.
- Wolfgang PAHL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMS COMPONENT HAVING A HIGH INTEGRATION DENSITY
- Publication number 20180013055
- Publication date Jan 11, 2018
- Thomas METZGER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIMPLE TO PRODUCE ELECTRIC COMPONENT AND METHOD FOR PRODUCING AN EL...
- Publication number 20170272855
- Publication date Sep 21, 2017
- SnapTrack, Inc.
- Christian BAUER
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
MEMS Component and Method for Encapsulating MEMS Components
- Publication number 20150325780
- Publication date Nov 12, 2015
- EPCOS AG
- Hans Krüger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Top-Port MEMS Microphone and Method of Manufacturing the Same
- Publication number 20150326979
- Publication date Nov 12, 2015
- EPCOS AG
- Jan Tue Ravnkilde
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
METHOD FOR PRODUCING A SENSOR
- Publication number 20150056725
- Publication date Feb 26, 2015
- EPCOS AG
- Wolfgang Pahl
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CASED ELECTRICAL COMPONENT
- Publication number 20140036466
- Publication date Feb 6, 2014
- EPCOS AG
- Wolfgang Pahl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENCAPSULATION OF AN MEMS COMPONENT AND A METHOD FOR PRODUCING SAID...
- Publication number 20130341773
- Publication date Dec 26, 2013
- EPCOS AG
- Christian Bauer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Encapsulated electronic component and production method
- Publication number 20060151203
- Publication date Jul 13, 2006
- Hans Krueger
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Encapsulated component which is small in terms of height and method...
- Publication number 20050034888
- Publication date Feb 17, 2005
- Christian Hoffmann
- H03 - BASIC ELECTRONIC CIRCUITRY

Jürgen Portmann

Person

Patents Grantslast 30 patents

Electric component with sensitive component structures and method f...

Stacked modules

MEMS component having a high integration density

MEMS component and method for encapsulating MEMS components

Method for producing a cased electrical component

Top-port MEMS microphone and method of manufacturing the same

MEMS component and method for encapsulating MEMS components

Cased electrical component

Method for producing a sensor

Encapsulation of an MEMS component and a method for producing said...

Encapsulated electronic component and production method

Encapsulated component which is small in terms of height and method...

Patents Applicationslast 30 patents

MODULE AND METHOD FOR PRODUCING A PLURALITY OF MODULES

MEMS COMPONENT AND METHOD FOR ENCAPSULATING MEMS COMPONENTS

CASED ELECTRICAL COMPONENT

MEMS COMPONENT HAVING A HIGH INTEGRATION DENSITY

SIMPLE TO PRODUCE ELECTRIC COMPONENT AND METHOD FOR PRODUCING AN EL...

MEMS Component and Method for Encapsulating MEMS Components

Top-Port MEMS Microphone and Method of Manufacturing the Same

METHOD FOR PRODUCING A SENSOR

CASED ELECTRICAL COMPONENT

ENCAPSULATION OF AN MEMS COMPONENT AND A METHOD FOR PRODUCING SAID...

Encapsulated electronic component and production method

Encapsulated component which is small in terms of height and method...