Jürgen Schredl

Person

Mering, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Molded semiconductor package with high voltage isolation
- Patent number 11,817,407
- Issue date Nov 14, 2023
- Infineon Technologies AG
- Shao Ping Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded semiconductor package with high voltage isolation
- Patent number 11,355,460
- Issue date Jun 7, 2022
- Infineon Technologies AG
- Shao Ping Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connection structure and electronic component
- Patent number 10,109,609
- Issue date Oct 23, 2018
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packaging arrangement
- Patent number 9,196,577
- Issue date Nov 24, 2015
- Infineon Technologies AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component, arrangement and method
- Patent number 9,196,554
- Issue date Nov 24, 2015
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with top-side insulation layer
- Patent number 9,099,391
- Issue date Aug 4, 2015
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS FOR MANUFACTURING THEREOF
- Publication number 20240030148
- Publication date Jan 25, 2024
- INFINEON TECHNOLOGIES AG
- Kok Kiat KOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED SEMICONDUCTOR PACKAGE WITH HIGH VOLTAGE ISOLATION
- Publication number 20220278060
- Publication date Sep 1, 2022
- Shao Ping Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED SEMICONDUCTOR PACKAGE WITH HIGH VOLTAGE ISOLATION
- Publication number 20220181280
- Publication date Jun 9, 2022
- Shao Ping Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Connection Structure and Electronic Component
- Publication number 20150200178
- Publication date Jul 16, 2015
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Packaging Arrangement
- Publication number 20150194373
- Publication date Jul 9, 2015
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Component, Arrangement and Method
- Publication number 20150091176
- Publication date Apr 2, 2015
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package with Top-Side Insulation Layer
- Publication number 20140264944
- Publication date Sep 18, 2014
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS

Jürgen Schredl

Person

Patents Grantslast 30 patents

Molded semiconductor package with high voltage isolation

Molded semiconductor package with high voltage isolation

Connection structure and electronic component

Semiconductor packaging arrangement

Electronic component, arrangement and method

Semiconductor package with top-side insulation layer

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICES AND METHODS FOR MANUFACTURING THEREOF

MOLDED SEMICONDUCTOR PACKAGE WITH HIGH VOLTAGE ISOLATION

MOLDED SEMICONDUCTOR PACKAGE WITH HIGH VOLTAGE ISOLATION

Connection Structure and Electronic Component

Semiconductor Packaging Arrangement

Electronic Component, Arrangement and Method

Semiconductor Package with Top-Side Insulation Layer